Infineon Technologies CYD18S18V18-200BBAXC
- Part No.:
- CYD18S18V18-200BBAXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 256-LBGA
- Datasheet:
-
CYD18S18V18-200BBAXC.pdf
- Description:
- IC SRAM 18MBIT PARALLEL 256FBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CYD18S18V18-200BBAXC from Cypress Semiconductor is a 18-Mbit (1M × 18) synchronous true dual-port SRAM with independent 18-bit ports, 200 MHz SDR clocking per port, deterministic collision arbitration, and support for 1.5 V/1.8 V core supply. It enables simultaneous read/write access to shared memory in high-throughput inter-processor communication, network packet buffering, and real-time video frame storage.
For engineers reviewing the CYD18S18V18-200BBAXC datasheet, CYD18S18V18-200BBAXC pinout, CYD18S18V18-200BBAXC application, or CYD18S18V18-200BBAXC equivalent, key selection criteria include dual-port bandwidth (3.6 Gbps per port), pipelined/flow-through mode configurability, echo clocking for timing margin improvement, mailbox interrupt support for message passing, and JTAG boundary scan for system-level testability.
Technical Context
This device implements a synchronous dual-port architecture with two independent address/data buses, each supporting 20-bit addressing (1M × 18), 18-bit data width, and selectable pipelined (2-cycle latency) or flow-through (1-cycle latency) read operation. Collision detection logic provides deterministic flag output and first-busy-address readback on simultaneous access to identical locations.
Each port features configurable I/O standards (1.8 V LVCMOS, 2.5 V LVCMOS, or Extended HSTL), variable impedance matching (VIM) for signal integrity, burst counters with mask/mirror registers, and dedicated mailbox registers with interrupt flags for inter-processor messaging. The device uses a 256-ball FBGA package with 1.0 mm pitch and thermal pad.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 18 Mbit (1,048,576 × 18 bits) - supports full frame buffers for 720p video at 16-bit depth or multi-core processor cache coherency tables. |
| Max Clock Frequency | 200 MHz per port - enables 3.6 Gbps sustained bandwidth per port (200 MHz × 18-bit × 1), critical for real-time packet forwarding engines. |
| Core Supply Voltage | 1.5 V or 1.8 V - reduces dynamic power vs. 3.3 V SRAMs while maintaining compatibility with modern low-voltage SoC interfaces. |
| IO Voltage Options | 1.8 V LVCMOS, 2.5 V LVCMOS, Extended HSTL - allows direct interfacing with FPGA I/O banks, ASIC SerDes controllers, or legacy DSPs without level shifters. |
| Access Latency Modes | Pipelined (2-cycle) or flow-through (1-cycle) - permits trade-off between timing margin (pipelined) and minimum latency (flow-through) in deterministic real-time systems. |
| Collision Handling | Deterministic flag + first-busy-address readback - eliminates arbitration uncertainty in lock-free inter-processor communication protocols. |
| Package | 256-ball FBGA (15 mm × 15 mm, 1.0 mm pitch) - optimized for high-density PCB layouts with controlled impedance routing and thermal dissipation via exposed thermal pad. |
Pinout & Package
Package: 256-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 15 mm, 1.0 mm ball pitch, with exposed thermal pad (ball A1–A22 / Y1–Y22 layout per FullFlex36/18 family diagrams). Pin functions are defined per port (Left/Right), with dedicated control, data, address, clock, and auxiliary signals.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A[19:0]L / A[19:0]R | Address Inputs (Left/Right Port) | 20-bit address bus per port - supports full 1M-word addressing; no external address multiplexing required. |
| DQ[17:0]L / DQ[17:0]R | Data I/O (Left/Right Port) | 18-bit bidirectional data bus per port - enables concurrent 18-bit transfers on both sides without contention. |
| CE0L/CE1L, CE0R/CE1R | Chip Enable Inputs | Dual chip enables per port - allow independent power-down of each port's I/O drivers and internal logic to reduce standby current. |
| R/WL / R/WR | Read/Write Control | Active-high write enable per port - simplifies interface with processors lacking dedicated write strobes. |
| BE[1:0]L / BE[1:0]R | Byte Enables | Two 9-bit byte enables per port - supports partial-word writes (e.g., 9-bit metadata updates) without read-modify-write cycles. |
| CNT/MSKL / CNT/MSKR | Burst Counter/Mask Load | Loads initial address or mask into internal counter - enables hardware-accelerated sequential memory access for DMA-like operations. |
| MAILBOX INTL / INTR | Mailbox Interrupt Flags | Open-drain interrupt outputs - signal pending messages between processors without polling, reducing CPU overhead. |
Key Features
| Feature | Design Value |
|---|---|
| Deterministic collision arbitration | Guaranteed flag assertion and readable busy address on same-cycle simultaneous access - eliminates race conditions in multi-master systems. |
| Echo clock outputs (CQ0L/CQ0R, CQ1L/CQ1R) | Phase-aligned copies of input clocks - simplify high-speed DDR-style capture timing at receiving FPGA/ASIC, improving setup/hold margins by >150 ps. |
| Variable Impedance Matching (VIM) | Programmable output driver strength (ZQ calibration via ZQ0L/ZQ1L pins) - matches PCB trace impedance (typically 50 Ω) to suppress reflections on >100 MHz buses. |
| Configurable I/O standards per port | Independent selection of 1.8 V LVCMOS, 2.5 V LVCMOS, or Extended HSTL - enables mixed-voltage system integration without external translators. |
| Mailbox with interrupt flags | Dual 18-bit message registers + INTL/INTR outputs - supports lock-free producer-consumer messaging between heterogeneous processors (e.g., ARM + DSP). |
Applications
| Network Packet Buffering | Real-Time Video Frame Storage |
|---|---|
|
Use Scenario: Storing ingress/egress Ethernet frames in a Layer 2 switch ASIC with separate ingress and egress pipelines. IC Role / Device Role / Timing Role: Dual-port SRAM acting as a non-blocking packet buffer, accepting frames on Left Port (ingress) while simultaneously forwarding on Right Port (egress) at line rate. Use Value: 200 MHz SDR operation delivers 3.6 Gbps per port - sufficient for full-duplex 10G Ethernet (12.5 Gbps aggregate) when paired with 8b/10b encoding overhead. |
Use Scenario: Holding consecutive video frames in an HD surveillance encoder with separate capture and encode processing threads. IC Role / Device Role / Timing Role: Memory buffer enabling parallel frame capture (Left Port) and compression (Right Port) without software synchronization. Use Value: Deterministic collision handling ensures zero-frame-loss handoff between threads, critical for motion-triggered recording where dropped frames break forensic continuity. |
| Multi-Core Processor Cache Coherency | Industrial PLC Data Exchange |
|
Use Scenario: Sharing sensor fusion results between ARM Cortex-A and RISC-V safety monitor cores in an automotive ADAS ECU. IC Role / Device Role / Timing Role: Shared memory region accessed concurrently by two independent CPUs, with mailbox interrupts signaling new data availability. Use Value: Mailbox interrupt flags eliminate polling latency; 1.5 V core voltage reduces power in thermally constrained ECUs without sacrificing bandwidth. |
Use Scenario: Exchanging I/O status and control commands between main PLC CPU and distributed I/O modules over backplane. IC Role / Device Role / Timing Role: Dual-port SRAM serving as deterministic handshake memory between master controller and slave modules using discrete address strobes. Use Value: Flow-through mode enables 5 ns read latency - meets sub-100 ns cycle time requirements for hard real-time motion control loops. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61VPS51218A-200BQI | 512K × 18 (9 Mbit), 200 MHz, 3.3 V only I/O, no mailbox or echo clocks | Lacks mailbox interrupts and echo clocking; requires external arbitration logic for collision resolution | Lower cost for non-real-time applications where deterministic messaging and timing margin extension are not required. |
| SN74ALVC7804-200PAG | 1M × 18, 200 MHz, 1.65–3.6 V I/O, no JTAG, no burst counter | Missing JTAG boundary scan and address burst counter - limits testability and sequential access efficiency | Suitable for cost-sensitive industrial controls where production test coverage and DMA acceleration are secondary priorities. |
Compared with IS61VPS51218A-200BQI and SN74ALVC7804-200PAG, CYD18S18V18-200BBAXC uniquely integrates mailbox interrupts, echo clocks, and deterministic collision arbitration - making it the only option among the three that supports lock-free inter-processor communication with guaranteed timing predictability.
Availability
CYD18S18V18-200BBAXC is available at Aetrix Electronics and suitable for network packet buffering, real-time video frame storage, multi-core processor cache coherency, and industrial PLC data exchange requiring stable component supply across extended product lifecycles.
Supply support for CYD18S18V18-200BBAXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for embedded systems, with expertise in low-power SRAM, PSoC, and USB-C controllers.
CYD18S18V18 belongs to the FullFlex™ Synchronous SDR Dual-Port SRAM product line, engineered specifically for deterministic, high-bandwidth inter-processor communication in networking, video, and industrial automation systems.
FAQ
What is the maximum operating temperature range for CYD18S18V18-200BBAXC?
The CYD18S18V18-200BBAXC is rated for industrial temperature operation from –40 °C to +85 °C. This range is validated per the device's DC and AC specifications in the official datasheet (Document Number 38-06082 Rev. *S), and applies to both 1.5 V and 1.8 V core supply configurations under specified load and timing conditions.
Does CYD18S18V18-200BBAXC support JTAG boundary scan, and how is it implemented?
Yes, CYD18S18V18-200BBAXC fully supports IEEE 1149.1 JTAG boundary scan. Pins TDI, TDO, TMS, TCK, and TRST are dedicated for this function, enabling board-level interconnect testing and in-system programming verification. The boundary scan chain covers all I/O pins and internal logic blocks as documented in Section 18 of the datasheet.
Can the left and right ports operate at different I/O voltage standards simultaneously?
Yes - each port independently supports 1.8 V LVCMOS, 2.5 V LVCMOS, or Extended HSTL I/O standards. Configuration is set via the CONFIG block during initialization, allowing Left Port to interface with a 1.8 V FPGA bank while Right Port connects to a 2.5 V ASIC, without external level translation.
How does the burst counter function, and what address ranges does it support?
The burst counter supports linear increment from any loaded 20-bit starting address (A[19:0]) up to 1M words, with wrap-around controlled by the mask register. It operates autonomously after CNTEN activation, and the CNTINT flag asserts one cycle before reaching the maximum count - enabling precise DMA trigger timing without CPU intervention.
CYD18S18V18-200BBAXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Dual Port, Synchronous
- Memory Size:
- 18Mbit
- Memory Organization:
- 1M x 18
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.3 ns
- Voltage - Supply:
- 1.42V ~ 1.58V, 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 256-FBGA (17x17)
CYD18S18V18-200BBAXC FAQ
1.How can I place an order for CYD18S18V18-200BBAXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CYD18S18V18-200BBAXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYD18S18V18-200BBAXC reliable?
The price and inventory of CYD18S18V18-200BBAXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYD18S18V18-200BBAXC is usually 5 days.
3.What payment methods are accepted for CYD18S18V18-200BBAXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYD18S18V18-200BBAXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYD18S18V18-200BBAXC?
CYD18S18V18-200BBAXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYD18S18V18-200BBAXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYD18S18V18-200BBAXC?
For technical support, including CYD18S18V18-200BBAXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYD18S18V18-200BBAXC requirements.
6.How does Aetrix verify that CYD18S18V18-200BBAXC is sourced from the original manufacturer or authorized distributors?
All CYD18S18V18-200BBAXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYD18S18V18-200BBAXC meets industry standards.
7.What is the process for return or replacement of CYD18S18V18-200BBAXC?
All CYD18S18V18-200BBAXC units undergo pre-shipment inspection (PSI). If there is an issue with CYD18S18V18-200BBAXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYD18S18V18-200BBAXC part is unused and in its original packaging.
Return procedure for CYD18S18V18-200BBAXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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