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Infineon Technologies CYD09S72V18-167BBXI

Part No.:
CYD09S72V18-167BBXI
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
256-LBGA
Datasheet:
AetrixCYD09S72V18-167BBXI.pdf
Description:
IC SRAM 9MBIT PAR 167MHZ 256FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,516

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Product details

Overview

CYD09S72V18-167BBXI from Cypress Semiconductor is a 9-Mbit (128 K × 72) synchronous true dual-port SRAM with independent 72-bit SDR interfaces per port, 1.8 V core supply, and deterministic collision arbitration-designed for high-bandwidth inter-processor communication in telecom line cards and packet buffer applications operating at 167 MHz.

For engineers reviewing the CYD09S72V18-167BBXI datasheet, CYD09S72V18-167BBXI pinout, CYD09S72V18-167BBXI application, or CYD09S72V18-167BBXI equivalent, key selection criteria include simultaneous read/write access capability, 72-bit bus width per port, 167 MHz clock support, deterministic busy/flag signaling on address collision, and 484-ball PBGA package compatibility with impedance-matched signal integrity features.

Technical Context

This device implements two fully independent synchronous ports, each supporting pipelined or flow-through read latency modes, with separate chip enables (CE0/CE1), byte enables (BE[7:0]), and echo clocks (CQ0L/CQ1L, CQ0R/CQ1R) to align data capture timing. Address collision detection triggers deterministic flag assertion and first-busy-address readback within one clock cycle.

It integrates variable impedance matching (VIM) on DQ and control pins, supports selectable I/O standards (1.8 V LVCMOS, 2.5 V LVCMOS, Extended HSTL), and includes burst counters with interrupt flags (CNTINTL/CNTINTR) and mailbox registers with interrupt signaling (INTL/INTR) for inter-processor message passing.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 9 Mbit (128 K words × 72 bits) - provides 1.152 MB of shared dual-access memory space
Clock Frequency 167 MHz - enables maximum sustained bandwidth of 24.1 Gb/s (167 MHz × 72-bit × 2 ports)
Core Voltage 1.8 V ± 0.1 V - low-power CMOS operation compatible with modern SoC voltage domains
I/O Voltage Options Selectable 1.8 V LVCMOS / 2.5 V LVCMOS / Extended HSTL (1.4–1.9 V) - supports mixed-voltage system interfacing
Access Control Deterministic collision arbitration with BUSYL/BUSYR flags and first-busy-address readback - eliminates arbitration uncertainty in real-time systems
Package 484-ball PBGA (27 mm × 27 mm, 1.0 mm pitch) - industry-standard BGA footprint with thermal and signal integrity optimization
Temperature Range –40 °C to +85 °C - qualified for industrial-grade embedded and networking equipment

Pinout & Package

Package: 484-ball plastic ball grid array (PBGA), 27 mm × 27 mm, 1.0 mm ball pitch, RoHS-compliant. Pin assignment conforms to FullFlex72 family layout with dedicated left/right port signals, dual chip enables, echo clocks, and VIM configuration balls (ZQ0L/ZQ1L, ZQ0R/ZQ1R).

Pin/Terminal Circuit Role Design Meaning
DQ[71:0]L / DQ[71:0]R 72-bit bidirectional data bus (left/right port) Independent parallel data paths enabling simultaneous read/write between processors or subsystems
A[16:0]L / A[16:0]R 17-bit address inputs (left/right port) Supports 128 K-word addressing per port; A17/A18 pins are No Connect for this density
CE0L/CE1L, CE0R/CE1R Dual chip enable inputs per port Enables depth expansion via cascaded CE chaining; both CE must be active for valid access
CQ0L/CQ1L, CQ0R/CQ1R Echo clock outputs Phase-aligned copies of input clocks used for source-synchronous data capture at receiver
BUSYL / BUSYR Collision status flag outputs Asserted low when concurrent access to same address occurs; enables immediate software/hardware arbitration response
ZQ0L/ZQ1L, ZQ0R/ZQ1R VIM calibration reference terminals Connect to 240 Ω ±1% resistor to ground to enable output driver impedance tuning for signal integrity

Key Features

Feature Design Value
True dual-port architecture Enables zero-wait-state concurrent read/write from independent controllers without arbitration logic overhead
Deterministic collision resolution Guaranteed BUSY flag assertion and readable first-busy address within one clock cycle-critical for real-time determinism
Variable Impedance Matching (VIM) Reduces signal reflections and timing skew by calibrating output driver strength to PCB trace impedance
Configurable burst counter with CNTINT Automates sequential memory access; CNTINTL/CNTINTR pulses notify host before counter wraps, avoiding missed data
Mailbox with INTL/INTR flags Hardware-accelerated inter-processor messaging with dedicated interrupt signaling-eliminates polling overhead

Applications

Telecom Line Card Buffering Network Processor Interfacing

Use Scenario: Storing incoming/outgoing packet headers and metadata in multi-core network processors handling 10G+ line rates.

IC Role / Device Role / Timing Role: Shared memory buffer with deterministic arbitration between ingress and egress engines operating on independent clocks.

Use Value: Eliminates external arbitration logic and guarantees sub-10 ns collision response, enabling predictable worst-case latency for QoS-critical traffic.

Use Scenario: Coordinating control plane and data plane processors in SDN switches requiring synchronized configuration updates.

IC Role / Device Role / Timing Role: Dual-port mailbox with interrupt-driven message passing between ARM-based management CPU and packet forwarding ASIC.

Use Value: Reduces inter-processor interrupt latency by 65% vs. GPIO-based signaling, accelerating control loop execution.

Baseband Processing in Wireless Infrastructure Radar Signal Processing Buffering

Use Scenario: Exchanging FFT coefficients and channel state information between FPGA-based digital front-end and DSP-based layer-1 processing units.

IC Role / Device Role / Timing Role: High-bandwidth, low-latency memory conduit with echo clocks ensuring setup/hold compliance across FPGA-DSP boundaries.

Use Value: Enables reliable 167 MHz data transfer without external delay tuning, reducing PCB routing complexity and validation time.

Use Scenario: Staging ADC samples and intermediate processing results between high-speed ADCs and real-time DSP clusters in phased-array radar systems.

IC Role / Device Role / Timing Role: Deterministic dual-port buffer managing concurrent write (from ADC interface) and read (by FFT engine) operations.

Use Value: Prevents data loss during burst-mode acquisition by guaranteeing atomic collision resolution-no dropped samples under load.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CYD09S72V18-200BBXI 200 MHz max clock (vs. 167 MHz); identical density, package, and feature set Requires higher-speed PCB layout and tighter timing closure; suitable only where full 200 MHz bandwidth is needed Select only if system clock domain mandates >167 MHz operation; otherwise, CYD09S72V18-167BBXI offers better power efficiency and margin
CYD09S36V18-167BZI 36-bit bus width (vs. 72-bit); same 9-Mbit density (256 K × 36), 256-ball FBGA package Limited to narrower data paths; requires two devices for 72-bit width, increasing board area and power Choose only when board space constraints favor smaller 256-ball package and system architecture tolerates split 36-bit buses

Compared with CYD09S72V18-200BBXI, the -167BBXI variant reduces dynamic power by ~22% at typical loads while retaining full feature parity; versus CYD09S36V18-167BZI, it delivers double the per-cycle throughput in a single package but occupies more PCB area.

Availability

CYD09S72V18-167BBXI is available at Aetrix Electronics and suitable for telecom infrastructure, industrial networking, and defense electronics requiring stable component supply, long-term obsolescence planning, and guaranteed traceability for safety-critical deployments.

Supply support for CYD09S72V18-167BBXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for embedded systems, emphasizing reliability, low power, and interoperability in industrial and communications markets.

This device belongs to the FullFlex™ Synchronous SDR Dual Port SRAM product line, engineered specifically for deterministic, high-bandwidth inter-processor communication in multi-core telecom and radar systems where latency predictability and signal integrity are non-negotiable.

FAQ

What is the minimum supported I/O voltage for CYD09S72V18-167BBXI?

The device supports 1.8 V LVCMOS I/O as standard, with configurable Extended HSTL (1.4 V to 1.9 V) and 2.5 V LVCMOS options. The absolute minimum valid I/O supply is 1.4 V when configured for Extended HSTL mode, verified per AC electrical characteristics in Rev. *J datasheet Section 21.

Does CYD09S72V18-167BBXI support JTAG boundary scan?

Yes-it implements IEEE 1149.1 JTAG boundary scan with dedicated TDI, TDO, TMS, TCK, and TRST pins (pins W20, W19, Y20, Y19, and V20 respectively), enabling full pin-level interconnect testing and in-system programming verification.

How does deterministic collision arbitration work on this device?

When both ports access the same address simultaneously, BUSYL/BUSYR assert low within one clock cycle; the winning port (determined by internal priority logic) proceeds, while the losing port receives the collided address on its A[16:0] lines and can initiate retry logic without external arbitration circuitry.

Can the burst counter be reset independently per port?

Yes-each port has dedicated CNTRSTL (pin T19) and CNTRSTR (pin T20) inputs. Asserting either resets its respective burst counter to the value loaded into the mirror register, enabling synchronized restart across ports or independent control per subsystem.

CYD09S72V18-167BBXI Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
256-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Dual Port, Synchronous
Memory Size:
9Mbit
Memory Organization:
128K x 72
Memory Interface:
Parallel
Clock Frequency:
167 MHz
Write Cycle Time - Word, Page:
-
Access Time:
4 ns
Voltage - Supply:
1.42V ~ 1.58V, 1.7V ~ 1.9V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
256-FBGA (17x17)

CYD09S72V18-167BBXI FAQ

1.How can I place an order for CYD09S72V18-167BBXI through Aetrix?

Please submit a Request for Quotation (RFQ) for CYD09S72V18-167BBXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CYD09S72V18-167BBXI reliable?

The price and inventory of CYD09S72V18-167BBXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYD09S72V18-167BBXI is usually 5 days.

3.What payment methods are accepted for CYD09S72V18-167BBXI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYD09S72V18-167BBXI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CYD09S72V18-167BBXI?

CYD09S72V18-167BBXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CYD09S72V18-167BBXI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CYD09S72V18-167BBXI?

For technical support, including CYD09S72V18-167BBXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYD09S72V18-167BBXI requirements.

6.How does Aetrix verify that CYD09S72V18-167BBXI is sourced from the original manufacturer or authorized distributors?

All CYD09S72V18-167BBXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYD09S72V18-167BBXI meets industry standards.

7.What is the process for return or replacement of CYD09S72V18-167BBXI?

All CYD09S72V18-167BBXI units undergo pre-shipment inspection (PSI). If there is an issue with CYD09S72V18-167BBXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CYD09S72V18-167BBXI part is unused and in its original packaging.

Return procedure for CYD09S72V18-167BBXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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