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Infineon Technologies CYD09S36V18-200BBXI

Part No.:
CYD09S36V18-200BBXI
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
256-LBGA
Datasheet:
AetrixCYD09S36V18-200BBXI.pdf
Description:
IC SRAM 9MBIT PARALLEL 256FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,886

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Product details

Overview

CYD09S36V18-200BBXI from Cypress Semiconductor is a 9-Mbit (256K × 36) synchronous true dual-port SRAM with independent 36-bit ports, 1.8 V/1.5 V core supply, and 200 MHz SDR interface supporting up to 14.4 Gbps aggregate bandwidth. It implements deterministic access control for simultaneous port contention, built-in mailbox with interrupt flags, and burst counter logic-used in high-speed packet buffering and FPGA co-processor memory interfaces.

For engineers reviewing the CYD09S36V18-200BBXI datasheet, CYD09S36V18-200BBXI pinout, CYD09S36V18-200BBXI application, or CYD09S36V18-200BBXI equivalent, key selection criteria include pipelined vs. flow-through latency mode, per-port I/O voltage flexibility (1.8 V LVCMOS/2.5 V LVCMOS), echo clock support, and collision-handling flag behavior on back-to-back address conflicts.

Technical Context

This device belongs to the FullFlex36 family and uses synchronous dual-port architecture with two independent clock domains (CLKL/CLKR), each supporting single-data-rate operation at up to 200 MHz. Address collision detection triggers deterministic flag assertion and first-busy-address readback within one cycle.

Each port features selectable pipelined (2-cycle read latency) or flow-through (1-cycle read latency) timing, configurable byte enables (BE[3:0]), and independent I/O standards-including 1.8 V LVCMOS, 2.5 V LVCMOS, or LVTTL-with variable impedance matching (VIM) enabled via ZQ pins.

Key Specifications

ParameterValue and Actual Design Meaning
Memory Density9 Mbit (256K × 36 bits), enabling compact dual-port buffer for 36-bit data paths
Max Clock Frequency200 MHz SDR per port, supporting 14.4 Gbps total bandwidth (200 MHz × 36-bit × 2 ports)
Core Supply Voltage1.5 V or 1.8 V VCORE, reducing dynamic power vs. legacy 3.3 V SRAMs
I/O Voltage OptionsSelectable 1.8 V LVCMOS, 2.5 V LVCMOS, or LVTTL per port-enabling mixed-voltage system interfacing
Read Latency ModesPipelined (2-cycle) or flow-through (1-cycle); determines timing margin requirements in FPGA/ASIC designs
Collision HandlingDeterministic flag output + first-busy-address readback on simultaneous same-address access
Package256-ball FBGA (17 mm × 17 mm, 1.0 mm pitch), compatible with standard BGA reflow profiles

Pinout & Package

Package: 256-ball Fine-Pitch Ball Grid Array (FBGA), 17 mm × 17 mm, 1.0 mm ball pitch, RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
A[17:0]L / A[17:0]RLeft/Right port address inputs18-bit addressing supports 256K depth per port; unconnected above A17 for this density
DQ[35:0]L / DQ[35:0]RLeft/Right port bidirectional data buses36-bit parallel interface; each bit routed independently for signal integrity optimization
BE[3:0]L / BE[3:0]RByte enable inputs per portFour enables control 8-bit subwords; critical for partial writes without read-modify-write overhead
CE0/CE1L & CE0/CE1RChip enable pairs per portDual enables allow selective port activation and low-power gating of unused port circuitry
R/WL / R/WRRead/write direction controlActive-high control; synchronously sampled to define transaction type on each clock edge
BUSYL / BUSYRBusy status outputsAsserted when port is busy due to internal arbitration or counter operation; used for handshake flow control
CNTINTL / CNTINTRBurst counter interrupt flagsIndicate counter wrap or max-count condition; trigger host interrupt for sequential buffer management
ZQ0L / ZQ1L & ZQ0R / ZQ1RImpedance calibration referenceConnect to 240 Ω ±1% resistor to ground to enable VIM for output driver impedance tuning

Key Features

FeatureDesign Value
Deterministic collision resolutionGuaranteed flag assertion and readable busy address on same-cycle contention-eliminates arbitration uncertainty in real-time systems
Per-port I/O voltage selectabilityEnables direct connection to 1.8 V FPGA banks or 2.5 V ASIC I/O without level shifters
Burst counter with mirror registerReduces address bus traffic during sequential accesses; retransmit function reloads counter from mirrored start address
Mailbox with interrupt flagsSupports lock-free inter-processor communication between CPU and DSP/FPGA using shared memory regions
Echo clock outputs (CQ0/CQ1)Delivers phase-aligned clock copies to simplify source-synchronous capture timing at receiving logic

Applications

Telecom Line Card BufferingFPGA-Based Protocol Analyzer

Use Scenario: Storing incoming/outgoing ATM or Ethernet frames in carrier-grade line cards where ingress and egress paths operate independently.

IC Role / Device Role / Timing Role: Dual-port SRAM acts as non-blocking frame buffer-left port accepts data from PHY, right port feeds switch fabric-both at full 200 MHz rate.

Use Value: Deterministic collision handling ensures no frame loss during bursty traffic peaks; echo clocks align capture timing across multi-FPGA architectures.

Use Scenario: Capturing and post-processing high-speed serial protocol traffic (e.g., PCIe, SATA) using FPGA-based logic analyzers with deep trace memory.

IC Role / Device Role / Timing Role: Left port stores captured data under FPGA control; right port streams data to host processor via DMA-no software intervention required during capture.

Use Value: Mailbox interrupts notify host when buffer is half-full; burst counter automates address incrementing, reducing FPGA logic resource usage by >12%.

Industrial Motion ControllerAvionics Data Concentrator

Use Scenario: Real-time coordination of multiple servo axes in CNC machines, requiring synchronized position/velocity updates between motion CPU and FPGA trajectory engine.

IC Role / Device Role / Timing Role: Shared memory space for coordinate tables and status registers-CPU writes setpoints, FPGA reads and executes interpolation in hard real-time loop.

Use Value: Flow-through read mode achieves 5 ns read latency; deterministic busy flag prevents overwrites during concurrent access-meeting <1 µs jitter requirement.

Use Scenario: Aggregating ARINC 429, MIL-STD-1553, and discrete I/O data from multiple avionics subsystems into a centralized health monitoring unit.

IC Role / Device Role / Timing Role: Left port receives time-stamped sensor packets from interface ASICs; right port supplies consolidated reports to flight management computer.

Use Value: Independent I/O voltage settings allow 1.8 V connection to ARINC receiver ASICs and 2.5 V link to legacy 1553 transceivers-reducing board-level voltage conversion.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous dual-port SRAM applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IS61WV102436BLL-15BLI1024K × 36, 15 ns async access; no pipelined mode, no mailbox or burst counterLacks deterministic collision handling and echo clocks-requires external arbitration logic for real-time systemsChoose only if system clock ≤100 MHz and latency tolerance >15 ns; not suitable for 200 MHz SDR timing closure
SN74ALVC164245DGGRLevel-shifting transceiver-not memory; no storage, no dual ports, no clock domain isolationCannot replace SRAM functionality; only useful for voltage translation between busesNot a functional alternative; included only to clarify common mis-selection error in mixed-voltage designs

Compared with IS61WV102436BLL-15BLI and SN74ALVC164245DGGR, CYD09S36V18-200BBXI uniquely delivers synchronous dual-port operation at 200 MHz with integrated collision management and mailbox messaging-making it irreplaceable in high-speed deterministic embedded memory subsystems.

Availability

CYD09S36V18-200BBXI is available at Aetrix Electronics and suitable for telecom line card buffering, FPGA-based protocol analysis, industrial motion control, and avionics data concentration requiring stable component supply across extended temperature ranges.

Supply support for CYD09S36V18-200BBXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for industrial, automotive, and communications infrastructure.

This device belongs to the FullFlex36 synchronous dual-port SRAM product line, engineered specifically for deterministic, low-latency memory sharing between heterogeneous processors and accelerators in real-time embedded systems.

FAQ

What is the maximum supported I/O voltage for CYD09S36V18-200BBXI?

The device supports 1.8 V LVCMOS, 2.5 V LVCMOS, and LVTTL I/O standards per port-configurable independently via the CONFIG block. Core voltage remains fixed at 1.5 V or 1.8 V. No 3.3 V I/O is supported; attempting to exceed 2.5 V on VDDIO may damage the device.

Does CYD09S36V18-200BBXI support JTAG boundary scan?

Yes, it implements IEEE 1149.1 JTAG boundary scan with TDI, TDO, TMS, TCK, and TRST pins. Scan chain includes all I/O buffers and internal control logic. Boundary scan testing is fully supported per the 38-06082 Rev. *S specification and requires no special configuration mode.

How does the deterministic access control resolve simultaneous port conflicts?

When both ports access the same address on the same clock edge, the device asserts BUSY and FLAG outputs within one cycle and places the contending address on the address bus for readback. The left port wins arbitration; the right port receives a delayed response. This behavior is guaranteed across temperature and voltage ranges per datasheet timing diagrams.

Can CYD09S36V18-200BBXI be used in industrial temperature applications?

Yes, the -200BBXI suffix denotes Industrial temperature grade (–40 °C to +85 °C). All electrical characteristics-including 200 MHz operation, setup/hold times, and VIM calibration-are specified and tested across this range. Thermal resistance (θJA = 32 °C/W) ensures reliable operation under typical PCB layouts with 2 oz copper and 4 thermal vias.

CYD09S36V18-200BBXI Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
256-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Dual Port, Synchronous
Memory Size:
9Mbit
Memory Organization:
256K x 36
Memory Interface:
Parallel
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.3 ns
Voltage - Supply:
1.42V ~ 1.58V, 1.7V ~ 1.9V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
256-FBGA (17x17)

CYD09S36V18-200BBXI FAQ

1.How can I place an order for CYD09S36V18-200BBXI through Aetrix?

Please submit a Request for Quotation (RFQ) for CYD09S36V18-200BBXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CYD09S36V18-200BBXI reliable?

The price and inventory of CYD09S36V18-200BBXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYD09S36V18-200BBXI is usually 5 days.

3.What payment methods are accepted for CYD09S36V18-200BBXI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYD09S36V18-200BBXI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CYD09S36V18-200BBXI?

CYD09S36V18-200BBXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CYD09S36V18-200BBXI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CYD09S36V18-200BBXI?

For technical support, including CYD09S36V18-200BBXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYD09S36V18-200BBXI requirements.

6.How does Aetrix verify that CYD09S36V18-200BBXI is sourced from the original manufacturer or authorized distributors?

All CYD09S36V18-200BBXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYD09S36V18-200BBXI meets industry standards.

7.What is the process for return or replacement of CYD09S36V18-200BBXI?

All CYD09S36V18-200BBXI units undergo pre-shipment inspection (PSI). If there is an issue with CYD09S36V18-200BBXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CYD09S36V18-200BBXI part is unused and in its original packaging.

Return procedure for CYD09S36V18-200BBXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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