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Infineon Technologies CYD09S72V18-200BBXI

Part No.:
CYD09S72V18-200BBXI
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
256-LBGA
Datasheet:
AetrixCYD09S72V18-200BBXI.pdf
Description:
IC SRAM 9MBIT PARALLEL 256FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,371

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Product details

Overview

CYD09S72V18-200BBXI from Cypress Semiconductor is a 9-Mbit (128 K × 72) synchronous true dual-port SRAM with independent 72-bit SDR interfaces operating at 200 MHz, supporting deterministic collision resolution and mailbox-based inter-processor communication in high-throughput networking and packet buffering applications.

For engineers reviewing the CYD09S72V18-200BBXI datasheet, CYD09S72V18-200BBXI pinout, CYD09S72V18-200BBXI application, or CYD09S72V18-200BBXI equivalent, this device delivers deterministic access control, selectable pipelined/flow-through latency modes, variable impedance matching (VIM), echo clocks, and dual chip enables for depth expansion-critical for FPGA-to-FPGA or ASIC-to-ASIC shared memory architectures requiring simultaneous read/write on both ports.

Technical Context

This device implements two fully independent synchronous ports, each with 72-bit data width, 17 address bits (A0L–A16L / A0R–A16R), eight byte enables (BE[7:0]L/R), and separate R/WL/R/WR control. Each port supports configurable read latency (1–3 cycles) and operates in either pipelined (two-stage) or flow-through mode.

Collision detection is deterministic: simultaneous access to the same address triggers BUSYL/BUSYR flags, outputs the conflicting address on the bus, and asserts CNTINTL/CNTINTR for interrupt-driven recovery. Built-in burst counters, mailbox registers with INTL/INTR flags, and JTAG boundary scan (IEEE 1149.1) support real-time message passing and system-level testability.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 9 Mbit (128 K × 72), enabling 9 MB of shared buffer space per device with full 72-bit parallelism.
Max Clock Frequency 200 MHz per port, delivering up to 28.8 Gb/s aggregate bandwidth (200 MHz × 72-bit × 2 ports).
Core Voltage 1.5 V or 1.8 V VCORE, allowing direct integration with low-voltage FPGAs and ASICs while reducing dynamic power.
I/O Voltage Options Selectable LVTTL (3.3 V), Extended HSTL (1.4–1.9 V), 1.8 V LVCMOS, or 2.5 V LVCMOS per port-enabling mixed-voltage system interfacing.
Access Control Deterministic collision handling with BUSY flag assertion, first-busy address readback, and back-to-back cycle detection-no arbitration firmware required.
Package 484-ball PBGA (19 mm × 19 mm, 1.0 mm pitch), thermally optimized for high-speed signal integrity and industrial temperature operation (–40°C to +85°C).
Special Features Variable Impedance Matching (VIM) for trace-length-tolerant signal integrity; echo clocks (CQ0L/CQ1L, CQ0R/CQ1R) for source-synchronous timing margin improvement.

Pinout & Package

Package: 484-ball plastic BGA (PBGA), 19 mm × 19 mm, 1.0 mm ball pitch, RoHS-compliant. Pin layout follows FullFlex72 family specification (Document 38-06082 Rev. *J, Figure 1).

Pin/Terminal Circuit Role Design Meaning
A0L–A16L / A0R–A16R Address Inputs (Left/Right Port) 17-bit address bus per port; supports 128 K-word addressing (217 = 131,072 locations).
DQ[71:0]L / DQ[71:0]R Data I/O (72-bit bidirectional) Full 72-bit parallel data path per port; byte-enable granularity via BE[7:0]L/R allows 8×8-bit sub-word writes.
CE0L/CE1L / CE0R/CE1R Chip Enable Inputs Dual CE per port enables depth expansion without external logic; both must be active for valid access.
R/WL / R/WR Read/Write Direction Control Active-high write enable per port; determines data flow direction on DQ bus during clock cycle.
BUSYL / BUSYR Collision Detection Flag Asserted low when simultaneous access to same address occurs; used for hardware arbitration or interrupt triggering.
CNTINTL / CNTINTR Burst Counter Interrupt Signals counter wrap-around or max-count condition; enables automatic address reload via RETL/RETR or mirror register.
ZQ0L/ZQ1L / ZQ0R/ZQ1R Impedance Calibration Pads Connect to 240 Ω reference resistor for VIM calibration; unused balls (e.g., ZQ1L for CYD09S72V18) must be left unconnected.

Key Features

Feature Design Value
Deterministic Collision Resolution Hardware-enforced priority with BUSY flag, busy address readback, and no software arbitration overhead-ensures predictable latency in real-time systems.
Selectably Pipelined or Flow-Through Mode Configurable 1–3 cycle read latency per port; pipelined mode improves throughput in burst-heavy traffic; flow-through reduces latency for single-access patterns.
Mailbox with Interrupt Flags (INTL/INTR) Enables lock-free inter-processor messaging between ports; interrupt flags eliminate polling and reduce CPU load in multi-core or FPGA subsystems.
Variable Impedance Matching (VIM) On-die driver impedance tuning (30–60 Ω range) matched to PCB trace impedance-reduces signal reflections and eye closure at 200 MHz.
Echo Clocks (CQ0L/CQ1L, CQ0R/CQ1R) Source-synchronous clock copies output with minimal skew; simplifies timing closure for high-speed DDR-like capture on receiving logic.
JTAG Boundary Scan (IEEE 1149.1) Full 484-ball interconnect test coverage; supports production testing and in-system debug without additional test fixtures.

Applications

Telecom Packet Buffering FPGA Co-Processing Memory

Use Scenario: Storing and forwarding variable-length Ethernet/IP packets in line cards where ingress and egress paths require concurrent access to shared memory.

IC Role / Device Role / Timing Role: True dual-port SRAM acts as zero-latency shared buffer between MAC-layer and switching fabric logic, with deterministic collision handling preventing packet loss during bursts.

Use Value: 200 MHz SDR operation sustains >28 Gb/s aggregate throughput-matching 100 GbE line rates with 72-bit alignment-while VIM and echo clocks ensure signal integrity across 6+ inch traces.

Use Scenario: Offloading compute-intensive tasks (e.g., FFT, filtering) between two FPGA domains where one domain writes processed data and the other reads for display or transmission.

IC Role / Device Role / Timing Role: Acts as high-bandwidth, low-latency scratchpad memory with mailbox interrupts synchronizing task completion without polling or shared semaphores.

Use Value: Burst counters and retransmit (RETL/RETR) enable automatic sequential address generation-reducing control logic overhead by ~40% versus discrete address generators.

Industrial Motion Controller Avionics Data Recorder

Use Scenario: Real-time coordination between servo control loop (fast update) and supervisory PLC logic (slower monitoring), requiring synchronized access to position/velocity state variables.

IC Role / Device Role / Timing Role: Dual-port interface provides atomic read-modify-write capability across domains; deterministic BUSY flag ensures safe state updates without race conditions.

Use Value: Industrial temperature rating (–40°C to +85°C) and JTAG testability meet IEC 61508 SIL-3 requirements; 1.5 V core voltage lowers thermal load in sealed enclosures.

Use Scenario: Capturing high-fidelity sensor telemetry (e.g., inertial measurement unit streams) during flight, where recording and playback occur simultaneously without data gaps.

IC Role / Device Role / Timing Role: Functions as circular buffer memory with hardware wrap-around via burst counter and mirror register-eliminating software pointer management.

Use Value: Low-power 1.8 V I/O and 1.5 V core reduce standby current to <5 mA; MRST (asynchronous master reset) ensures deterministic recovery after brownout events.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CYD09S36V18-200BAXI Same density (9 Mbit) but 36-bit bus width (256 K × 36); uses 256-ball FBGA package; lacks ZQ pins and VIM support. Lower pin count and board area; suitable for cost-sensitive designs with narrower data paths and no need for impedance tuning. Select when system bandwidth demand is ≤14.4 Gb/s and PCB routing simplicity outweighs signal integrity optimization.
CYD18S72V18-200BBXI Double density (18 Mbit, 256 K × 72); identical 484-ball PBGA package, pin-compatible footprint, and feature set-including VIM, echo clocks, and mailbox. Provides 2× memory depth without redesign; ideal for future-proofing or scaling buffer size in existing layouts. Choose for seamless upgrade path where board space and thermal budget allow higher capacity without changing interface logic.

Compared with CYD09S36V18-200BAXI, CYD09S72V18-200BBXI delivers double the per-cycle bandwidth and advanced signal integrity features at the cost of larger package and higher pin count; versus CYD18S72V18-200BBXI, it offers identical interface flexibility at half the memory depth and lower power draw-making it optimal for latency-critical, bandwidth-constrained embedded systems.

Availability

CYD09S72V18-200BBXI is available at Aetrix Electronics and suitable for telecom packet buffering, FPGA co-processing memory, industrial motion control, and avionics data recorders requiring stable component supply, long-term lifecycle assurance, and industrial temperature compliance.

Supply support for CYD09S72V18-200BBXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for industrial, automotive, and communications infrastructure markets.

The FullFlex™ SDR Dual Port SRAM product line targets deterministic, high-bandwidth shared-memory architectures in FPGA-based systems, network processors, and real-time control platforms-emphasizing simultaneous access, signal integrity, and hardware-managed arbitration.

FAQ

What is the maximum supported data rate per port for CYD09S72V18-200BBXI?

The device supports up to 200 MHz clock frequency per port, enabling 200 million transfers per second on each 72-bit bus. With single data rate (SDR) operation, this yields 1.44 Gb/s per port (200 MHz × 72-bit) and 2.88 Gb/s aggregate for read+write on one port. Total bidirectional bandwidth across both ports reaches 28.8 Gb/s.

How does deterministic collision resolution work without external arbitration logic?

When both ports access the same memory address in the same clock cycle, the device asserts BUSYL and BUSYR low, outputs the conflicting address on the address bus, and latches the "first busy" address for readback. No external logic is needed-the resolution is fixed in silicon with guaranteed timing, and the CNTINTL/CNTINTR flags notify hosts to initiate recovery sequences.

Can CYD09S72V18-200BBXI operate with different I/O voltages on left and right ports?

Yes. Each port independently supports LVTTL (3.3 V), Extended HSTL (1.4–1.9 V), 1.8 V LVCMOS, or 2.5 V LVCMOS I/O standards. VDDIOL powers the left port I/Os; VDDIOR powers the right port I/Os; VTTL sets the threshold reference for LVTTL mode. This enables heterogeneous system interfacing-for example, connecting to a 1.8 V FPGA on one side and a 3.3 V microcontroller on the other.

Is the 484-ball PBGA package lead-free and RoHS compliant?

Yes. The CYD09S72V18-200BBXI is manufactured in a lead-free, RoHS-compliant 484-ball PBGA package (package code BBXI). It meets JEDEC J-STD-020 moisture sensitivity level 3 (MSL-3) and is qualified for reflow soldering per IPC/JEDEC J-STD-020D.1 specifications.

CYD09S72V18-200BBXI Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
256-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Dual Port, Synchronous
Memory Size:
9Mbit
Memory Organization:
128K x 72
Memory Interface:
Parallel
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.3 ns
Voltage - Supply:
1.42V ~ 1.58V, 1.7V ~ 1.9V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
256-FBGA (17x17)

CYD09S72V18-200BBXI FAQ

1.How can I place an order for CYD09S72V18-200BBXI through Aetrix?

Please submit a Request for Quotation (RFQ) for CYD09S72V18-200BBXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CYD09S72V18-200BBXI reliable?

The price and inventory of CYD09S72V18-200BBXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYD09S72V18-200BBXI is usually 5 days.

3.What payment methods are accepted for CYD09S72V18-200BBXI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYD09S72V18-200BBXI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CYD09S72V18-200BBXI?

CYD09S72V18-200BBXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CYD09S72V18-200BBXI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CYD09S72V18-200BBXI?

For technical support, including CYD09S72V18-200BBXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYD09S72V18-200BBXI requirements.

6.How does Aetrix verify that CYD09S72V18-200BBXI is sourced from the original manufacturer or authorized distributors?

All CYD09S72V18-200BBXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYD09S72V18-200BBXI meets industry standards.

7.What is the process for return or replacement of CYD09S72V18-200BBXI?

All CYD09S72V18-200BBXI units undergo pre-shipment inspection (PSI). If there is an issue with CYD09S72V18-200BBXI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CYD09S72V18-200BBXI part is unused and in its original packaging.

Return procedure for CYD09S72V18-200BBXI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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