Infineon Technologies CYD36S72V18-200BGXC
- Part No.:
- CYD36S72V18-200BGXC
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 484-FBGA
- Datasheet:
-
CYD36S72V18-200BGXC.pdf
- Description:
- IC SRAM 36MBIT PARALLEL 484PBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
CYD36S72V18-200BGXC from Cypress Semiconductor is a 36-Mbit (512K × 72) synchronous true dual-port SRAM with independent 72-bit SDR interfaces per port, 200 MHz clock support, deterministic collision resolution, and 1.5 V/1.8 V core supply-designed for high-bandwidth inter-processor communication in telecom line cards and packet buffer applications.
For engineers reviewing the CYD36S72V18-200BGXC datasheet, CYD36S72V18-200BGXC pinout, CYD36S72V18-200BGXC application, or CYD36S72V18-200BGXC equivalent, key selection criteria include simultaneous 72-bit read/write capability per port, pipelined/flow-through mode configurability, JTAG boundary scan compliance, echo clocking for timing margin improvement, and 484-ball PBGA package compatibility with high-density PCB routing.
Technical Context
This device implements two fully independent synchronous ports sharing a single 512K × 72 memory array, each supporting 200 MHz SDR operation with selectable 1- or 2-cycle read latency. Collision detection logic ensures deterministic arbitration on simultaneous access to identical addresses, generating BUSY flags and enabling first-busy address readback.
Each port features programmable I/O standards (1.8 V LVCMOS, 2.5 V LVCMOS, or Extended HSTL), variable impedance matching (VIM) via ZQ pins, burst counters with interrupt flags, mailbox registers with interrupt signaling, and echo clocks (CQ0/CQ1) synchronized to data valid windows for improved setup/hold margins.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 36 Mbit (512K × 72 bits), enabling full 72-bit parallel data exchange between two independent subsystems. |
| Max Clock Frequency | 200 MHz per port - supports 28.8 Gbps aggregate bandwidth (200 MHz × 72-bit × 2 ports). |
| Core Supply Voltage | 1.5 V or 1.8 V - reduces dynamic power vs. 3.3 V SRAMs while maintaining timing headroom. |
| I/O Voltage Options | Selectable 1.8 V LVCMOS / 2.5 V LVCMOS / Extended HSTL - allows interface matching to FPGA or ASIC I/O banks. |
| Access Control | Deterministic collision resolution with BUSY flag assertion and first-busy address readback on back-to-back cycles. |
| Package | 484-ball PBGA (27 mm × 27 mm, 1.0 mm pitch) - optimized for thermal dissipation and signal integrity in high-speed layouts. |
| JTAG Support | IEEE 1149.1 compliant boundary scan - enables board-level testability without external probes. |
Pinout & Package
Package: 484-ball plastic BGA (PBGA), 27 mm × 27 mm, 1.0 mm ball pitch, RoHS-compliant. Pin mapping validated per Cypress Document No. 38-06082 Rev. *S, Figure 1 (FullFlex72 484-ball BGA top view).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DQ[71:0]L / DQ[71:0]R | Left/Right port bidirectional data bus | 72-bit wide data path per port; supports byte-wise masking via BE[7:0]L/R for partial writes. |
| A[18:0]L / A[18:0]R | Left/Right port address inputs | 19-bit address space (512K depth); A16–A18 marked [7–9] indicate density-dependent no-connect status. |
| CE0L/CE1L, CE0R/CE1R | Chip enable pairs per port | Two enables required active-low for valid access; enables power-down of internal circuitry when inactive. |
| R/WL / R/WR | Read/write control per port | Active-high write enable; controls direction of DQ bus and internal write latch timing. |
| CQ0L/CQ1L, CQ0R/CQ1R | Echo clocks per port | Output-only clocks phase-aligned to data valid window; used by receiving logic to sample DQ with reduced skew. |
| ZQ0L/ZQ1L, ZQ0R/ZQ1R | Impedance calibration reference | Connect to 240 Ω ±1% resistor to ground; enables on-die termination calibration for signal integrity tuning. |
| PORTSTD[1:0]L/R | I/O standard selection | Configures per-port I/O voltage and drive strength: 00=1.8 V LVCMOS, 01=2.5 V LVCMOS, 10=Extended HSTL. |
| CNT/MSKL, CNT/MSKR | Burst counter/mask register select | Enables sequential addressing via internal counter; mask register controls wrap behavior and increment step. |
Key Features
| Feature | Design Value |
|---|---|
| True dual-port architecture | Independent clock, address, data, and control per port - eliminates arbitration overhead in peer-to-peer buffering. |
| Selectably pipelined or flow-through mode | Reduces read latency to 1 cycle (flow-through) or improves timing closure at 200 MHz (2-cycle pipelined) per port. |
| Deterministic collision handling | Guaranteed BUSY flag assertion and readable first-busy address within one clock cycle of conflict detection. |
| Mailbox with interrupt flags | Hardware-accelerated message passing between ports using dedicated INTL/INTR signals and register-backed buffers. |
| Variable impedance matching (VIM) | On-die driver impedance calibration via ZQ pins - matches PCB trace impedance to minimize reflections at 200 MHz. |
| Burst counter with retransmit | Auto-incrementing address generator with mirror register reload - simplifies DMA-like sequential access without host CPU intervention. |
Applications
| Telecom Line Card Buffering | Network Processor Interfacing |
|---|---|
|
Use Scenario: Storing packet headers and payload fragments between ingress and egress processing engines on a 10G/40G line card. IC Role / Device Role / Timing Role: Shared memory buffer with deterministic arbitration ensuring zero-packet-loss forwarding under concurrent read/write load. Use Value: 72-bit width matches typical network processor bus size; 200 MHz SDR delivers sufficient bandwidth to sustain 40 Gbps line rate with <10 ns access latency. |
Use Scenario: Coordinating control plane and data plane operations in multi-core network processors requiring low-latency shared state. IC Role / Device Role / Timing Role: Dual-port SRAM acting as a hardware mailbox with interrupt-driven message passing between CPU cores. Use Value: Mailbox interrupt flags (INTL/INTR) eliminate polling overhead; deterministic collision response prevents race-condition-induced corruption. |
| FPGA-to-FPGA Communication | Real-Time Video Frame Buffering |
|
Use Scenario: High-speed data exchange between two Xilinx Ultrascale+ FPGAs implementing separate video encode/decode pipelines. IC Role / Device Role / Timing Role: Synchronous dual-port memory bridging clock domains with echo clocks (CQ0/CQ1) aligning data capture timing. Use Value: Echo clocks reduce setup/hold uncertainty by >300 ps vs. free-running clocks; VIM improves signal integrity across 10+ inch traces. |
Use Scenario: Storing uncompressed 4K UHD frames (3840×2160×24bpp) for real-time color correction and overlay compositing. IC Role / Device Role / Timing Role: Frame buffer with independent read (display engine) and write (sensor interface) ports operating at full pixel clock rates. Use Value: 512K × 72 organization supports 128-line deep frame slices; 1.5 V core reduces thermal load in fanless enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar synchronous dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AS7C36S72P-200BIN | 36-Mbit (512K × 72), 200 MHz, 1.8 V core, 484-pin PBGA - lacks JTAG, echo clocks, and mailbox interrupts. | Lower-cost alternative where deterministic collision handling and inter-processor messaging are not required. | Select when system-level arbitration is handled externally and test coverage does not require IEEE 1149.1 support. |
| IS61WV102472BLL-200BLI | 72-Mbit (1M × 72), 200 MHz, 3.3 V core, 484-pin PBGA - higher density but incompatible voltage and missing burst counter/VIM. | Suitable for legacy 3.3 V systems needing larger capacity, but requires level-shifting and forfeits impedance tuning. | Choose only if 3.3 V I/O compatibility is mandatory and power efficiency is secondary to memory size. |
Compared with AS7C36S72P-200BIN and IS61WV102472BLL-200BLI, CYD36S72V18-200BGXC uniquely combines 1.5/1.8 V operation, echo clocking, deterministic arbitration, and JTAG testability - making it optimal for new designs prioritizing signal integrity, low power, and debuggability in high-speed interconnects.
Availability
CYD36S72V18-200BGXC is available at Aetrix Electronics and suitable for telecom infrastructure, network processor interfacing, FPGA-to-FPGA bridging, and real-time video processing applications requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.
Supply support for CYD36S72V18-200BGXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance memory and programmable solutions for communications, industrial, and automotive markets, with emphasis on signal integrity and system-level integration.
CYD36S72V18 belongs to the FullFlex™ SDR Dual-Port SRAM product line, engineered specifically for deterministic, low-latency, high-bandwidth memory sharing between heterogeneous processors and ASICs in packet-processing and real-time imaging systems.
FAQ
What is the minimum supported core voltage for CYD36S72V18-200BGXC?
The device operates at either 1.5 V ±0.075 V or 1.8 V ±0.09 V core supply, with both voltages fully supported across commercial (0°C to +70°C) and industrial (–40°C to +85°C) temperature ranges. The 1.5 V option reduces dynamic power by ~25% versus 1.8 V at identical frequency and activity factor.
Does CYD36S72V18-200BGXC support asynchronous reset?
Yes - the device includes an asynchronous Master Reset (MRST) input that forces all internal registers, counters, and mailboxes into a known state regardless of clock or enable status. MRST is active-low and must be held for ≥100 ns to guarantee full initialization.
How is echo clock timing related to data valid window?
Echo clocks CQ0L/CQ1L and CQ0R/CQ1R are generated internally and edge-aligned to the center of the DQ valid window. Their rising edges occur at tDS (data setup) + tDH (data hold)/2 relative to DQ transitions, enabling receivers to sample data with maximum timing margin without external delay tuning.
Can the burst counter be used independently on each port?
Yes - each port has its own dedicated burst counter (CNT/MSKL/R, CNTENL/R, CNTRSTL/R), mask register, and mirror register. Counters operate autonomously; one port can perform sequential reads while the other executes random accesses without interference or synchronization overhead.
CYD36S72V18-200BGXC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 484-FBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Dual Port, Synchronous
- Memory Size:
- 36Mbit
- Memory Organization:
- 512K x 72
- Memory Interface:
- Parallel
- Clock Frequency:
- 200 MHz
- Write Cycle Time - Word, Page:
- -
- Access Time:
- 3.3 ns
- Voltage - Supply:
- 1.42V ~ 1.58V, 1.7V ~ 1.9V
- Operating Temperature:
- 0°C ~ 70°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 484-PBGA (27x27)
CYD36S72V18-200BGXC FAQ
1.How can I place an order for CYD36S72V18-200BGXC through Aetrix?
Please submit a Request for Quotation (RFQ) for CYD36S72V18-200BGXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYD36S72V18-200BGXC reliable?
The price and inventory of CYD36S72V18-200BGXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYD36S72V18-200BGXC is usually 5 days.
3.What payment methods are accepted for CYD36S72V18-200BGXC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYD36S72V18-200BGXC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYD36S72V18-200BGXC?
CYD36S72V18-200BGXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYD36S72V18-200BGXC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYD36S72V18-200BGXC?
For technical support, including CYD36S72V18-200BGXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYD36S72V18-200BGXC requirements.
6.How does Aetrix verify that CYD36S72V18-200BGXC is sourced from the original manufacturer or authorized distributors?
All CYD36S72V18-200BGXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYD36S72V18-200BGXC meets industry standards.
7.What is the process for return or replacement of CYD36S72V18-200BGXC?
All CYD36S72V18-200BGXC units undergo pre-shipment inspection (PSI). If there is an issue with CYD36S72V18-200BGXC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYD36S72V18-200BGXC part is unused and in its original packaging.
Return procedure for CYD36S72V18-200BGXC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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