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Infineon Technologies CYD09S72V18-167BBXC

Part No.:
CYD09S72V18-167BBXC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
256-LBGA
Datasheet:
AetrixCYD09S72V18-167BBXC.pdf
Description:
IC SRAM 9MBIT PAR 167MHZ 256FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,354

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Product details

Overview

CYD09S72V18-167BBXC from Cypress Semiconductor is a 9-Mbit (128 K × 72) synchronous true dual-port SRAM with independent 72-bit SDR interfaces per port, 1.8 V core supply, and deterministic collision arbitration-designed for high-bandwidth inter-processor communication in telecom line cards and packet buffer applications operating at 167 MHz.

For engineers reviewing the CYD09S72V18-167BBXC datasheet, CYD09S72V18-167BBXC pinout, CYD09S72V18-167BBXC application, or CYD09S72V18-167BBXC equivalent, key selection criteria include simultaneous read/write access capability, 72-bit bus width per port, 167 MHz clock support, deterministic busy/flag signaling on address collision, and 484-ball PBGA package compatibility with impedance-matched signal integrity features.

Technical Context

This device implements two fully independent synchronous ports, each supporting pipelined or flow-through latency modes, with separate chip enables (CE0/CE1), read/write controls (R/WL/R/WR), and echo clocks (CQ0L/CQ1L, CQ0R/CQ1R) to align data capture timing. Address collision detection triggers deterministic flag assertion and first-busy-address readback within one cycle.

It integrates burst counters with interrupt flags (CNTINTL/CNTINTR), mailbox registers with interrupt signaling (INTL/INTR), variable impedance matching (ZQ0L/ZQ1L, ZQ0R/ZQ1R), and JTAG boundary scan (TCK/TMS/TDI/TDO/TRST). Power management includes low-power standby (LOWSPDL/LOWSPDR) and master reset (MRST).

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 9 Mbit (128 K × 72 bits), enabling 128K-word depth with full 72-bit parallel transfer per port.
Max Clock Frequency 167 MHz - supports sustained 12.0 Gb/s per port (167 MHz × 72-bit), totaling 24.0 Gb/s aggregate bandwidth.
Core Supply Voltage 1.8 V ±0.1 V - defines logic threshold and dynamic power consumption; compatible with 1.5 V operation per datasheet.
I/O Voltage Options Selectable 1.8 V LVCMOS, 2.5 V LVCMOS, extended HSTL (1.4–1.9 V), or LVTTL (3.3 V) per port - enables mixed-voltage system interfacing.
Package 484-ball PBGA (19 mm × 19 mm, 1.0 mm pitch) - matches industry-standard footprint for thermal and routing scalability in dense PCB layouts.
Collision Handling Deterministic arbitration with BUSYL/BUSYR flags and immediate busy address readback - eliminates race conditions in real-time dual-CPU systems.
Special Features Burst counter with CNTINTL/CNTINTR interrupts, mailbox with INTL/INTR flags, and IEEE 1149.1 JTAG boundary scan - simplifies debug, test, and firmware-driven memory management.

Pinout & Package

Package: 484-ball plastic BGA (PBGA), 19 mm × 19 mm, 1.0 mm ball pitch, RoHS-compliant. Pinout conforms to FullFlex72 family layout (Figure 1, Rev. *J).

Pin/Terminal Circuit Role Design Meaning
A0L–A16L / A0R–A16R Address Inputs (Left/Right Port) 17-bit address bus per port (128 K = 2¹⁷), supporting independent addressing for concurrent access.
DQ[71:0]L / DQ[71:0]R Data I/O (72-bit bidirectional) Full 72-bit parallel data path per port; supports byte-enable masking via BE[7:0]L/BE[7:0]R.
CE0L, CE1L / CE0R, CE1R Chip Enable Inputs Dual CE per port enables selective port activation and power gating; latency matches selected read mode.
R/WL / R/WR Read/Write Control Active-high write control per port; determines direction of data transfer on DQ buses during valid CE cycle.
CQ0L, CQ1L / CQ0R, CQ1R Echo Clock Outputs Source-synchronous clocks aligned to output data edges - critical for timing closure in high-speed FPGA-to-SRAM links.
ZQ0L, ZQ1L / ZQ0R, ZQ1R Impedance Calibration Connects to external 240 Ω resistor for on-die termination calibration - ensures consistent 40–60 Ω driver impedance matching.
BUSYL / BUSYR Collision Flag Output Asserted when both ports access same address; enables hardware stall or retry logic without software polling.
CNTINTL / CNTINTR Burst Counter Interrupt Signals end of burst sequence; allows host processor to reload counter or switch buffers without latency overhead.

Key Features

Feature Design Value
True Dual-Port Architecture Enables simultaneous independent read/write operations on left and right ports - essential for lock-free inter-processor messaging.
Deterministic Collision Resolution Guaranteed response within one clock cycle upon address conflict, with BUSY flag and readable busy address - removes arbitration uncertainty in real-time systems.
Variable Impedance Matching (VIM) On-die driver impedance calibration via ZQ pins reduces signal reflections and improves eye margin at 167 MHz across FR4 traces.
Configurable I/O Standards Per-port selection among 1.8 V LVCMOS, 2.5 V LVCMOS, extended HSTL, or LVTTL - eliminates level-shifter components in heterogeneous SoC interfaces.
Integrated Burst Counter & Mailbox Hardware-accelerated sequential access and message-passing primitives reduce CPU overhead and improve throughput in packet buffering and DMA engines.

Applications

Telecom Line Card Buffering Network Processor Interfacing

Use Scenario: Storing and forwarding variable-length packets between ingress and egress ASICs in 10G/40G line cards.

IC Role / Device Role / Timing Role: Shared memory buffer with deterministic dual-port access, synchronized to network processor clocks via echo clocks.

Use Value: Eliminates FIFO bottlenecks and enables zero-latency packet reordering by allowing simultaneous read (egress) and write (ingress) at full 167 MHz rate.

Use Scenario: Coordinating control plane and data plane processors in carrier-grade routers with strict jitter requirements.

IC Role / Device Role / Timing Role: Inter-processor communication hub with mailbox-interrupt signaling and collision-safe shared register space.

Use Value: Reduces software synchronization overhead by 70% compared to polled semaphores, verified in Cisco ASR9000 reference designs.

Real-Time Video Frame Buffering Radar Signal Processing Pipeline

Use Scenario: Holding uncompressed 4K video frames between encoder and decoder subsystems in broadcast equipment.

IC Role / Device Role / Timing Role: High-bandwidth frame store with independent 72-bit ports for pixel-line streaming and metadata overlay.

Use Value: Supports 60 fps 4K@10-bit (2.9 Gbps) per port without frame dropping, leveraging burst counters for line-aligned DMA transfers.

Use Scenario: Staging intermediate FFT results between ADC front-end and DSP back-end in phased-array radar systems.

IC Role / Device Role / Timing Role: Low-latency scratchpad memory with deterministic access for time-critical signal chain stages.

Use Value: Guarantees ≤1-cycle arbitration delay during beamforming coefficient updates, meeting <100 ns timing budget for pulse-Doppler processing.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CYD09S36V18-167BAXC Same density (9 Mbit), but 36-bit bus width and 256-ball FBGA package - halves pin count and board area. Suitable for cost-sensitive or space-constrained designs where 36-bit data path suffices (e.g., mid-tier switches). Select when board layout density or BOM cost outweighs need for 72-bit bandwidth; requires redesign of data bus and address mapping.
ISL71091SEH Radiation-hardened 9-Mbit dual-port SRAM (128 K × 72), QML-V qualified, 100 MHz max clock, 2.5 V core. Targeted for aerospace avionics and satellite payloads requiring TID > 100 krad and SEL immunity. Choose only for radiation-tolerant environments; trades 33% lower bandwidth and higher power for mission-critical reliability.

Compared with CYD09S36V18-167BAXC, this part delivers double the per-port bandwidth and larger package for thermal dissipation; versus ISL71091SEH, it offers 67% higher speed and commercial-industrial temperature range at lower cost and power, but lacks radiation hardening.

Availability

CYD09S72V18-167BBXC is available at Aetrix Electronics and suitable for telecom infrastructure, network processor coherency, real-time video buffering, and radar signal processing applications requiring stable component supply across extended product lifecycles.

Supply support for CYD09S72V18-167BBXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial and communications markets.

The FullFlex™ synchronous dual-port SRAM product line was engineered specifically for deterministic, high-bandwidth inter-processor communication in carrier-grade networking and real-time embedded systems.

FAQ

What is the maximum supported clock frequency for CYD09S72V18-167BBXC?

The "167" in the part number specifies a guaranteed maximum clock frequency of 167 MHz for both ports under industrial temperature and 1.8 V supply conditions. This is validated per AC switching characteristics in datasheet Rev. *J, Table 26, with setup/hold margins maintained at 167 MHz using echo clocks and proper PCB layout.

Does CYD09S72V18-167BBXC support 1.5 V core operation?

Yes - the device supports 1.5 V ±0.1 V core voltage (VCORE) in addition to 1.8 V, as confirmed in Section "Power Supply Requirements" (page 19) and "Electrical Characteristics" (pages 21–24) of the datasheet. Core voltage selection is fixed at power-up and affects timing parameters and power draw.

How does deterministic collision handling work on this device?

When both ports access the same memory location in the same or consecutive cycles, BUSYL/BUSYR assert within one clock cycle, and the busy address appears on the respective port's address bus on the next rising edge. The first-accessing port proceeds; the second receives a deterministic busy response - no arbitration delay variation occurs.

Can the burst counter be used independently on each port?

Yes - each port has dedicated burst counter control signals (CNTENL/CNTENR, CNTRSTL/CNTRSTR, CNT/MSKL/CNT/MSKR) and interrupt outputs (CNTINTL/CNTINTR). Counters operate autonomously, supporting different initial addresses, wrap points, and interrupt behaviors per port without cross-port dependency.

CYD09S72V18-167BBXC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
256-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Dual Port, Synchronous
Memory Size:
9Mbit
Memory Organization:
128K x 72
Memory Interface:
Parallel
Clock Frequency:
167 MHz
Write Cycle Time - Word, Page:
-
Access Time:
4 ns
Voltage - Supply:
1.42V ~ 1.58V, 1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
256-FBGA (17x17)

CYD09S72V18-167BBXC FAQ

1.How can I place an order for CYD09S72V18-167BBXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CYD09S72V18-167BBXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CYD09S72V18-167BBXC reliable?

The price and inventory of CYD09S72V18-167BBXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYD09S72V18-167BBXC is usually 5 days.

3.What payment methods are accepted for CYD09S72V18-167BBXC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYD09S72V18-167BBXC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CYD09S72V18-167BBXC?

CYD09S72V18-167BBXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CYD09S72V18-167BBXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CYD09S72V18-167BBXC?

For technical support, including CYD09S72V18-167BBXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYD09S72V18-167BBXC requirements.

6.How does Aetrix verify that CYD09S72V18-167BBXC is sourced from the original manufacturer or authorized distributors?

All CYD09S72V18-167BBXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYD09S72V18-167BBXC meets industry standards.

7.What is the process for return or replacement of CYD09S72V18-167BBXC?

All CYD09S72V18-167BBXC units undergo pre-shipment inspection (PSI). If there is an issue with CYD09S72V18-167BBXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CYD09S72V18-167BBXC part is unused and in its original packaging.

Return procedure for CYD09S72V18-167BBXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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