Infineon Technologies CYD18S36V18-167BBAI
- Part No.:
- CYD18S36V18-167BBAI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 256-LBGA
- Datasheet:
-
CYD18S36V18-167BBAI.pdf
- Description:
- IC SRAM 18MBIT PAR 256FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,230
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CYD18S36V18-167BBAI from Cypress Semiconductor is a 18-Mbit (512K × 36) synchronous true dual-port SRAM with independent 36-bit ports, 1.5 V/1.8 V core supply, and SDR operation at up to 200 MHz. It enables deterministic concurrent read/write access to shared memory in high-throughput inter-processor communication, network packet buffering, and real-time video frame storage.
For engineers reviewing the CYD18S36V18-167BBAI datasheet, CYD18S36V18-167BBAI pinout, CYD18S36V18-167BBAI application, or CYD18S36V18-167BBAI equivalent, key selection criteria include dual-port collision handling, selectable pipelined/flow-through latency, per-port I/O voltage flexibility (1.4–2.5 V), echo clocking for timing margin, and JTAG boundary scan for system-level testability.
Technical Context
This device implements two fully independent synchronous ports-each with its own address bus, data bus (36-bit), byte enables (4 per port), control signals (CE0/CE1, R/W, OEN), and clock domain-enabling simultaneous access without arbitration overhead. Deterministic access control resolves same-address contention via busy flag assertion and first-busy address readback within one cycle.
Each port supports configurable pipelined mode (two-stage latency) or flow-through mode (zero-cycle latency), with programmable burst counters, mailbox interrupts, and echo clocks synchronized to output data edges. Variable impedance matching (VIM) on DQ pins allows dynamic driver strength tuning to match PCB trace impedance.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 18 Mbit (512K × 36 bits), enabling compact buffer storage for multi-channel data streams |
| Max Clock Frequency | 200 MHz SDR per port, delivering up to 14.4 Gbps aggregate bandwidth (200 MHz × 36-bit × 2 ports) |
| Core Supply Voltage | 1.5 V or 1.8 V, reducing dynamic power vs. 3.3 V SRAMs while maintaining timing margins |
| I/O Voltage Range | Selectable per port: LVTTL (3.3 V), Extended HSTL (1.4–1.9 V), 1.8 V/2.5 V LVCMOS, supporting mixed-voltage system integration |
| Access Control | Deterministic collision resolution with BUSY flag, first-busy address readback, and back-to-back cycle detection |
| Package | 256-ball FBGA (17 mm × 17 mm, 1.0 mm pitch), optimized for high-density routing and thermal dissipation |
| Temperature Range | Industrial grade (–40 °C to +85 °C), qualified for embedded control and telecom infrastructure |
Pinout & Package
256-ball Fine-Pitch BGA (FBGA), 17 mm × 17 mm, 1.0 mm ball pitch, RoHS-compliant. Pinout conforms to FullFlex36 family layout with dedicated left/right port signal groups, dual chip enables, echo clocks (CQ0/CQ1), and ZQ calibration balls for VIM.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0L–A18L / A0R–A18R | Left/Right port address inputs | 19-bit addressing per port (512K depth); A18L/R unconnected per density specification |
| DQ0L–DQ35L / DQ0R–DQ35R | Left/Right port bidirectional data | 36-bit parallel data path per port; supports byte-wise write masking via BE[3:0] |
| CE0L/CE1L / CE0R/CE1R | Left/Right port chip enable pairs | Dual CE per port enables depth expansion and low-power gating of internal logic |
| R/WL / R/WR | Left/Right port read/write control | Active-high synchronous write enable; determines direction of data transfer on each clock edge |
| CQ0L/CQ1L / CQ0R/CQ1R | Left/Right port echo clocks | Output-only clocks phase-aligned to DQ valid windows, easing high-speed capture at receiving end |
| ZQ0L/ZQ1L / ZQ0R/ZQ1R | Impedance calibration reference | Connect to 240 Ω ±1% resistor to ground for VIM calibration; ZQ1 unused in 18-Mbit devices |
| PORTSTD0L/1L / PORTSTD0R/1R | I/O standard configuration | Per-port 2-bit encoding selects LVTTL, HSTL, or LVCMOS I/O voltage and drive strength |
| BUSYL / BUSYR | Collision status flag | Asserted low when simultaneous access to same address occurs; used for handshake or stall control |
Key Features
| Feature | Design Value |
|---|---|
| Deterministic collision management | Guaranteed BUSY assertion and first-busy address readback within one clock cycle, eliminating arbitration uncertainty |
| Selectable latency mode | Pipelined (2-cycle read latency) or flow-through (0-cycle read latency) per port, enabling trade-off between throughput and timing closure |
| Per-port I/O voltage independence | Each port configures I/O standard separately-e.g., left port at 1.8 V LVCMOS, right port at 2.5 V LVCMOS-for seamless interface bridging |
| Burst counter with interrupt | Hardware address incrementer with CNTINT flag notifies host when max count reached, enabling zero-overhead sequential access |
| Mailbox with interrupt flags | Dedicated memory region with INTR signaling supports lock-free inter-processor messaging without polling overhead |
Applications
| Telecom Packet Buffering | Real-Time Video Frame Store |
|---|---|
Use Scenario: Storing incoming/outgoing Ethernet or SONET frames in line cards where ingress and egress processors access same buffer concurrently. IC Role / Device Role / Timing Role: Dual-port SRAM acts as shared FIFO with deterministic collision resolution, synchronizing traffic between MAC and switch fabric controllers. Use Value: Eliminates external arbitration logic and guarantees bounded latency for frame forwarding under full load. | Use Scenario: Holding uncompressed YUV422 frames during encode/decode pipeline handoff in broadcast encoders or medical imaging systems. IC Role / Device Role / Timing Role: Provides simultaneous read (encoder input) and write (decoder output) access to frame buffers with precise pixel-clock alignment. Use Value: Enables zero-latency frame swapping and eliminates frame drop during rapid scene transitions. |
| Multi-Core Processor Interconnect | Industrial Motion Controller Shared Memory |
Use Scenario: Serving as coherent shared memory between two ARM Cortex-R5 cores executing safety-critical tasks in automotive ADAS ECUs. IC Role / Device Role / Timing Role: Acts as lock-free message-passing buffer with mailbox interrupts, replacing software-managed queues and reducing CPU overhead. Use Value: Reduces inter-core communication latency by >60% versus DDR-based shared memory, improving real-time determinism. | Use Scenario: Coordinating position setpoints and feedback data between FPGA-based servo axis controllers and ARM-based motion planner in CNC machines. IC Role / Device Role / Timing Role: Provides deterministic, low-jitter memory access for time-critical trajectory updates and encoder sampling synchronization. Use Value: Ensures sub-microsecond timing consistency across axes, critical for contour accuracy in high-speed machining. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CYD18S36V18-167BAC | Same die, commercial temperature range (0 °C to +70 °C) and different FBGA marking; identical electrical specs and pinout | Suitable for non-industrial environments where extended temperature is not required | Select when cost sensitivity outweighs industrial qualification needs |
| IS61VPS51236A-167BQI | 18-Mbit dual-port SRAM with 200 MHz SDR, but lacks echo clocks, VIM, mailbox, and JTAG; uses 256-pin TQFP package | Limited to simpler systems without advanced timing margin or debug requirements | Choose only if legacy board space accommodates TQFP and advanced features are unnecessary |
Compared with CYD18S36V18-167BBAI, the BAC variant offers identical performance at lower cost for commercial use, while the IS61VPS51236A lacks echo clocks and mailbox-critical for high-speed inter-processor sync and interrupt-driven messaging in modern embedded designs.
Availability
CYD18S36V18-167BBAI is available at Aetrix Electronics and suitable for telecom infrastructure, real-time video processing, multi-core processor interconnect, and industrial motion control requiring stable component supply across long production lifecycles.
Supply support for CYD18S36V18-167BBAI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for embedded systems, emphasizing reliability, low power, and system-level integration.
CYD18S36V18 belongs to the FullFlex36 family of synchronous dual-port SRAMs, engineered specifically for deterministic, high-bandwidth inter-processor communication in networking, video, and industrial automation systems.
FAQ
What is the maximum supported I/O voltage per port?
CYD18S36V18-167BBAI supports four selectable I/O standards per port: LVTTL (3.3 V), Extended HSTL (1.4–1.9 V), 1.8 V LVCMOS, and 2.5 V LVCMOS. Selection is controlled by PORTSTD[1:0] pins, and each port may be configured independently. HSTL support was removed after WW1830 per datasheet revision *S, but all other standards remain fully functional.
How does deterministic access control resolve simultaneous accesses?
When both ports attempt to access the same memory location on the same clock edge, the device asserts BUSYL or BUSYR (depending on port priority), outputs the colliding address on the address bus, and sets the first-busy address register. The collision is detected on back-to-back cycles, and no data corruption occurs-the winning port completes its access while the losing port receives a busy response, enabling predictable software recovery.
Can the burst counter operate across both ports simultaneously?
No-the burst counter is implemented per port and operates independently. Each port has its own CNT/MSKL/R, CNTENL/R, CNTRSTL/R, and CNTINTR signals. Counters cannot be linked or synchronized across ports; however, mailbox interrupts allow coordinated triggering of counter reloads or resets via inter-port messaging.
Is JTAG boundary scan supported in all operating modes?
Yes-IEEE 1149.1 JTAG boundary scan remains fully functional regardless of pipelined/flow-through mode, I/O voltage selection, or echo clock enable state. TRST, TMS, TDI, TDO, and TCK pins retain their boundary-scan functionality during active memory operation, enabling in-system test and debug without halting system clocks.
CYD18S36V18-167BBAI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 256-LBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Dual Port, Synchronous
- Memory Size:
- 18Mbit
- Memory Organization:
- 512K x 36
- Memory Interface:
- Parallel
- Clock Frequency:
- 167 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 4 ns
- Voltage - Supply:
- 1.42V ~ 1.58V, 1.7V ~ 1.9V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 256-FBGA (17x17)
CYD18S36V18-167BBAI FAQ
1.How can I place an order for CYD18S36V18-167BBAI through Aetrix?
Please submit a Request for Quotation (RFQ) for CYD18S36V18-167BBAI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYD18S36V18-167BBAI reliable?
The price and inventory of CYD18S36V18-167BBAI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYD18S36V18-167BBAI is usually 5 days.
3.What payment methods are accepted for CYD18S36V18-167BBAI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYD18S36V18-167BBAI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYD18S36V18-167BBAI?
CYD18S36V18-167BBAI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYD18S36V18-167BBAI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYD18S36V18-167BBAI?
For technical support, including CYD18S36V18-167BBAI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYD18S36V18-167BBAI requirements.
6.How does Aetrix verify that CYD18S36V18-167BBAI is sourced from the original manufacturer or authorized distributors?
All CYD18S36V18-167BBAI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYD18S36V18-167BBAI meets industry standards.
7.What is the process for return or replacement of CYD18S36V18-167BBAI?
All CYD18S36V18-167BBAI units undergo pre-shipment inspection (PSI). If there is an issue with CYD18S36V18-167BBAI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYD18S36V18-167BBAI part is unused and in its original packaging.
Return procedure for CYD18S36V18-167BBAI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CYD18S36V18-167BBAI Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

