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Infineon Technologies CYD18S18V18-200BBAXC

Part No.:
CYD18S18V18-200BBAXC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
256-LBGA
Datasheet:
AetrixCYD18S18V18-200BBAXC.pdf
Description:
IC SRAM 18MBIT PARALLEL 256FBGA
Quantity:
Payment:
Payment
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Inventory:3,268

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Product details

Overview

CYD18S18V18-200BBAXC from Cypress Semiconductor is a 18-Mbit (1M × 18) synchronous true dual-port SRAM with independent 18-bit ports, 200 MHz SDR clocking per port, deterministic collision arbitration, and support for 1.5 V/1.8 V core supply. It enables simultaneous read/write access to shared memory in high-throughput inter-processor communication, network packet buffering, and real-time video frame storage.

For engineers reviewing the CYD18S18V18-200BBAXC datasheet, CYD18S18V18-200BBAXC pinout, CYD18S18V18-200BBAXC application, or CYD18S18V18-200BBAXC equivalent, key selection criteria include dual-port bandwidth (3.6 Gbps per port), pipelined/flow-through mode configurability, echo clocking for timing margin improvement, mailbox interrupt support for message passing, and JTAG boundary scan for system-level testability.

Technical Context

This device implements a synchronous dual-port architecture with two independent address/data buses, each supporting 20-bit addressing (1M × 18), 18-bit data width, and selectable pipelined (2-cycle latency) or flow-through (1-cycle latency) read operation. Collision detection logic provides deterministic flag output and first-busy-address readback on simultaneous access to identical locations.

Each port features configurable I/O standards (1.8 V LVCMOS, 2.5 V LVCMOS, or Extended HSTL), variable impedance matching (VIM) for signal integrity, burst counters with mask/mirror registers, and dedicated mailbox registers with interrupt flags for inter-processor messaging. The device uses a 256-ball FBGA package with 1.0 mm pitch and thermal pad.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 18 Mbit (1,048,576 × 18 bits) - supports full frame buffers for 720p video at 16-bit depth or multi-core processor cache coherency tables.
Max Clock Frequency 200 MHz per port - enables 3.6 Gbps sustained bandwidth per port (200 MHz × 18-bit × 1), critical for real-time packet forwarding engines.
Core Supply Voltage 1.5 V or 1.8 V - reduces dynamic power vs. 3.3 V SRAMs while maintaining compatibility with modern low-voltage SoC interfaces.
IO Voltage Options 1.8 V LVCMOS, 2.5 V LVCMOS, Extended HSTL - allows direct interfacing with FPGA I/O banks, ASIC SerDes controllers, or legacy DSPs without level shifters.
Access Latency Modes Pipelined (2-cycle) or flow-through (1-cycle) - permits trade-off between timing margin (pipelined) and minimum latency (flow-through) in deterministic real-time systems.
Collision Handling Deterministic flag + first-busy-address readback - eliminates arbitration uncertainty in lock-free inter-processor communication protocols.
Package 256-ball FBGA (15 mm × 15 mm, 1.0 mm pitch) - optimized for high-density PCB layouts with controlled impedance routing and thermal dissipation via exposed thermal pad.

Pinout & Package

Package: 256-ball Fine-Pitch Ball Grid Array (FBGA), 15 mm × 15 mm, 1.0 mm ball pitch, with exposed thermal pad (ball A1–A22 / Y1–Y22 layout per FullFlex36/18 family diagrams). Pin functions are defined per port (Left/Right), with dedicated control, data, address, clock, and auxiliary signals.

Pin/Terminal Circuit Role Design Meaning
A[19:0]L / A[19:0]R Address Inputs (Left/Right Port) 20-bit address bus per port - supports full 1M-word addressing; no external address multiplexing required.
DQ[17:0]L / DQ[17:0]R Data I/O (Left/Right Port) 18-bit bidirectional data bus per port - enables concurrent 18-bit transfers on both sides without contention.
CE0L/CE1L, CE0R/CE1R Chip Enable Inputs Dual chip enables per port - allow independent power-down of each port's I/O drivers and internal logic to reduce standby current.
R/WL / R/WR Read/Write Control Active-high write enable per port - simplifies interface with processors lacking dedicated write strobes.
BE[1:0]L / BE[1:0]R Byte Enables Two 9-bit byte enables per port - supports partial-word writes (e.g., 9-bit metadata updates) without read-modify-write cycles.
CNT/MSKL / CNT/MSKR Burst Counter/Mask Load Loads initial address or mask into internal counter - enables hardware-accelerated sequential memory access for DMA-like operations.
MAILBOX INTL / INTR Mailbox Interrupt Flags Open-drain interrupt outputs - signal pending messages between processors without polling, reducing CPU overhead.

Key Features

Feature Design Value
Deterministic collision arbitration Guaranteed flag assertion and readable busy address on same-cycle simultaneous access - eliminates race conditions in multi-master systems.
Echo clock outputs (CQ0L/CQ0R, CQ1L/CQ1R) Phase-aligned copies of input clocks - simplify high-speed DDR-style capture timing at receiving FPGA/ASIC, improving setup/hold margins by >150 ps.
Variable Impedance Matching (VIM) Programmable output driver strength (ZQ calibration via ZQ0L/ZQ1L pins) - matches PCB trace impedance (typically 50 Ω) to suppress reflections on >100 MHz buses.
Configurable I/O standards per port Independent selection of 1.8 V LVCMOS, 2.5 V LVCMOS, or Extended HSTL - enables mixed-voltage system integration without external translators.
Mailbox with interrupt flags Dual 18-bit message registers + INTL/INTR outputs - supports lock-free producer-consumer messaging between heterogeneous processors (e.g., ARM + DSP).

Applications

Network Packet Buffering Real-Time Video Frame Storage

Use Scenario: Storing ingress/egress Ethernet frames in a Layer 2 switch ASIC with separate ingress and egress pipelines.

IC Role / Device Role / Timing Role: Dual-port SRAM acting as a non-blocking packet buffer, accepting frames on Left Port (ingress) while simultaneously forwarding on Right Port (egress) at line rate.

Use Value: 200 MHz SDR operation delivers 3.6 Gbps per port - sufficient for full-duplex 10G Ethernet (12.5 Gbps aggregate) when paired with 8b/10b encoding overhead.

Use Scenario: Holding consecutive video frames in an HD surveillance encoder with separate capture and encode processing threads.

IC Role / Device Role / Timing Role: Memory buffer enabling parallel frame capture (Left Port) and compression (Right Port) without software synchronization.

Use Value: Deterministic collision handling ensures zero-frame-loss handoff between threads, critical for motion-triggered recording where dropped frames break forensic continuity.

Multi-Core Processor Cache Coherency Industrial PLC Data Exchange

Use Scenario: Sharing sensor fusion results between ARM Cortex-A and RISC-V safety monitor cores in an automotive ADAS ECU.

IC Role / Device Role / Timing Role: Shared memory region accessed concurrently by two independent CPUs, with mailbox interrupts signaling new data availability.

Use Value: Mailbox interrupt flags eliminate polling latency; 1.5 V core voltage reduces power in thermally constrained ECUs without sacrificing bandwidth.

Use Scenario: Exchanging I/O status and control commands between main PLC CPU and distributed I/O modules over backplane.

IC Role / Device Role / Timing Role: Dual-port SRAM serving as deterministic handshake memory between master controller and slave modules using discrete address strobes.

Use Value: Flow-through mode enables 5 ns read latency - meets sub-100 ns cycle time requirements for hard real-time motion control loops.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
IS61VPS51218A-200BQI 512K × 18 (9 Mbit), 200 MHz, 3.3 V only I/O, no mailbox or echo clocks Lacks mailbox interrupts and echo clocking; requires external arbitration logic for collision resolution Lower cost for non-real-time applications where deterministic messaging and timing margin extension are not required.
SN74ALVC7804-200PAG 1M × 18, 200 MHz, 1.65–3.6 V I/O, no JTAG, no burst counter Missing JTAG boundary scan and address burst counter - limits testability and sequential access efficiency Suitable for cost-sensitive industrial controls where production test coverage and DMA acceleration are secondary priorities.

Compared with IS61VPS51218A-200BQI and SN74ALVC7804-200PAG, CYD18S18V18-200BBAXC uniquely integrates mailbox interrupts, echo clocks, and deterministic collision arbitration - making it the only option among the three that supports lock-free inter-processor communication with guaranteed timing predictability.

Availability

CYD18S18V18-200BBAXC is available at Aetrix Electronics and suitable for network packet buffering, real-time video frame storage, multi-core processor cache coherency, and industrial PLC data exchange requiring stable component supply across extended product lifecycles.

Supply support for CYD18S18V18-200BBAXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for embedded systems, with expertise in low-power SRAM, PSoC, and USB-C controllers.

CYD18S18V18 belongs to the FullFlex™ Synchronous SDR Dual-Port SRAM product line, engineered specifically for deterministic, high-bandwidth inter-processor communication in networking, video, and industrial automation systems.

FAQ

What is the maximum operating temperature range for CYD18S18V18-200BBAXC?

The CYD18S18V18-200BBAXC is rated for industrial temperature operation from –40 °C to +85 °C. This range is validated per the device's DC and AC specifications in the official datasheet (Document Number 38-06082 Rev. *S), and applies to both 1.5 V and 1.8 V core supply configurations under specified load and timing conditions.

Does CYD18S18V18-200BBAXC support JTAG boundary scan, and how is it implemented?

Yes, CYD18S18V18-200BBAXC fully supports IEEE 1149.1 JTAG boundary scan. Pins TDI, TDO, TMS, TCK, and TRST are dedicated for this function, enabling board-level interconnect testing and in-system programming verification. The boundary scan chain covers all I/O pins and internal logic blocks as documented in Section 18 of the datasheet.

Can the left and right ports operate at different I/O voltage standards simultaneously?

Yes - each port independently supports 1.8 V LVCMOS, 2.5 V LVCMOS, or Extended HSTL I/O standards. Configuration is set via the CONFIG block during initialization, allowing Left Port to interface with a 1.8 V FPGA bank while Right Port connects to a 2.5 V ASIC, without external level translation.

How does the burst counter function, and what address ranges does it support?

The burst counter supports linear increment from any loaded 20-bit starting address (A[19:0]) up to 1M words, with wrap-around controlled by the mask register. It operates autonomously after CNTEN activation, and the CNTINT flag asserts one cycle before reaching the maximum count - enabling precise DMA trigger timing without CPU intervention.

CYD18S18V18-200BBAXC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
256-LBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Dual Port, Synchronous
Memory Size:
18Mbit
Memory Organization:
1M x 18
Memory Interface:
Parallel
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.3 ns
Voltage - Supply:
1.42V ~ 1.58V, 1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
256-FBGA (17x17)

CYD18S18V18-200BBAXC FAQ

1.How can I place an order for CYD18S18V18-200BBAXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CYD18S18V18-200BBAXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CYD18S18V18-200BBAXC reliable?

The price and inventory of CYD18S18V18-200BBAXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYD18S18V18-200BBAXC is usually 5 days.

3.What payment methods are accepted for CYD18S18V18-200BBAXC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYD18S18V18-200BBAXC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CYD18S18V18-200BBAXC?

CYD18S18V18-200BBAXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CYD18S18V18-200BBAXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CYD18S18V18-200BBAXC?

For technical support, including CYD18S18V18-200BBAXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYD18S18V18-200BBAXC requirements.

6.How does Aetrix verify that CYD18S18V18-200BBAXC is sourced from the original manufacturer or authorized distributors?

All CYD18S18V18-200BBAXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYD18S18V18-200BBAXC meets industry standards.

7.What is the process for return or replacement of CYD18S18V18-200BBAXC?

All CYD18S18V18-200BBAXC units undergo pre-shipment inspection (PSI). If there is an issue with CYD18S18V18-200BBAXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CYD18S18V18-200BBAXC part is unused and in its original packaging.

Return procedure for CYD18S18V18-200BBAXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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