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Infineon Technologies CYD36S36V18-200BGXC

Part No.:
CYD36S36V18-200BGXC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
484-FBGA
Datasheet:
AetrixCYD36S36V18-200BGXC.pdf
Description:
IC SRAM 36MBIT PARALLEL 484PBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,883

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Product details

Overview

CYD36S36V18-200BGXC from Cypress Semiconductor is a 36-Mbit (1,024 K × 36) synchronous true dual-port SRAM with independent 36-bit ports, 200 MHz SDR interface, deterministic collision control, and configurable I/O standards including 1.8 V LVCMOS and Extended HSTL. It operates at 1.5 V or 1.8 V core voltage and supports pipelined or flow-through read latency modes for high-speed packet buffering in telecom line cards.

For engineers reviewing the CYD36S36V18-200BGXC datasheet, CYD36S36V18-200BGXC pinout, CYD36S36V18-200BGXC application, or CYD36S36V18-200BGXC equivalent, key selection criteria include dual-port bandwidth (14.4 Gb/s), deterministic busy/flag signaling on address collision, echo clock support for timing margin improvement, and 484-ball PBGA package compatibility with depth-expansion via dual chip enables.

Technical Context

This device implements a synchronous dual-port architecture with two independent clock domains (CLKL/CLKR), each supporting single-data-rate operation up to 200 MHz. Each port features a 20-bit address bus, four byte enables (BE[3:0]), and full-duplex data transfer on separate 36-bit bidirectional data buses (DQ[35:0]L/R).

Collision detection is deterministic and occurs on back-to-back clock cycles; the device outputs a BUSY flag and provides first-busy address readback via the address bus. Internal burst counters, mailbox interrupts, and JTAG boundary scan (IEEE 1149.1) are integrated for system-level synchronization and debug.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 36 Mbit (1,024 K × 36) - supports 1M-word depth with 36-bit parallel data path per port.
Max Clock Frequency 200 MHz - enables 200 MT/s per port, delivering 14.4 Gb/s aggregate bandwidth (200 MHz × 36-bit × 2 ports).
Core Supply Voltage 1.5 V or 1.8 V - low-voltage operation reduces dynamic power and enables compatibility with advanced SoC I/O domains.
I/O Standard Support Selectable 1.8 V LVCMOS, Extended HSTL (1.4–1.9 V), or 2.5 V LVCMOS - allows direct interfacing with FPGAs and ASICs without level shifters.
Access Mode Pipelined or flow-through read latency - configurable per port to optimize timing closure in high-speed PCB layouts.
Package 484-ball PBGA (27 mm × 27 mm, 1.0 mm pitch) - matches industry-standard footprint for thermal and routing scalability in dense line-card designs.
Collision Handling Deterministic flag + BUSY output + first-busy address readback - eliminates arbitration firmware overhead in real-time buffer management.

Pinout & Package

Package: 484-ball Plastic Ball Grid Array (PBGA), 27 mm × 27 mm, 1.0 mm ball pitch, RoHS-compliant. Pinout conforms to FullFlex36 family layout (Figure 2, Document 38-06082 Rev. *M, Page 5), with dedicated left/right port signals, dual chip enables (CE0L/CE1L and CE0R/CE1R), echo clocks (CQ0L/CQ1L and CQ0R/CQ1R), and impedance calibration balls (ZQ0L/ZQ1L and ZQ0R/ZQ1R).

Pin/Terminal Circuit Role Design Meaning
A[19:0]L / A[19:0]R Address Inputs (Left/Right Port) 20-bit address bus per port; supports 1M-word addressing (220 = 1,048,576 locations).
DQ[35:0]L / DQ[35:0]R Bidirectional Data Bus (Left/Right Port) 36-bit parallel data path per port; supports simultaneous read/write across ports.
BE[3:0]L / BE[3:0]R Byte Enable Inputs Four independent byte enables per port allow granular 8-bit write masking within 36-bit word.
CE0L/CE1L, CE0R/CE1R Chip Enable Inputs Dual CE per port enables depth expansion without external logic; both must be active for valid access.
BUSYL / BUSYR Collision Status Output Active-high signal indicates deterministic address collision; used for hardware arbitration or interrupt generation.
CNTINTL / CNTINTR Burst Counter Interrupt Flags when internal burst counter reaches max count; enables autonomous sequential memory access without CPU polling.

Key Features

Feature Design Value
Deterministic Collision Control Guaranteed BUSY assertion and first-busy address readback on simultaneous same-address access - eliminates race conditions in shared-buffer systems.
Echo Clock Outputs (CQ0/CQ1) Phase-aligned clock copies reduce setup/hold timing uncertainty for source-synchronous interfaces - improves margin in >150 MHz FPGA-SRAM links.
Variable Impedance Matching (VIM) On-die termination calibration via ZQ pins - matches driver impedance to PCB trace (typically 40–60 Ω), reducing reflections and eye closure.
Configurable I/O Standards Per-port selection of 1.8 V LVCMOS, Extended HSTL, or 2.5 V LVCMOS - avoids external level translators when interfacing with mixed-voltage FPGAs.
Burst Counter with Mailbox Hardware address incrementer + interrupt flags + mailbox registers - enables zero-CPU-overhead DMA-like transfers for packet header processing or descriptor queues.

Applications

Telecom Line Card Buffering Network Packet Switching

Use Scenario: Storing ingress/egress packet headers and metadata in multi-gigabit Ethernet line cards with real-time traffic shaping.

IC Role / Device Role / Timing Role: True dual-port SRAM acting as a non-blocking, low-latency shared buffer between MAC and traffic manager ASICs.

Use Value: Deterministic collision handling ensures predictable worst-case latency (<2 cycles) during concurrent header lookups and updates - critical for IEEE 802.1Qbv time-aware shapers.

Use Scenario: Implementing cut-through switching buffers in Layer 2/L3 switches where packets arrive at asymmetric rates on ingress/egress ports.

IC Role / Device Role / Timing Role: Dual-port memory serving as a ping-pong descriptor ring for packet forwarding engines, synchronized via mailbox interrupts.

Use Value: Burst counter + CNTINT enables automatic address stepping across 1M descriptors - eliminating CPU intervention for every packet, reducing host load by >90%.

FPGA-Based Protocol Acceleration Industrial Real-Time Control

Use Scenario: Offloading TCP/IP checksum calculation and segmentation offload (TSO) in FPGA-accelerated NICs.

IC Role / Device Role / Timing Role: High-bandwidth SRAM providing simultaneous access to packet payload (via one port) and metadata tables (via second port).

Use Value: 200 MHz SDR + echo clocks deliver 14.4 Gb/s aggregate throughput - sustains full 100 GbE line rate with <1 ns jitter-induced timing margin loss.

Use Scenario: Coordinating motion control commands between PLC master and servo drive modules in CNC machines with sub-microsecond cycle times.

IC Role / Device Role / Timing Role: Deterministic dual-port memory synchronizing position setpoints (Port L) and status feedback (Port R) across isolated control domains.

Use Value: BUSY flag + deterministic readback guarantees bounded response time (<300 ns) for safety-critical axis coordination - meeting IEC 61800-5-2 functional safety requirements.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
AS7C36S36P-200PCN 36-Mbit (1M × 36), 200 MHz, 3.3 V LVTTL I/O only, no echo clocks or VIM. Lacks deterministic collision signaling and per-port I/O flexibility - requires external arbitration logic and level translation for 1.8 V FPGAs. Choose only if legacy 3.3 V system integration is required and deterministic BUSY signaling is not needed.
IS61WV102436BLL-200TQLI 36-Mbit (1M × 36), 200 MHz, 1.8 V core + I/O, but asynchronous dual-port (no clock domain separation). No pipelined latency control or echo clocks; collision resolution relies on external logic - increases design complexity and timing risk. Prefer only for cost-sensitive applications where synchronous timing margins are relaxed and software arbitration is acceptable.

Compared with AS7C36S36P-200PCN and IS61WV102436BLL-200TQLI, CYD36S36V18-200BGXC uniquely delivers deterministic hardware arbitration, echo-clock timing assistance, and per-port I/O standard selection - reducing PCB layer count, eliminating level shifters, and guaranteeing worst-case latency in real-time systems.

Availability

CYD36S36V18-200BGXC is available at Aetrix Electronics and suitable for telecom line card buffering, network packet switching, FPGA-based protocol acceleration, and industrial real-time control requiring stable component supply and long-term lifecycle assurance.

Supply support for CYD36S36V18-200BGXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance memory, microcontrollers, and programmable analog/digital ICs for industrial, automotive, and communications markets.

CYD36S36V18 belongs to the FullFlex™ Synchronous SDR Dual Port SRAM product line, designed specifically for deterministic, low-latency shared-memory architectures in high-speed networking and real-time embedded systems.

FAQ

What is the maximum supported I/O voltage for CYD36S36V18-200BGXC?

The device supports selectable I/O standards: 1.8 V LVCMOS, Extended HSTL (1.4 V to 1.9 V), and 2.5 V LVCMOS. Core voltage remains fixed at either 1.5 V or 1.8 V. I/O voltage is configured per port via CONFIG block settings and does not require external regulators beyond VDDIO_L/R supplies.

Does CYD36S36V18-200BGXC support depth expansion using multiple devices?

Yes - dual chip enable inputs (CE0/CE1) per port allow seamless depth expansion without external decode logic. When CE0 is asserted and CE1 is deasserted, the device responds to its full address range; asserting both enables partial-depth operation for interleaved addressing across stacked devices.

How does deterministic collision detection work in practice?

When both ports access the same memory location on consecutive clock edges, the device asserts BUSY within one cycle and places the colliding address on the address bus. The host reads this address synchronously on the next rising edge - enabling immediate corrective action without polling or timeout loops.

Can echo clocks (CQ0/CQ1) be disabled or repurposed?

No - echo clocks are dedicated outputs tied to internal clock paths and cannot be disabled or reassigned. They mirror CLKL/CLKR with minimal skew (<150 ps) and are intended solely for source-synchronous capture at the receiving device; using them as general-purpose clocks violates timing specifications.

CYD36S36V18-200BGXC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
484-FBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Dual Port, Synchronous
Memory Size:
36Mbit
Memory Organization:
1M x 36
Memory Interface:
Parallel
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.3 ns
Voltage - Supply:
1.42V ~ 1.58V, 1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
484-PBGA (27x27)

CYD36S36V18-200BGXC FAQ

1.How can I place an order for CYD36S36V18-200BGXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CYD36S36V18-200BGXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CYD36S36V18-200BGXC reliable?

The price and inventory of CYD36S36V18-200BGXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYD36S36V18-200BGXC is usually 5 days.

3.What payment methods are accepted for CYD36S36V18-200BGXC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYD36S36V18-200BGXC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CYD36S36V18-200BGXC?

CYD36S36V18-200BGXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CYD36S36V18-200BGXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CYD36S36V18-200BGXC?

For technical support, including CYD36S36V18-200BGXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYD36S36V18-200BGXC requirements.

6.How does Aetrix verify that CYD36S36V18-200BGXC is sourced from the original manufacturer or authorized distributors?

All CYD36S36V18-200BGXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYD36S36V18-200BGXC meets industry standards.

7.What is the process for return or replacement of CYD36S36V18-200BGXC?

All CYD36S36V18-200BGXC units undergo pre-shipment inspection (PSI). If there is an issue with CYD36S36V18-200BGXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CYD36S36V18-200BGXC part is unused and in its original packaging.

Return procedure for CYD36S36V18-200BGXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CYD36S36V18-200BGXC Tags

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