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Infineon Technologies CYD36S72V18-200BGXC

Part No.:
CYD36S72V18-200BGXC
Manufacturer:
Infineon Technologies
Category:
Memory
Package:
484-FBGA
Datasheet:
AetrixCYD36S72V18-200BGXC.pdf
Description:
IC SRAM 36MBIT PARALLEL 484PBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,459

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Product details

Overview

CYD36S72V18-200BGXC from Cypress Semiconductor is a 36-Mbit (512K × 72) synchronous true dual-port SRAM with independent 72-bit SDR interfaces per port, 200 MHz clock support, deterministic collision resolution, and 1.5 V/1.8 V core supply-designed for high-bandwidth inter-processor communication in telecom line cards and packet buffer applications.

For engineers reviewing the CYD36S72V18-200BGXC datasheet, CYD36S72V18-200BGXC pinout, CYD36S72V18-200BGXC application, or CYD36S72V18-200BGXC equivalent, key selection criteria include simultaneous 72-bit read/write capability per port, pipelined/flow-through mode configurability, JTAG boundary scan compliance, echo clocking for timing margin improvement, and 484-ball PBGA package compatibility with high-density PCB routing.

Technical Context

This device implements two fully independent synchronous ports sharing a single 512K × 72 memory array, each supporting 200 MHz SDR operation with selectable 1- or 2-cycle read latency. Collision detection logic ensures deterministic arbitration on simultaneous access to identical addresses, generating BUSY flags and enabling first-busy address readback.

Each port features programmable I/O standards (1.8 V LVCMOS, 2.5 V LVCMOS, or Extended HSTL), variable impedance matching (VIM) via ZQ pins, burst counters with interrupt flags, mailbox registers with interrupt signaling, and echo clocks (CQ0/CQ1) synchronized to data valid windows for improved setup/hold margins.

Key Specifications

Parameter Value and Actual Design Meaning
Memory Density 36 Mbit (512K × 72 bits), enabling full 72-bit parallel data exchange between two independent subsystems.
Max Clock Frequency 200 MHz per port - supports 28.8 Gbps aggregate bandwidth (200 MHz × 72-bit × 2 ports).
Core Supply Voltage 1.5 V or 1.8 V - reduces dynamic power vs. 3.3 V SRAMs while maintaining timing headroom.
I/O Voltage Options Selectable 1.8 V LVCMOS / 2.5 V LVCMOS / Extended HSTL - allows interface matching to FPGA or ASIC I/O banks.
Access Control Deterministic collision resolution with BUSY flag assertion and first-busy address readback on back-to-back cycles.
Package 484-ball PBGA (27 mm × 27 mm, 1.0 mm pitch) - optimized for thermal dissipation and signal integrity in high-speed layouts.
JTAG Support IEEE 1149.1 compliant boundary scan - enables board-level testability without external probes.

Pinout & Package

Package: 484-ball plastic BGA (PBGA), 27 mm × 27 mm, 1.0 mm ball pitch, RoHS-compliant. Pin mapping validated per Cypress Document No. 38-06082 Rev. *S, Figure 1 (FullFlex72 484-ball BGA top view).

Pin/Terminal Circuit Role Design Meaning
DQ[71:0]L / DQ[71:0]R Left/Right port bidirectional data bus 72-bit wide data path per port; supports byte-wise masking via BE[7:0]L/R for partial writes.
A[18:0]L / A[18:0]R Left/Right port address inputs 19-bit address space (512K depth); A16–A18 marked [7–9] indicate density-dependent no-connect status.
CE0L/CE1L, CE0R/CE1R Chip enable pairs per port Two enables required active-low for valid access; enables power-down of internal circuitry when inactive.
R/WL / R/WR Read/write control per port Active-high write enable; controls direction of DQ bus and internal write latch timing.
CQ0L/CQ1L, CQ0R/CQ1R Echo clocks per port Output-only clocks phase-aligned to data valid window; used by receiving logic to sample DQ with reduced skew.
ZQ0L/ZQ1L, ZQ0R/ZQ1R Impedance calibration reference Connect to 240 Ω ±1% resistor to ground; enables on-die termination calibration for signal integrity tuning.
PORTSTD[1:0]L/R I/O standard selection Configures per-port I/O voltage and drive strength: 00=1.8 V LVCMOS, 01=2.5 V LVCMOS, 10=Extended HSTL.
CNT/MSKL, CNT/MSKR Burst counter/mask register select Enables sequential addressing via internal counter; mask register controls wrap behavior and increment step.

Key Features

Feature Design Value
True dual-port architecture Independent clock, address, data, and control per port - eliminates arbitration overhead in peer-to-peer buffering.
Selectably pipelined or flow-through mode Reduces read latency to 1 cycle (flow-through) or improves timing closure at 200 MHz (2-cycle pipelined) per port.
Deterministic collision handling Guaranteed BUSY flag assertion and readable first-busy address within one clock cycle of conflict detection.
Mailbox with interrupt flags Hardware-accelerated message passing between ports using dedicated INTL/INTR signals and register-backed buffers.
Variable impedance matching (VIM) On-die driver impedance calibration via ZQ pins - matches PCB trace impedance to minimize reflections at 200 MHz.
Burst counter with retransmit Auto-incrementing address generator with mirror register reload - simplifies DMA-like sequential access without host CPU intervention.

Applications

Telecom Line Card Buffering Network Processor Interfacing

Use Scenario: Storing packet headers and payload fragments between ingress and egress processing engines on a 10G/40G line card.

IC Role / Device Role / Timing Role: Shared memory buffer with deterministic arbitration ensuring zero-packet-loss forwarding under concurrent read/write load.

Use Value: 72-bit width matches typical network processor bus size; 200 MHz SDR delivers sufficient bandwidth to sustain 40 Gbps line rate with <10 ns access latency.

Use Scenario: Coordinating control plane and data plane operations in multi-core network processors requiring low-latency shared state.

IC Role / Device Role / Timing Role: Dual-port SRAM acting as a hardware mailbox with interrupt-driven message passing between CPU cores.

Use Value: Mailbox interrupt flags (INTL/INTR) eliminate polling overhead; deterministic collision response prevents race-condition-induced corruption.

FPGA-to-FPGA Communication Real-Time Video Frame Buffering

Use Scenario: High-speed data exchange between two Xilinx Ultrascale+ FPGAs implementing separate video encode/decode pipelines.

IC Role / Device Role / Timing Role: Synchronous dual-port memory bridging clock domains with echo clocks (CQ0/CQ1) aligning data capture timing.

Use Value: Echo clocks reduce setup/hold uncertainty by >300 ps vs. free-running clocks; VIM improves signal integrity across 10+ inch traces.

Use Scenario: Storing uncompressed 4K UHD frames (3840×2160×24bpp) for real-time color correction and overlay compositing.

IC Role / Device Role / Timing Role: Frame buffer with independent read (display engine) and write (sensor interface) ports operating at full pixel clock rates.

Use Value: 512K × 72 organization supports 128-line deep frame slices; 1.5 V core reduces thermal load in fanless enclosures.

Equivalent & Alternatives

The following parts are listed as comparable options for similar synchronous dual-port SRAM applications.

Alternative Part Technical Difference Application Difference Selection Advice
AS7C36S72P-200BIN 36-Mbit (512K × 72), 200 MHz, 1.8 V core, 484-pin PBGA - lacks JTAG, echo clocks, and mailbox interrupts. Lower-cost alternative where deterministic collision handling and inter-processor messaging are not required. Select when system-level arbitration is handled externally and test coverage does not require IEEE 1149.1 support.
IS61WV102472BLL-200BLI 72-Mbit (1M × 72), 200 MHz, 3.3 V core, 484-pin PBGA - higher density but incompatible voltage and missing burst counter/VIM. Suitable for legacy 3.3 V systems needing larger capacity, but requires level-shifting and forfeits impedance tuning. Choose only if 3.3 V I/O compatibility is mandatory and power efficiency is secondary to memory size.

Compared with AS7C36S72P-200BIN and IS61WV102472BLL-200BLI, CYD36S72V18-200BGXC uniquely combines 1.5/1.8 V operation, echo clocking, deterministic arbitration, and JTAG testability - making it optimal for new designs prioritizing signal integrity, low power, and debuggability in high-speed interconnects.

Availability

CYD36S72V18-200BGXC is available at Aetrix Electronics and suitable for telecom infrastructure, network processor interfacing, FPGA-to-FPGA bridging, and real-time video processing applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for CYD36S72V18-200BGXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, industrial, and automotive markets, with emphasis on signal integrity and system-level integration.

CYD36S72V18 belongs to the FullFlex™ SDR Dual-Port SRAM product line, engineered specifically for deterministic, low-latency, high-bandwidth memory sharing between heterogeneous processors and ASICs in packet-processing and real-time imaging systems.

FAQ

What is the minimum supported core voltage for CYD36S72V18-200BGXC?

The device operates at either 1.5 V ±0.075 V or 1.8 V ±0.09 V core supply, with both voltages fully supported across commercial (0°C to +70°C) and industrial (–40°C to +85°C) temperature ranges. The 1.5 V option reduces dynamic power by ~25% versus 1.8 V at identical frequency and activity factor.

Does CYD36S72V18-200BGXC support asynchronous reset?

Yes - the device includes an asynchronous Master Reset (MRST) input that forces all internal registers, counters, and mailboxes into a known state regardless of clock or enable status. MRST is active-low and must be held for ≥100 ns to guarantee full initialization.

How is echo clock timing related to data valid window?

Echo clocks CQ0L/CQ1L and CQ0R/CQ1R are generated internally and edge-aligned to the center of the DQ valid window. Their rising edges occur at tDS (data setup) + tDH (data hold)/2 relative to DQ transitions, enabling receivers to sample data with maximum timing margin without external delay tuning.

Can the burst counter be used independently on each port?

Yes - each port has its own dedicated burst counter (CNT/MSKL/R, CNTENL/R, CNTRSTL/R), mask register, and mirror register. Counters operate autonomously; one port can perform sequential reads while the other executes random accesses without interference or synchronization overhead.

CYD36S72V18-200BGXC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
-
Package/Case:
484-FBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Memory Type:
Volatile
Memory Format:
SRAM
Technology:
SRAM - Dual Port, Synchronous
Memory Size:
36Mbit
Memory Organization:
512K x 72
Memory Interface:
Parallel
Clock Frequency:
200 MHz
Write Cycle Time - Word, Page:
-
Access Time:
3.3 ns
Voltage - Supply:
1.42V ~ 1.58V, 1.7V ~ 1.9V
Operating Temperature:
0°C ~ 70°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
484-PBGA (27x27)

CYD36S72V18-200BGXC FAQ

1.How can I place an order for CYD36S72V18-200BGXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CYD36S72V18-200BGXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CYD36S72V18-200BGXC reliable?

The price and inventory of CYD36S72V18-200BGXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYD36S72V18-200BGXC is usually 5 days.

3.What payment methods are accepted for CYD36S72V18-200BGXC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYD36S72V18-200BGXC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CYD36S72V18-200BGXC?

CYD36S72V18-200BGXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CYD36S72V18-200BGXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CYD36S72V18-200BGXC?

For technical support, including CYD36S72V18-200BGXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYD36S72V18-200BGXC requirements.

6.How does Aetrix verify that CYD36S72V18-200BGXC is sourced from the original manufacturer or authorized distributors?

All CYD36S72V18-200BGXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYD36S72V18-200BGXC meets industry standards.

7.What is the process for return or replacement of CYD36S72V18-200BGXC?

All CYD36S72V18-200BGXC units undergo pre-shipment inspection (PSI). If there is an issue with CYD36S72V18-200BGXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CYD36S72V18-200BGXC part is unused and in its original packaging.

Return procedure for CYD36S72V18-200BGXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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