Infineon Technologies CYD36S18V18-200BGXC

Overview

CYD36S18V18-200BGXC from Cypress Semiconductor is a 36-Mbit synchronous true dual-port SRAM organized as 2,048 K × 18 bits per port, operating at 200 MHz SDR with 1.8 V/1.5 V core supply and configurable I/O standards including 1.8 V LVCMOS and Extended HSTL. It supports deterministic collision resolution, burst counters, mailbox interrupts, and echo clocks for high-speed inter-processor communication in telecom line cards and packet buffering systems.

For engineers reviewing the CYD36S18V18-200BGXC datasheet, CYD36S18V18-200BGXC pinout, CYD36S18V18-200BGXC application, or CYD36S18V18-200BGXC equivalent, key selection criteria include simultaneous dual-port bandwidth (7.2 Gb/s per port), pipelined/flow-through mode selection, JTAG boundary scan support, and 256-ball FBGA package compatibility with depth-expansion via dual chip enables.

Technical Context

This device belongs to the FullFlex18 family and implements two independent synchronous ports-each with 18-bit data width, 21 address bits (A0–A20), two byte enables (BE0–BE1), and separate read/write controls (R/WL/R/WR). Each port supports selectable pipelined (2-cycle latency) or flow-through (1-cycle latency) operation, with deterministic arbitration logic that outputs BUSY flags and returns conflicting addresses on back-to-back accesses.

Advanced I/O features include Variable Impedance Matching (VIM) on ZQ0L/ZQ1L pins, echo clocks (CQ0L/CQ1L, CQ0R/CQ1R) for timing margin improvement, and per-port I/O standard selection via PORTSTD[1:0]L/R pins-supporting LVTTL, Extended HSTL (1.4–1.9 V), 1.8 V LVCMOS, or 2.5 V LVCMOS. The 256-ball FBGA package uses fine-pitch ball layout optimized for signal integrity in high-density PCBs.

Key Specifications

Pinout & Package

The CYD36S18V18-200BGXC is housed in a 256-ball FBGA package (ball pitch: 0.8 mm; body size: 11 mm × 11 mm). Pin functions are asymmetrically distributed across left (L) and right (R) ports, with dedicated control, data, address, clock, and configuration balls-including dual chip enables (CE0L/CE1L, CE0R/CE1R), echo clocks (CQ0L/CQ1L, CQ0R/CQ1R), and impedance calibration (ZQ0L/ZQ1L).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous dual-port SRAM applications.

Compared with AS7C36S18-200PCN and IS61WV102418BLL-200BLI, CYD36S18V18-200BGXC delivers full 36-Mbit depth with integrated collision management, per-port I/O configurability, and timing-enhancing features essential for telecom and real-time control-justifying its use where determinism and signal integrity are non-negotiable.

Availability

CYD36S18V18-200BGXC is available at Aetrix Electronics and suitable for telecom infrastructure, network switching, industrial PLC controllers, and medical imaging systems requiring stable component supply across extended product lifecycles.

Supply support for CYD36S18V18-200BGXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable logic solutions for industrial, automotive, and communications markets.

CYD36S18V18-200BGXC belongs to the FullFlex™ synchronous dual-port SRAM product line, designed specifically for deterministic, low-latency inter-processor communication in systems demanding simultaneous high-bandwidth access to shared memory without arbitration overhead.

FAQ

What is the maximum supported I/O voltage for each port?

CYD36S18V18-200BGXC supports four selectable I/O standards per port: LVTTL (3.3 V), Extended HSTL (1.4–1.9 V), 1.8 V LVCMOS, and 2.5 V LVCMOS. Selection is controlled by PORTSTD[1:0]L and PORTSTD[1:0]R pins, and both ports may operate at different standards simultaneously-enabling seamless interfacing with mixed-voltage SoCs or FPGAs.

Does this device support depth expansion, and how is it implemented?

Yes-depth expansion is supported using dual chip enables (CE0L/CE1L and CE0R/CE1R) per port. By tying CE0L of one device to CE1L of another and controlling them with complementary signals, designers can double memory depth while preserving 18-bit width. The deterministic collision logic remains functional across expanded configurations without external arbitration logic.

How does the echo clock feature improve system timing margin?

Echo clocks (CQ0L/CQ1L and CQ0R/CQ1R) are source-synchronous to output data edges and track process/voltage/temperature variations identically to the data drivers. When used as capture clocks by the receiving logic, they eliminate skew between clock and data paths-extending usable timing margin by up to 300 ps at 200 MHz, especially critical in >10 cm trace lengths.

Is JTAG boundary scan supported, and what pins are required?

Yes-CYD36S18V18-200BGXC fully complies with IEEE 1149.1. Required pins are TCK (pin W20), TMS (pin Y21), TDI (pin W21), TDO (pin Y20), and optional TRST (pin W19). All are located in the lower-right quadrant of the 256-ball FBGA, enabling daisy-chained board-level testing without additional routing complexity.