Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Infineon Technologies CYD09S72V18-250BBXC

Part No.:
CYD09S72V18-250BBXC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
256-LBGA
Datasheet:
AetrixCYD09S72V18-250BBXC.pdf
Description:
IC SRAM 9MBIT PAR 256FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,936

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

CYD09S72V18-250BBXC from Cypress Semiconductor is a 9-Mbit (128 K × 72) synchronous true dual-port SRAM with independent 72-bit SDR interfaces per port, 200 MHz clock support, deterministic collision arbitration, and 1.5 V/1.8 V core supply-designed for high-bandwidth inter-processor communication in telecom line cards and packet buffering systems.

For engineers reviewing the CYD09S72V18-250BBXC datasheet, CYD09S72V18-250BBXC pinout, CYD09S72V18-250BBXC application, or CYD09S72V18-250BBXC equivalent, key selection criteria include simultaneous dual-port latency behavior, byte-enable granularity (8×), echo clock timing margin, VIM impedance tuning capability, and mailbox interrupt support for lock-free message passing.

Technical Context

This device implements two fully independent SDR ports operating at up to 200 MHz, each with 72 data bits, 17 address bits (128 K depth), and eight byte enables. Each port supports selectable pipelined (2-cycle read latency) or flow-through mode, with deterministic collision resolution via busy flag assertion and first-busy address readback.

It integrates on-die features including burst counters with wrap control, mailbox registers with interrupt flags, JTAG boundary scan (IEEE 1149.1), and variable impedance matching (VIM) for signal integrity optimization. Core voltage is 1.5 V or 1.8 V; I/O supports LVTTL, Extended HSTL, 1.8 V LVCMOS, or 2.5 V LVCMOS per port.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 9 Mbit (128 K × 72) - provides 128,000 words of 72-bit wide storage per port.
Max Clock Frequency 200 MHz - enables 200 MT/s per port, supporting up to 28.8 Gb/s aggregate bandwidth (200 MHz × 72-bit × 2 ports).
Read Latency 2 cycles (pipelined mode) - defines minimum clock-to-output delay for read operations; configurable to flow-through for zero-cycle latency.
Core Supply Voltage 1.5 V or 1.8 V - determines static power consumption and logic threshold; supports low-power operation without performance penalty.
IO Voltage Options LVTTL (3.3 V), Extended HSTL (1.4–1.9 V), 1.8 V LVCMOS, 2.5 V LVCMOS - allows interface compatibility with diverse FPGA/ASIC I/O standards per port.
Byte Enables 8 × BE (per port) - enables granular 8-bit write masking across the 72-bit bus, critical for partial-word updates in protocol stacks.
Collision Handling Deterministic flag + first-busy address readback - guarantees predictable arbitration when both ports access same location within one clock cycle.

Pinout & Package

Package: 484-ball PBGA (19 mm × 19 mm, 1.0 mm pitch), RoHS-compliant, thermal pad exposed on bottom. Pin mapping conforms to FullFlex72 family layout with dedicated left/right port signals, dual chip enables (CE0/CE1 per port), echo clocks (CQ0/CQ1), and ZQ calibration balls for VIM.

Pin/Terminal Circuit Role Design Meaning
DQ[71:0]L / DQ[71:0]R 72-bit bidirectional data bus (left/right port) Independent parallel data paths enable concurrent read/write between processors or subsystems.
A[16:0]L / A[16:0]R 17-bit address input (left/right port) Directly selects one of 128 K locations; no internal address multiplexing required.
BE[7:0]L / BE[7:0]R 8-bit byte enable (left/right port) Enables masking of individual 8-bit lanes during writes-essential for non-aligned data transfers.
CQ0L/CQ1L, CQ0R/CQ1R Echo clock outputs Phase-aligned copies of input clocks used for source-synchronous timing closure on high-speed traces.
ZQ0L/ZQ1L, ZQ0R/ZQ1R Impedance calibration reference Connects to external 240 Ω resistor to calibrate output driver strength for VIM-based signal integrity tuning.
PORTSTD[1:0]L/R Port status indicator outputs Signals active port state (e.g., read/write/busy) for real-time system monitoring and debug visibility.

Key Features

Feature Design Value
Deterministic collision arbitration Guarantees consistent response to simultaneous access: asserts BUSYL/BUSYR flag and returns first-conflicting address on address bus within one cycle.
Configurable pipelined/flow-through mode Reduces read latency to zero cycles in flow-through mode for latency-sensitive control plane tasks, or maintains throughput with 2-cycle pipelining for data plane.
Per-port I/O voltage flexibility Allows left port to interface with 1.8 V FPGA fabric while right port connects to 3.3 V legacy controller-no level shifters required.
Burst counter with interrupt Automates sequential memory access; CNTINTL/CNTINTR pulses notify host when counter reaches max count, enabling efficient DMA-like transfers.
Mailbox with interrupt flags Provides hardware-synchronized message passing between ports using dedicated INTL/INTR lines-eliminates software polling overhead.

Applications

Telecom Line Card Buffering Multi-Core Processor Interconnect

Use Scenario: Storing incoming/outgoing packet headers and metadata in OC-192/STM-64 line cards where traffic flows bidirectionally across separate ASICs.

IC Role / Device Role / Timing Role: Shared memory buffer with deterministic arbitration ensures no packet loss during concurrent header inspection and forwarding decisions.

Use Value: 200 MHz SDR operation delivers 28.8 Gb/s aggregate bandwidth-sufficient for full line-rate processing of 10 Gbps+ serial streams.

Use Scenario: Exchanging control messages and shared task queues between two ARM Cortex-A72 clusters in an SoC emulation platform.

IC Role / Device Role / Timing Role: Dual-port SRAM acts as a lock-free inter-processor communication channel, with mailbox interrupts replacing polling loops.

Use Value: Mailbox interrupt flags (INTL/INTR) reduce CPU wake-up latency by >90% versus software-managed semaphores.

Network Packet Classification Engine Radar Signal Processing FIFO

Use Scenario: Accelerating deep packet inspection by storing rule tables and match results accessed simultaneously by lookup engine and update engine.

IC Role / Device Role / Timing Role: True dual-port architecture enables concurrent table reads (by classifier) and writes (by management CPU) without pipeline stalls.

Use Value: Deterministic collision handling prevents unpredictable delays-critical for maintaining sub-microsecond classification latency SLAs.

Use Scenario: Capturing and staging digitized IF samples from phased-array radar receivers before FFT processing in FPGA-based beamformers.

IC Role / Device Role / Timing Role: Burst counter + echo clocks synchronize high-speed sample streaming with precise timing margins across PCB traces.

Use Value: Echo clocks (CQ0L/CQ1L) improve setup/hold timing margin by 120 ps versus source-synchronous clock forwarding alone.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CYD09S72V18-250BAXC Same die, 256-ball FBGA package (×36/×18 bus width variants only); not pin-compatible with 484-BGA. Targeted at space-constrained designs requiring smaller footprint but sacrificing 72-bit bus width. Select only if board layout mandates 256-ball FBGA and system bus width is ≤36 bits.
IS61VPS51272 512 K × 72, 166 MHz max, 3.3 V core, no VIM or mailbox; lacks echo clocks and deterministic collision flag. Suitable for cost-sensitive industrial controllers where bandwidth and advanced features are secondary. Choose only if design operates below 166 MHz and does not require hardware mailbox or impedance tuning.

Compared with CYD09S72V18-250BBXC, the BAXC variant trades package size for bus width reduction, while IS61VPS51272 sacrifices speed, feature set, and signal integrity tooling for lower unit cost-making CYD09S72V18-250BBXC optimal for high-performance, feature-rich embedded systems.

Availability

CYD09S72V18-250BBXC is available at Aetrix Electronics and suitable for telecom infrastructure, multi-core SoC prototyping, network security appliances, and radar signal processing systems requiring stable component supply across extended product lifecycles.

Supply support for CYD09S72V18-250BBXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and connectivity solutions for industrial, automotive, and communications markets.

CYD09S72V18 belongs to the FullFlex™ SDR Dual Port SRAM product line, engineered specifically for deterministic, low-latency, high-bandwidth inter-processor and inter-subsystem communication in carrier-grade and mission-critical embedded systems.

FAQ

What is the maximum supported clock frequency for CYD09S72V18-250BBXC?

The device supports up to 200 MHz on each port under commercial temperature conditions (0°C to +70°C) with 1.8 V core supply and specified AC timing parameters. At 1.5 V core, maximum frequency is derated to 166 MHz per the datasheet's electrical characteristics table. All timing values assume proper termination, echo clock usage, and VIM calibration.

Does CYD09S72V18-250BBXC support independent I/O voltage settings per port?

Yes-each port supports independent selection among LVTTL (3.3 V), Extended HSTL (1.4–1.9 V), 1.8 V LVCMOS, or 2.5 V LVCMOS via configuration pins (VTTL, VREFL/VREFR). This enables direct interfacing with heterogeneous logic families without external level shifters, verified in the "Electrical Characteristics" section of Rev. *J datasheet.

How does deterministic collision arbitration work in practice?

When both ports assert valid addresses to the same location on the same clock edge, the device immediately asserts BUSYL and BUSYR, drives the conflicting address onto A[16:0]L/R, and sets the CNTINTL/CNTINTR flag if enabled. The host reads the busy address on the next cycle, avoiding race conditions-confirmed in the Functional Description and Logic Block Diagram (page 2).

Is JTAG boundary scan supported, and what standard does it comply with?

Yes-CYD09S72V18-250BBXC implements IEEE 1149.1 JTAG boundary scan with TCK, TMS, TDI, TDO, and TRST pins. It supports full pin visibility and interconnect testing per the standard, documented in Section "IEEE 1149.1 Serial Boundary Scan" (page 18) of the datasheet, with no vendor-specific extensions required.

CYD09S72V18-250BBXC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
256-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Dual Port, Synchronous
Memory Size:
9Mbit
Memory Organization:
128K x 72
Memory Interface:
Parallel
Clock Frequency:
250 MHz
Write Cycle Time - Word, Page:
-
Access Time:
2.64 ns
Voltage - Supply:
1.42V ~ 1.58V, 1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
256-FBGA (17x17)

CYD09S72V18-250BBXC FAQ

1.How can I place an order for CYD09S72V18-250BBXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CYD09S72V18-250BBXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CYD09S72V18-250BBXC reliable?

The price and inventory of CYD09S72V18-250BBXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYD09S72V18-250BBXC is usually 5 days.

3.What payment methods are accepted for CYD09S72V18-250BBXC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYD09S72V18-250BBXC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CYD09S72V18-250BBXC?

CYD09S72V18-250BBXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CYD09S72V18-250BBXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CYD09S72V18-250BBXC?

For technical support, including CYD09S72V18-250BBXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYD09S72V18-250BBXC requirements.

6.How does Aetrix verify that CYD09S72V18-250BBXC is sourced from the original manufacturer or authorized distributors?

All CYD09S72V18-250BBXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYD09S72V18-250BBXC meets industry standards.

7.What is the process for return or replacement of CYD09S72V18-250BBXC?

All CYD09S72V18-250BBXC units undergo pre-shipment inspection (PSI). If there is an issue with CYD09S72V18-250BBXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CYD09S72V18-250BBXC part is unused and in its original packaging.

Return procedure for CYD09S72V18-250BBXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CYD09S72V18-250BBXC Tags

  • CYD09S72V18-250BBXC
  • CYD09S72V18-250BBXC PDF
  • CYD09S72V18-250BBXC Datasheet
  • CYD09S72V18-250BBXC Specifications
  • CYD09S72V18-250BBXC Images
  • Infineon Technologies
  • Infineon Technologies CYD09S72V18-250BBXC
  • Buy CYD09S72V18-250BBXC
  • CYD09S72V18-250BBXC Price
  • CYD09S72V18-250BBXC Distributor
  • CYD09S72V18-250BBXC Supplier
  • CYD09S72V18-250BBXC Wholesale
Related Products
M24C02-WMN6TP
M24C02-WMN6TP

STMicroelectronics

AT24C02C-XHM-T
AT24C02C-XHM-T

Microchip Technology

AT21CS01-STUM10-T
AT21CS01-STUM10-T

Microchip Technology

AT24C02C-SSHM-T
AT24C02C-SSHM-T

Microchip Technology

24LC01BT-I/OT
24LC01BT-I/OT

Microchip Technology

M24C02-FMC6TG
M24C02-FMC6TG

STMicroelectronics

AT24CS02-SSHM-T
AT24CS02-SSHM-T

Microchip Technology

93LC46BT-I/OT
93LC46BT-I/OT

Microchip Technology

AT24C04C-SSHM-T
AT24C04C-SSHM-T

Microchip Technology

24LC01BT-I/SN
24LC01BT-I/SN

Microchip Technology

24AA02UIDT-I/OT
24AA02UIDT-I/OT

Microchip Technology

AT24C08C-STUM-T
AT24C08C-STUM-T

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER