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Infineon Technologies CYD09S18V18-167BBXI

Part No.:
CYD09S18V18-167BBXI
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
256-LBGA
Datasheet:
AetrixCYD09S18V18-167BBXI.pdf
Description:
IC SRAM 9MBIT PAR 167MHZ 256FBGA
Quantity:
Payment:
Payment
Shipping:
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Inventory:2,414

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Product details

Overview

CYD09S18V18-167BBXI from Cypress Semiconductor is a 9-Mbit (512K × 18) synchronous true dual-port SRAM with independent 18-bit-wide ports, 1.8 V/1.5 V core supply, and SDR operation up to 167 MHz. It supports deterministic collision resolution, burst counters, mailbox messaging, and JTAG boundary scan - deployed in high-speed packet buffering, FPGA co-processing, and telecom line-card data exchange.

For engineers reviewing the CYD09S18V18-167BBXI datasheet, CYD09S18V18-167BBXI pinout, CYD09S18V18-167BBXI application, or CYD09S18V18-167BBXI equivalent, key selection criteria include dual-port latency matching, byte-enable granularity (2 BE per port), echo clock support for timing margin improvement, and 256-ball FBGA package compatibility with industrial temperature range (–40°C to +85°C).

Technical Context

This device implements pipelined or flow-through read/write modes per port, with configurable latency (1–3 cycles) and deterministic access control that outputs a busy flag and readable first-busy address upon simultaneous access to the same location. Each port features independent I/O voltage support (1.8 V LVCMOS, 2.5 V LVCMOS, or extended HSTL), variable impedance matching (VIM), and echo clocks for source-synchronous timing alignment.

The logic block includes dual 19-bit address counters with mask/retx/mirror registers, CNTINT interrupt flags, and dual mailboxes with INTR/BUSY signaling. Collision detection operates on back-to-back clock cycles, and chip enables (CE0/CE1 per port) power down internal circuitry with latency-matched bus release.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density9 Mbit (512K × 18 bits) - supports compact buffer designs requiring moderate depth and narrow bus width.
Max Clock Frequency167 MHz - enables 3.0 Gbps per port (167 MHz × 18-bit × 2 ports = 6.0 Gbps aggregate bandwidth).
Core Supply Voltage1.5 V or 1.8 V - reduces dynamic power vs. 3.3 V SRAMs; compatible with modern low-voltage SoC/FPGA I/O domains.
I/O Voltage Options1.8 V LVCMOS, 2.5 V LVCMOS, or extended HSTL - allows direct interfacing to diverse logic families without level shifters.
Byte Enables2 per port (BE0–BE1) - enables granular 9-bit writes within 18-bit word, reducing unnecessary data overwrites.
Address Bits19-bit addressing - maps directly to 512K depth; simplifies address decoding in FPGA-based controllers.
Operating Temperature–40°C to +85°C - qualified for industrial-grade embedded systems including base station equipment and motor drives.

Pinout & Package

Package: 256-ball Fine-Pitch BGA (FBGA), 15 mm × 15 mm, 1.0 mm ball pitch, RoHS-compliant. Pinout conforms to FullFlex18 family layout with dedicated left/right port signals, dual chip enables, echo clocks (CQ0L/CQ1L, CQ0R/CQ1R), and ZQ calibration balls (ZQ0L/ZQ0R) for VIM.

Pin/TerminalCircuit RoleDesign Meaning
A[18:0]L / A[18:0]RLeft/Right port address inputs19-bit address bus per port; enables full 512K × 18 access without multiplexing.
DQ[17:0]L / DQ[17:0]RLeft/Right port bidirectional data18-bit parallel data path per port; supports concurrent read/write across ports.
BE[1:0]L / BE[1:0]RLeft/Right port byte enableTwo independent enables per port - each controls 9-bit sub-word write masking.
CE0L/CE1L, CE0R/CE1RChip enable inputs (dual per port)Enables/disables port activity; both must be active for valid access; power-down control with latency-matched bus release.
R/WL / R/WRRead/write direction controlActive-high for write, active-low for read - matches standard SRAM timing conventions.
CQ0L/CQ1L, CQ0R/CQ1REcho clock outputsSource-synchronous clocks aligned to output data edges - improves setup/hold margin in high-speed PCB layouts.
ZQ0L/ZQ0RImpedance calibration referenceConnects to 240 Ω external resistor to ground - enables VIM for precise output driver impedance tuning (±15%).
MRSTAsynchronous master resetResets internal logic, counters, and mailboxes - required for deterministic startup after power-on or error recovery.

Key Features

FeatureDesign Value
Deterministic collision handlingOutputs BUSYL/BUSYR flags and provides first-busy address readback on A[18:0] lines - eliminates arbitration firmware overhead in real-time systems.
Burst counter with mirror registerAuto-increments address post-load; retransmit via mirror register enables seamless circular buffer wrap - reduces CPU intervention in streaming applications.
Mailbox with interrupt flagsSeparate INTR/BUSY signaling per port - enables lock-free inter-processor communication between FPGA and microcontroller subsystems.
Variable impedance matching (VIM)Adjusts output driver strength using ZQ0L/ZQ0R calibration - minimizes signal reflections on long traces (>10 cm) at 167 MHz.
Selectable I/O standardsPer-port configuration of 1.8 V LVCMOS, 2.5 V LVCMOS, or extended HSTL - avoids external level shifters when interfacing to mixed-voltage FPGAs.

Applications

Telecom Packet BufferingFPGA Co-Processing Interface

Use Scenario: Storing incoming/outgoing Ethernet frames in a Layer 2 switch ASIC pipeline where ingress and egress engines access shared memory concurrently.

IC Role / Device Role / Timing Role: True dual-port SRAM acting as zero-latency shared buffer with deterministic collision resolution to prevent frame loss during burst traffic.

Use Value: Eliminates need for arbitration logic or time-division multiplexing - sustains full 167 MHz throughput per port under worst-case simultaneous access.

Use Scenario: Interfacing a Xilinx Kintex FPGA with an ARM Cortex-A9 processor in a radar signal processing module requiring real-time DMA transfers.

IC Role / Device Role / Timing Role: Memory bridge enabling FPGA to write processed FFT results while ARM reads prior results - synchronized via echo clocks (CQ0L/CQ1L).

Use Value: Echo clocks tighten data valid window by 150 ps vs. system clock - allows reliable 167 MHz handshaking across 8-layer PCB with 12 cm trace length.

Industrial Motion ControllerMedical Imaging Data Pipeline

Use Scenario: Holding interpolated position commands and encoder feedback in a servo drive where motion controller (left port) and safety monitor (right port) access shared trajectory tables.

IC Role / Device Role / Timing Role: Deterministic dual-port SRAM providing atomic read-modify-write for critical motion parameters with BUSY flag signaling contention.

Use Value: First-busy address readback allows safety monitor to immediately identify conflicting writes - meets SIL-3 functional safety requirements without external watchdog.

Use Scenario: Buffering raw ultrasound A-line data between ADC front-end (left port) and DSP engine (right port) in portable imaging equipment.

IC Role / Device Role / Timing Role: Low-power 1.8 V SRAM with burst counter auto-incrementing through 512K samples - reduces CPU load during continuous acquisition.

Use Value: 2-byte BE enables allow selective update of metadata fields without disturbing adjacent pixel data - preserves image integrity during real-time annotation.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous dual-port SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CYD09S18V18-200BBXIHigher speed grade: 200 MHz max clock vs. 167 MHz; identical pinout and feature set.Supports higher bandwidth use cases (e.g., 10G MAC buffering) but requires tighter PCB layout and 1.8 V I/O compliance.Select when system timing margin permits 200 MHz operation and board layout supports reduced flight time skew.
IS61WV51218BLL-10MLIAsynchronous interface, no echo clocks or burst counters; 10 ns access time; 3.3 V only.Suitable for simpler control-plane buffers where deterministic collision handling is not required.Choose for cost-sensitive, non-real-time applications where FPGA logic resources are constrained and no mailbox/interrupt features needed.

Compared with CYD09S18V18-200BBXI, the -167BBXI trades 33 MHz bandwidth for relaxed timing closure and lower power; versus IS61WV51218BLL-10MLI, it adds deterministic arbitration, echo clocks, and mailbox messaging at the cost of higher complexity and 1.8 V dependency.

Availability

CYD09S18V18-167BBXI is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motion control, medical imaging, and FPGA-accelerated embedded systems requiring stable component supply across multi-year production cycles.

Supply support for CYD09S18V18-167BBXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for embedded systems, emphasizing reliability, low power, and integration.

The FullFlex™ SDR Dual-Port SRAM product line targets applications demanding concurrent, deterministic memory access - especially in FPGA-based accelerators, network processors, and real-time industrial controllers where arbitration latency is unacceptable.

FAQ

What is the minimum supported core voltage for CYD09S18V18-167BBXI?

The device operates at either 1.5 V ± 0.1 V or 1.8 V ± 0.1 V core supply - no operation is guaranteed below 1.4 V or above 1.9 V. Both voltages are fully supported across the industrial temperature range, with timing specifications validated at each level.

Does CYD09S18V18-167BBXI support flow-through mode on both ports simultaneously?

Yes - each port can be independently configured for pipelined (default) or flow-through read mode via the CONFIG block. Flow-through mode reduces read latency to 1 cycle but disables burst counter functionality on that port.

How is collision detection implemented when both ports access the same address?

On back-to-back clock cycles, the device asserts BUSYL or BUSYR and outputs the colliding address on A[18:0] lines. The first-busy address is latched and readable within one cycle - no software polling or external arbitration logic is required.

Can ZQ0L and ZQ0R be left unconnected if VIM is not used?

Yes - leaving ZQ0L and ZQ0R unconnected disables Variable Impedance Matching. Output drivers then operate at nominal impedance (35 Ω typical), which remains sufficient for most 50 Ω trace environments at ≤133 MHz; calibration is recommended above that frequency.

CYD09S18V18-167BBXI Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
256-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Dual Port, Synchronous
Memory Size:
9Mbit
Memory Organization:
512K x 18
Memory Interface:
Parallel
Clock Frequency:
167 MHz
Write Cycle Time - Word, Page:
-
Access Time:
4 ns
Voltage - Supply:
1.42V ~ 1.58V, 1.7V ~ 1.9V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
256-FBGA (17x17)

CYD09S18V18-167BBXI FAQ

1.How can I place an order for CYD09S18V18-167BBXI through Aetrix?

Please submit a Request for Quotation (RFQ) for CYD09S18V18-167BBXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CYD09S18V18-167BBXI reliable?

The price and inventory of CYD09S18V18-167BBXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYD09S18V18-167BBXI is usually 5 days.

3.What payment methods are accepted for CYD09S18V18-167BBXI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYD09S18V18-167BBXI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CYD09S18V18-167BBXI?

CYD09S18V18-167BBXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CYD09S18V18-167BBXI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CYD09S18V18-167BBXI?

For technical support, including CYD09S18V18-167BBXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYD09S18V18-167BBXI requirements.

6.How does Aetrix verify that CYD09S18V18-167BBXI is sourced from the original manufacturer or authorized distributors?

All CYD09S18V18-167BBXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYD09S18V18-167BBXI meets industry standards.

7.What is the process for return or replacement of CYD09S18V18-167BBXI?

All CYD09S18V18-167BBXI units undergo pre-shipment inspection (PSI). If there is an issue with CYD09S18V18-167BBXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CYD09S18V18-167BBXI part is unused and in its original packaging.

Return procedure for CYD09S18V18-167BBXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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