Infineon Technologies CYD09S36V18-167BBXC
- Part No.:
- CYD09S36V18-167BBXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 256-LBGA
- Datasheet:
-
CYD09S36V18-167BBXC.pdf
- Description:
- IC SRAM 9MBIT PAR 167MHZ 256FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,025
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CYD09S36V18-167BBXC from Cypress Semiconductor is a 9-Mbit (256K × 36) synchronous true dual-port SRAM with independent 36-bit ports, 1.8 V/1.5 V core supply, and SDR operation up to 200 MHz. It supports pipelined or flow-through read latency modes, deterministic collision resolution, and dual chip enables for depth expansion in high-speed networking and packet buffering applications.
For engineers reviewing the CYD09S36V18-167BBXC datasheet, CYD09S36V18-167BBXC pinout, CYD09S36V18-167BBXC application, or CYD09S36V18-167BBXC equivalent, key selection criteria include simultaneous dual-port bandwidth, configurable I/O standards (1.8 V LVCMOS/2.5 V LVCMOS), echo clocking support, burst counter capability, and JTAG boundary scan compliance.
Technical Context
This device implements a synchronous dual-port architecture with two independent address/data buses, each supporting 36-bit width and four byte enables. Collision detection logic provides deterministic flag output and first-busy-address readback on simultaneous access to identical memory locations.
Each port features selectable pipelined (2-cycle) or flow-through (1-cycle) read latency, variable impedance matching (VIM), echo clocks for timing margin improvement, and an integrated burst counter with mask/mirror registers and interrupt flags for sequential access acceleration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 9 Mbit (256K × 36), enabling compact buffer storage for medium-bandwidth packet processing. |
| Max Clock Frequency | 200 MHz SDR - delivers 14.4 Gbps aggregate bandwidth (200 MHz × 36-bit × 2 ports). |
| Core Voltage | 1.5 V or 1.8 V - reduces dynamic power vs. 3.3 V SRAMs while maintaining compatibility with modern SoC I/O domains. |
| I/O Voltage Options | Selectable 1.8 V LVCMOS, 2.5 V LVCMOS, or LVTTL - allows direct interfacing with diverse FPGA/ASIC I/O banks without level shifters. |
| Access Control | Deterministic collision handling with BUSY flag and readable busy address - eliminates arbitration firmware overhead in real-time systems. |
| Package | 256-ball FBGA (17 mm × 17 mm, 1.0 mm pitch) - optimized for high-density PCB layouts with thermal and signal integrity advantages over QFP. |
| JTAG Support | IEEE 1149.1 boundary scan - enables in-system testability and interconnect verification without physical probe access. |
Pinout & Package
Package: 256-ball Fine-Pitch BGA (FBGA), 17 mm × 17 mm, 1.0 mm ball pitch, RoHS-compliant. Pinout conforms to FullFlex36 family layout per Document 38-06082 Rev. *S Figures 2 and 5–6.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0L–A17L / A0R–A17R | Left/Right Port Address Inputs | 18-bit addressing per port (256K depth); unconnected pins (e.g., A18L/R) are NC for this density. |
| DQ0L–DQ35L / DQ0R–DQ35R | Left/Right Port Data I/O | 36-bit bidirectional data bus per port; supports byte-wise write enable via BE0L–BE3L / BE0R–BE3R. |
| CE0L/CE1L / CE0R/CE1R | Left/Right Port Chip Enables | Dual CE per port enables depth expansion; both must be active for valid read/write cycles. |
| R/WL / R/WR | Left/Right Port Read/Write Control | Active-high control; determines direction of data transfer on respective DQ bus during CE-active cycles. |
| CNT/MSKL / CNT/MSKR | Left/Right Counter/Mask Load Input | Loads initial address into burst counter or mask register; enables hardware-accelerated sequential access. |
| CNTINTL / CNTINTR | Left/Right Counter Interrupt Output | Asserted one cycle before counter reaches max count - triggers host interrupt for buffer wrap management. |
| PORTSTD0L/1L / PORTSTD0R/1R | I/O Standard Selection Inputs | Configures per-port I/O voltage standard (e.g., 1.8 V LVCMOS) at power-up; latched internally. |
| ZQ0L/ZQ1L / ZQ0R/ZQ1R | Impedance Calibration Pads | Connect to 240 Ω reference resistor for VIM calibration; ZQ1 unused for densities ≤18-Mbit. |
Key Features
| Feature | Design Value |
|---|---|
| Deterministic collision resolution | Guaranteed BUSY flag assertion and readable busy address on same-cycle conflict - eliminates race conditions in lock-free buffer designs. |
| Configurable read latency mode | Selectable pipelined (2-cycle) or flow-through (1-cycle) operation per port - balances timing margin vs. latency-critical throughput. |
| Burst counter with interrupt | Hardware address increment with wrap control and CNTINT flag - reduces CPU overhead in circular buffer and DMA descriptor chaining. |
| Echo clock outputs (CQ0L/CQ0R, CQ1L/CQ1R) | Phase-aligned clock copies for source-synchronous capture - improves setup/hold timing margins on high-speed FPGA interfaces. |
| Per-port I/O standard selection | Independent 1.8 V LVCMOS / 2.5 V LVCMOS / LVTTL configuration - avoids external level shifters when interfacing mixed-voltage SoCs. |
| Mailbox with interrupt flags | Dedicated shared memory region with INTR/INTL signaling - enables lightweight inter-processor communication without polling or external logic. |
Applications
| Telecom Packet Buffering | Industrial Motion Controller FIFO |
|---|---|
|
Use Scenario: Storing incoming/outgoing Ethernet frames in a line card ASIC with separate ingress/egress data paths. IC Role / Device Role / Timing Role: Dual-port SRAM acting as non-blocking frame buffer - left port accepts ingress packets while right port services egress scheduler. Use Value: Simultaneous 36-bit reads/writes at 200 MHz sustain 14.4 Gbps aggregate throughput, eliminating serialization bottlenecks in 10G+ switching fabric. |
Use Scenario: Holding motion trajectory points between PLC master and servo drive firmware during real-time interpolation. IC Role / Device Role / Timing Role: Shared memory FIFO with deterministic collision handling - left port writes new waypoints, right port reads next point on servo clock edge. Use Value: BUSY flag and readable busy address ensure no waypoint loss during rapid reprogramming, meeting IEC 61800-3 functional safety timing constraints. |
| Test Equipment Pattern Memory | Medical Imaging Data Pipeline |
|
Use Scenario: Storing stimulus/response patterns for automated circuit testing where pattern generator and analyzer operate asynchronously. IC Role / Device Role / Timing Role: Dual-clock domain bridge - left port clocked by pattern generator, right port clocked by analyzer, with JTAG for test vector loading. Use Value: IEEE 1149.1 boundary scan enables full interconnect test of SRAM interface traces, reducing fixture complexity and improving test coverage. |
Use Scenario: Buffering raw ultrasound A-line data between ADC front-end and FPGA-based beamformer before digital down-conversion. IC Role / Device Role / Timing Role: High-bandwidth temporary store - left port captures 36-bit parallel ADC samples, right port feeds beamforming engine with echo-clock synchronized reads. Use Value:Echo clocks (CQ0L/CQ1L) align data capture edges with FPGA sampling logic, achieving <100 ps jitter tolerance required for >15 MHz RF sampling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61WV102436BLL-15BLI | 1024K × 36, 15 ns async access, 3.3 V only, no burst counter or echo clocks | Lacks deterministic collision handling and per-port I/O flexibility - requires external arbitration logic for dual-CPU use. | Prefer for legacy 3.3 V systems where synchronous timing margin is not critical and cost is primary driver. |
| MT29F2G01ABAGDWB-IT:C | 2 Gbit NAND Flash, asynchronous, no dual-port capability, built-in ECC | Non-volatile but single-port only - unsuitable for real-time concurrent read/write; requires controller for wear leveling. | Only viable if non-volatility and density outweigh need for true dual-port concurrency and deterministic latency. |
Compared with IS61WV102436BLL-15BLI and MT29F2G01ABAGDWB-IT:C, CYD09S36V18-167BBXC uniquely delivers simultaneous 36-bit port access with hardware collision resolution, echo clocking for timing margin, and flexible I/O voltage selection - making it irreplaceable in high-throughput, low-latency dual-processor buffer applications.
Availability
CYD09S36V18-167BBXC is available at Aetrix Electronics and suitable for telecom packet buffering, industrial motion controller FIFOs, test equipment pattern memory, and medical imaging data pipelines requiring stable component supply across extended product lifecycles.
Supply support for CYD09S36V18-167BBXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for industrial, automotive, and communications markets, with emphasis on reliability and integration.
CYD09S36V18-167BBXC belongs to the FullFlex36 synchronous dual-port SRAM product line, engineered specifically for deterministic, high-bandwidth data exchange between asynchronous processors, FPGAs, or ASICs in real-time embedded systems.
FAQ
What is the maximum supported clock frequency for CYD09S36V18-167BBXC?
The device supports up to 200 MHz SDR operation on each port, verified under commercial temperature range (0°C to +70°C) with 1.8 V core supply and 1.8 V I/O. At 200 MHz, it achieves 14.4 Gbps aggregate bandwidth. Operation at 200 MHz requires adherence to specified setup/hold times and use of echo clocks for reliable capture in FPGA interfaces.
Does CYD09S36V18-167BBXC support JTAG boundary scan?
Yes, it fully complies with IEEE 1149.1 JTAG boundary scan. The TDI, TDO, TMS, TCK, and TRST pins are dedicated and functional per the pinout in Document 38-06082 Rev. *S. This enables PCB interconnect testing and in-system programming of configuration registers without requiring physical probe access.
How does deterministic collision resolution work in practice?
When both ports access the same memory location on the same clock edge, the device asserts BUSYL/BUSYR within one cycle and places the conflicting address on the address bus. The host reads this address to identify the collision source. No data corruption occurs - the winning port completes its access, and the losing port receives BUSY status, enabling software retry or priority arbitration.
Can the I/O voltage standard be changed dynamically during operation?
No. PORTSTD0L/1L and PORTSTD0R/1R are sampled at power-up reset and latched; they cannot be reconfigured without cycling VDD and asserting MRST. Once set, the I/O standard (e.g., 1.8 V LVCMOS) remains fixed until next power-on reset, ensuring signal integrity stability during runtime.
CYD09S36V18-167BBXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Dual Port, Synchronous
- Memory Size:
- 9Mbit
- Memory Organization:
- 256K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 167 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 4 ns
- Voltage - Supply:
- 1.42V ~ 1.58V, 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 256-FBGA (17x17)
CYD09S36V18-167BBXC FAQ
1.How can I place an order for CYD09S36V18-167BBXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CYD09S36V18-167BBXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYD09S36V18-167BBXC reliable?
The price and inventory of CYD09S36V18-167BBXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYD09S36V18-167BBXC is usually 5 days.
3.What payment methods are accepted for CYD09S36V18-167BBXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYD09S36V18-167BBXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYD09S36V18-167BBXC?
CYD09S36V18-167BBXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYD09S36V18-167BBXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYD09S36V18-167BBXC?
For technical support, including CYD09S36V18-167BBXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYD09S36V18-167BBXC requirements.
6.How does Aetrix verify that CYD09S36V18-167BBXC is sourced from the original manufacturer or authorized distributors?
All CYD09S36V18-167BBXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYD09S36V18-167BBXC meets industry standards.
7.What is the process for return or replacement of CYD09S36V18-167BBXC?
All CYD09S36V18-167BBXC units undergo pre-shipment inspection (PSI). If there is an issue with CYD09S36V18-167BBXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYD09S36V18-167BBXC part is unused and in its original packaging.
Return procedure for CYD09S36V18-167BBXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CYD09S36V18-167BBXC Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…

