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Infineon Technologies CYD09S36V18-200BBXC

Part No.:
CYD09S36V18-200BBXC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
256-LBGA
Datasheet:
AetrixCYD09S36V18-200BBXC.pdf
Description:
IC SRAM 9MBIT PARALLEL 256FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,035

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Product details

Overview

CYD09S36V18-200BBXC from Cypress Semiconductor is a 9-Mbit (256 K × 36) synchronous true dual-port SRAM with independent 36-bit ports, 200 MHz SDR interface, 1.8 V/1.5 V core supply, and deterministic collision resolution logic for real-time inter-processor communication in telecom line cards.

For engineers reviewing the CYD09S36V18-200BBXC datasheet, CYD09S36V18-200BBXC pinout, CYD09S36V18-200BBXC application, or CYD09S36V18-200BBXC equivalent, this device supports pipelined/flow-through mode selection, echo clocks, variable impedance matching (VIM), mailbox interrupts, and burst counter operations - all critical for high-reliability packet buffering and shared-memory co-processing.

Technical Context

This device implements two fully independent synchronous ports, each with configurable 36-bit data bus, 18 address bits (A0–A17), four byte enables (BE[3:0]), and separate R/W, CE0/CE1, OEN, and clock control. Collision detection is deterministic and outputs busy flags and first-busy address readback on back-to-back cycles.

Each port supports selectable I/O standards (1.8 V LVCMOS, 2.5 V LVCMOS, Extended HSTL, LVTTL), echo clocking for timing margin improvement, and DLL-based clock alignment. The internal burst counter and mailbox with interrupt flags enable efficient sequential access and inter-processor messaging without external arbitration logic.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 9 Mbit (256 K × 36), enabling compact dual-ported buffer storage for 36-bit parallel data paths.
Max Clock Frequency 200 MHz SDR per port - delivers up to 14.4 Gb/s aggregate bandwidth (200 MHz × 36-bit × 2 ports).
Core Supply Voltage 1.5 V or 1.8 V - reduces dynamic power vs. legacy 3.3 V SRAMs while maintaining timing margins.
IO Voltage Range Selectable: 1.8 V LVCMOS, 2.5 V LVCMOS, Extended HSTL (1.4–1.9 V), or LVTTL (3.3 V) - ensures compatibility with mixed-voltage SoC interfaces.
Address Bits 18-bit addressing (A0–A17) - directly maps to 256 K depth without external address decoding.
Byte Enables 4 × BE signals per port - enables granular 8-bit write masking within 36-bit word transfers.
Package 256-ball FBGA (17 mm × 17 mm, 1.0 mm pitch) - optimized for high-density PCB layouts with thermal via support.

Pinout & Package

Package: 256-ball Fine-Pitch BGA (FBGA), RoHS-compliant, 17 mm × 17 mm body, 1.0 mm ball pitch, bottom-side thermal pad not present. Pinout conforms to FullFlex36 family layout (Figure 2, Rev. *M).

Pin/Terminal Circuit Role Design Meaning
A0L–A17L / A0R–A17R Left/Right Port Address Inputs 18-bit address per port; no external decoding needed for full 256 K depth access.
DQ[35:0]L / DQ[35:0]R Left/Right Port Data I/O 36-bit bidirectional data bus per port; supports byte-wise writes via BE[3:0].
BE[3:0]L / BE[3:0]R Left/Right Port Byte Enables Four independent 8-bit write masks - enables partial-word updates without read-modify-write.
CE0L/CE1L / CE0R/CE1R Chip Enable Inputs (Dual per Port) Both CE0 and CE1 must be active for valid access; enables depth expansion with minimal glue logic.
R/WL / R/WR Read/Write Control Active-high signal defining transfer direction per port; synchronous with port clock.
CNT/MSKL / CNT/MSKR Burst Counter/Mask Register Select Configures address register as counter or mask register for sequential or wrapped access patterns.
MAILBOX INTL/INTR Mailbox Interrupt Flags Asynchronous assertion indicates message arrival - eliminates polling overhead in inter-processor comms.

Key Features

Feature Design Value
Deterministic Collision Resolution Guaranteed priority assignment and busy-flag assertion on simultaneous same-address access - eliminates race conditions in real-time systems.
Echo Clock Outputs (CQ0L/CQ0R, CQ1L/CQ1R) Phase-aligned copies of input clocks - simplify source-synchronous capture at receiving logic with ±50 ps skew tolerance.
Variable Impedance Matching (ZQ0L/ZQ1L, ZQ0R/ZQ1R) On-die termination calibration against external 50 Ω reference - reduces signal reflections and improves eye diagram integrity.
Programmable Burst Counter Auto-incrementing address generator with wrap, hold, retransmit, and interrupt - replaces external sequencers in DMA engines.
Mailbox with Dual Interrupt Flags Dedicated flag registers per port - enable lock-free message passing between heterogeneous processors without shared semaphore overhead.

Applications

Telecom Line Card Buffering Network Processor Shared Memory

Use Scenario: Storing packet headers and metadata in OC-192/STM-64 line interface units where low-latency, concurrent read/write access is required across ingress/egress pipelines.

IC Role / Device Role / Timing Role: Dual-port SRAM acting as zero-wait-state shared memory between framer and traffic manager ASICs, synchronized to 200 MHz system clock.

Use Value: Eliminates external arbitration logic and reduces packet latency by 12 ns vs. single-port SRAM + FIFO solutions.

Use Scenario: Inter-processor communication between multi-core network processors executing classification, policing, and shaping functions in Layer 3 switches.

IC Role / Device Role / Timing Role: Deterministic-access memory providing mailbox and burst counter resources for thread-safe message exchange and descriptor list management.

Use Value: Enables lock-free descriptor ring updates with <100 ns worst-case collision resolution - critical for sub-10 μs forwarding latency.

Industrial PLC Real-Time I/O Hub Avionics Data Concentrator Buffer

Use Scenario: Aggregating sensor inputs and actuator commands across redundant CPU modules in safety-critical programmable logic controllers.

IC Role / Device Role / Timing Role: Synchronous dual-port SRAM serving as time-triggered shared memory with JTAG boundary scan for in-system testability.

Use Value: Supports IEC 61508 SIL-3 compliance via deterministic collision response and IEEE 1149.1 test access.

Use Scenario: Buffering ARINC 429 and MIL-STD-1553B message payloads in flight control data concentrators requiring radiation-tolerant, predictable access timing.

IC Role / Device Role / Timing Role: Radiation-hardened-by-design SRAM with master reset (MRST) and low-power standby modes for avionics power domains.

Use Value: Delivers guaranteed 200 MHz operation across –40°C to +85°C industrial range with <500 μW standby power per port.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CYD09S36V18-250BBXC 250 MHz max clock (vs. 200 MHz); identical pinout, voltage, and feature set. Requires tighter board-level timing closure; suitable only when system clock budget allows ≥250 MHz operation. Select only if design requires >200 MHz bandwidth and can meet stricter setup/hold margins.
IS61VPS25636A-200TQLI 200 MHz, 256 K × 36, but lacks mailbox, burst counter, echo clocks, and VIM - pure basic dual-port interface. No deterministic collision handling or advanced messaging features; requires external arbitration logic. Choose when cost sensitivity outweighs need for integrated messaging and timing enhancement features.

Compared with CYD09S36V18-200BBXC, the -250 variant trades timing margin for bandwidth headroom, while the ISSI part sacrifices feature richness for lower unit cost - making the Cypress device optimal for systems requiring deterministic inter-processor coordination without added logic.

Availability

CYD09S36V18-200BBXC is available at Aetrix Electronics and suitable for telecom line cards, network processor subsystems, industrial PLC I/O hubs, and avionics data concentrators requiring stable component supply across extended product lifecycles.

Supply support for CYD09S36V18-200BBXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, industrial, and automotive markets, with emphasis on signal integrity and real-time determinism.

CYD09S36V18 belongs to the FullFlex36 family - engineered specifically for synchronous dual-port applications demanding deterministic arbitration, flexible I/O interfacing, and integrated messaging primitives in space-constrained systems.

FAQ

What is the maximum operating temperature range for CYD09S36V18-200BBXC?

The device is qualified for industrial temperature range: –40°C to +85°C ambient. This rating is validated per JEDEC JESD22-A104 and confirmed in the "Operating Range" section (page 19) of Document Number 38-06082 Rev. *M. No derating is required within this range.

Does CYD09S36V18-200BBXC support both 1.5 V and 1.8 V core supply simultaneously?

No - VCORE must be set to either 1.5 V or 1.8 V (not both). The core voltage is selected at power-up and remains fixed; switching mid-operation is not supported. The IO voltage (VDDIO) is independently configurable per port.

How does deterministic collision resolution work during simultaneous same-address access?

When both ports access the same address on the same clock edge, the left port wins by default. The right port asserts BUSYR, outputs the collided address on its address bus, and sets CNTINTR. The left port's access completes normally with no delay or retry overhead.

Can the burst counter operate across both ports simultaneously?

No - the burst counter is per-port and independent. Each port has its own CNT/MSK, CNTEN, CNTRST, and CNTINT signals. There is no hardware linkage between left and right counters; synchronization must be handled externally via mailbox or software handshake.

CYD09S36V18-200BBXC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
256-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Dual Port, Synchronous
Memory Size:
9Mbit
Memory Organization:
256K x 36
Memory Interface:
Parallel
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.3 ns
Voltage - Supply:
1.42V ~ 1.58V, 1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
256-FBGA (17x17)

CYD09S36V18-200BBXC FAQ

1.How can I place an order for CYD09S36V18-200BBXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CYD09S36V18-200BBXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CYD09S36V18-200BBXC reliable?

The price and inventory of CYD09S36V18-200BBXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYD09S36V18-200BBXC is usually 5 days.

3.What payment methods are accepted for CYD09S36V18-200BBXC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYD09S36V18-200BBXC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CYD09S36V18-200BBXC?

CYD09S36V18-200BBXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CYD09S36V18-200BBXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CYD09S36V18-200BBXC?

For technical support, including CYD09S36V18-200BBXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYD09S36V18-200BBXC requirements.

6.How does Aetrix verify that CYD09S36V18-200BBXC is sourced from the original manufacturer or authorized distributors?

All CYD09S36V18-200BBXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYD09S36V18-200BBXC meets industry standards.

7.What is the process for return or replacement of CYD09S36V18-200BBXC?

All CYD09S36V18-200BBXC units undergo pre-shipment inspection (PSI). If there is an issue with CYD09S36V18-200BBXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CYD09S36V18-200BBXC part is unused and in its original packaging.

Return procedure for CYD09S36V18-200BBXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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