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Infineon Technologies CYD18S72V18-167BGI

Part No.:
CYD18S72V18-167BGI
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
484-FBGA
Datasheet:
AetrixCYD18S72V18-167BGI.pdf
Description:
IC SRAM 18MBIT PAR 484PBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,912

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Product details

Overview

CYD18S72V18-167BGI from Cypress Semiconductor is a 18-Mbit (256K × 72) synchronous true dual-port SRAM with independent 72-bit ports, 1.5 V/1.8 V core supply, and SDR operation at 200 MHz. It supports pipelined or flow-through read latency modes, deterministic collision resolution, and dual chip enables for depth expansion in high-bandwidth inter-processor communication systems.

For engineers reviewing the CYD18S72V18-167BGI datasheet, CYD18S72V18-167BGI pinout, CYD18S72V18-167BGI application, or CYD18S72V18-167BGI equivalent, key selection criteria include simultaneous dual-port bandwidth (28.8 Gbps), JTAG boundary scan support, echo clocking for timing margin improvement, and configurable I/O standards including 1.8 V LVCMOS and Extended HSTL.

Technical Context

This device implements a synchronous dual-port architecture with two independent 72-bit data buses, each supporting single-cycle pipelined reads at 200 MHz and configurable burst counters for sequential access. Deterministic collision detection outputs a busy flag and enables first-busy address readback on back-to-back accesses to identical addresses.

Each port features selectable I/O standards (1.8 V LVCMOS, 2.5 V LVCMOS, LVTTL, or Extended HSTL), variable impedance matching (VIM) for signal integrity, and echo clocks synchronized to output data edges. The 484-ball PBGA package supports full 72-bit bus width per port with eight byte enables (BE[7:0]) and dedicated mailbox interrupt flags for inter-processor messaging.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 18 Mbit (256K × 72 bits), enabling 256K words of parallel 72-bit data storage per port
Max Clock Frequency 200 MHz SDR - delivers up to 28.8 Gbps aggregate bandwidth (200 MHz × 72-bit × 2 ports)
Core Supply Voltage 1.5 V or 1.8 V - low-voltage operation reduces dynamic power and thermal load in dense PCB layouts
I/O Voltage Options Selectable 1.8 V LVCMOS, 2.5 V LVCMOS, LVTTL (3.3 V), or Extended HSTL - supports mixed-voltage system interfacing
Access Control Deterministic collision handling with BUSY flag assertion and first-busy address readback on simultaneous same-address access
Package 484-ball PBGA (27 mm × 27 mm, 1.0 mm pitch) - matches industry-standard footprint for high-pin-count memory devices
Temperature Range –40 °C to +85 °C (Industrial grade) - qualified for extended-temperature embedded and networking equipment

Pinout & Package

Package: 484-ball plastic BGA (PBGA), 27 mm × 27 mm, 1.0 mm ball pitch, top-side marking includes "CYD18S72V18-167BGI" and date code.

Pin/Terminal Circuit Role Design Meaning
DQ[71:0]L / DQ[71:0]R Left/Right Port Data Bus 72-bit bidirectional data lines per port; supports byte-wise masking via BE[7:0]L/R
A[17:0]L / A[17:0]R Left/Right Port Address Bus 18-bit address inputs (256K depth); A16/A17 marked [9]/[8] - unconnected for CYD18S72V18 per datasheet note
CE0L/CE1L, CE0R/CE1R Chip Enable Inputs Dual CE per port enables depth expansion without external logic; both must be active for valid access
R/WL / R/WR Read/Write Control Active-high control for write enable; read occurs when R/W = high and OEL/OER asserted
OEL / OER Output Enable Separate output enables per port allow independent tri-state control of data bus drivers
CNT/MSKL / CNT/MSKR Burst Counter/Mask Load Loads initial address or mask value into internal counter/mirror register for sequential access control
CNTINTL / CNTINTR Counter Interrupt Flag Asserted one cycle before counter reaches max count; used for automatic burst termination or wrap notification
PORTSTD[1:0]L/R I/O Standard Selection Configures per-port I/O voltage standard (e.g., 00 = 1.8 V LVCMOS, 11 = LVTTL) at power-up

Key Features

Feature Design Value
Deterministic collision resolution Guaranteed BUSY flag assertion and first-busy address readback within one clock cycle of simultaneous same-address access
Echo clock outputs (CQ0L/CQ1L, CQ0R/CQ1R) Phase-aligned clock copies synchronized to data output edges - simplifies high-speed PCB layout and timing closure
Variable impedance matching (ZQ0L/ZQ1L, ZQ0R/ZQ1R) On-die termination calibration against external reference resistor - eliminates need for discrete series resistors on data lines
Mailbox with interrupt flags (INTL/INTR) Dedicated shared memory region with hardware-set interrupt flags - enables lock-free inter-processor message passing
IEEE 1149.1 JTAG boundary scan Fully compliant test access port supporting chain testing of SRAM I/Os and interconnects in assembled systems

Applications

Telecom Line Card Buffering Network Processor Interfacing

Use Scenario: High-speed packet buffering between line interface ASICs and network processors in 10G/25G Ethernet switches.

IC Role / Device Role / Timing Role: Dual-port SRAM acts as asynchronous FIFO bridge, absorbing timing skew between independent clock domains (e.g., 156.25 MHz SerDes vs. 200 MHz NPU bus).

Use Value: 28.8 Gbps aggregate bandwidth sustains full line-rate packet buffering; echo clocks reduce setup/hold margin requirements by >150 ps.

Use Scenario: Shared instruction/data memory between dual-core network processors executing parallel packet classification and forwarding tasks.

IC Role / Device Role / Timing Role: True dual-port memory enables concurrent read/write operations without arbitration delay - critical for real-time packet header parsing and table lookup.

Use Value: Deterministic collision handling ensures predictable worst-case latency (<2 cycles) during simultaneous access to shared lookup tables.

Avionics Data Concentrator Industrial PLC Redundancy Module

Use Scenario: Time-critical sensor fusion in flight control computers, where ADC streams and CPU command updates share memory space.

IC Role / Device Role / Timing Role: Memory serves as deterministic shared buffer between ARINC 429 receiver FPGA and safety-certified ARM Cortex-R5 processor.

Use Value: JTAG boundary scan supports DO-254 compliance verification; industrial temperature range (–40°C to +85°C) meets RTCA/DO-160 Section 22 requirements.

Use Scenario: Hot-swap redundancy controller synchronizing primary and backup PLC CPUs in factory automation systems.

IC Role / Device Role / Timing Role: Dual-port SRAM stores mirrored process images and status flags, updated via mailbox interrupts to avoid polling overhead.

Use Value: Dual chip enables (CE0/CE1 per port) allow seamless depth expansion across multiple devices without external decode logic.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
CYD36S72V18-167BGI 36-Mbit (512K × 72), same 484-ball PBGA package and timing specs but double density Used where deeper buffering or larger lookup tables are required without changing PCB layout Select when memory depth >256K words is needed; pin-compatible but requires firmware address map update
AS7C3256A-15JCIN Asynchronous dual-port SRAM (256K × 16), 15 ns access, 100-pin TQFP, no JTAG or echo clocks Suitable for lower-bandwidth legacy control plane designs without SDR timing constraints Choose only for cost-sensitive, non-timing-critical applications where 200 MHz SDR and deterministic collision control are unnecessary

Compared with CYD36S72V18-167BGI, the higher-density variant offers direct PCB compatibility but increases cost and power; versus AS7C3256A-15JCIN, CYD18S72V18-167BGI delivers 19× higher bandwidth and deterministic arbitration essential for modern packet processing.

Availability

CYD18S72V18-167BGI is available at Aetrix Electronics and suitable for telecom line cards, network processor interfaces, avionics data concentrators, and industrial PLC redundancy modules requiring stable component supply and long-term lifecycle support.

Supply support for CYD18S72V18-167BGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, industrial, and automotive markets, with headquarters in San Jose, CA.

CYD18S72V18 belongs to the FullFlex™ SDR Dual-Port SRAM product line, engineered specifically for deterministic, high-bandwidth inter-processor communication in multi-clock-domain systems such as network switches and real-time control platforms.

FAQ

What I/O voltage standards does CYD18S72V18-167BGI support per port?

CYD18S72V18-167BGI supports four selectable I/O standards per port: 1.8 V LVCMOS, 2.5 V LVCMOS, LVTTL (3.3 V), and Extended HSTL (1.4 V to 1.9 V). Selection is controlled by PORTSTD[1:0] pins at power-up, and each port can be configured independently. HSTL support was removed after WW1830 per datasheet revision notes, but all other standards remain fully functional.

How does deterministic collision resolution work on this device?

When both ports attempt to access the same memory address in the same or consecutive clock cycles, the device asserts BUSYL/BUSYR within one cycle and outputs the conflicting address on the address bus. The first-busy address is latched and readable immediately, while subsequent collisions increment an internal busy counter. This eliminates arbitration uncertainty and guarantees bounded latency for safety-critical applications.

Is echo clocking required for reliable 200 MHz operation?

Echo clocking (CQ0L/CQ1L, CQ0R/CQ1R) is not mandatory but strongly recommended for 200 MHz SDR operation. These source-synchronous clocks align with data output edges, reducing timing margin dependency on board trace length matching. Designs omitting echo clocks must rely on precise PCB layout and tighter skew control, increasing validation risk in high-density routing environments.

Can CYD18S72V18-167BGI be used in place of CYD18S36V18 in an existing design?

No - CYD18S72V18-167BGI uses a 484-ball PBGA package with 72-bit data width per port, while CYD18S36V18 uses a 256-ball FBGA package with 36-bit width. Pin count, ball pitch, and signal mapping are incompatible. Migration would require PCB redesign, FPGA/ASIC interface rework, and firmware address map changes due to differing depth/width ratios (256K × 72 vs. 512K × 36).

CYD18S72V18-167BGI Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
484-FBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Dual Port, Synchronous
Memory Size:
18Mbit
Memory Organization:
256K x 72
Memory Interface:
Parallel
Clock Frequency:
167 MHz
Write Cycle Time - Word, Page:
-
Access Time:
4 ns
Voltage - Supply:
1.42V ~ 1.58V, 1.7V ~ 1.9V
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
484-PBGA (27x27)

CYD18S72V18-167BGI FAQ

1.How can I place an order for CYD18S72V18-167BGI through Aetrix?

Please submit a Request for Quotation (RFQ) for CYD18S72V18-167BGI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CYD18S72V18-167BGI reliable?

The price and inventory of CYD18S72V18-167BGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYD18S72V18-167BGI is usually 5 days.

3.What payment methods are accepted for CYD18S72V18-167BGI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYD18S72V18-167BGI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CYD18S72V18-167BGI?

CYD18S72V18-167BGI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CYD18S72V18-167BGI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CYD18S72V18-167BGI?

For technical support, including CYD18S72V18-167BGI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYD18S72V18-167BGI requirements.

6.How does Aetrix verify that CYD18S72V18-167BGI is sourced from the original manufacturer or authorized distributors?

All CYD18S72V18-167BGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYD18S72V18-167BGI meets industry standards.

7.What is the process for return or replacement of CYD18S72V18-167BGI?

All CYD18S72V18-167BGI units undergo pre-shipment inspection (PSI). If there is an issue with CYD18S72V18-167BGI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CYD18S72V18-167BGI part is unused and in its original packaging.

Return procedure for CYD18S72V18-167BGI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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