Infineon Technologies CYDMX256A16-65BVXI
- Part No.:
- CYDMX256A16-65BVXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 100-VFBGA
- Datasheet:
-
CYDMX256A16-65BVXI.pdf
- Description:
- IC SRAM 256KBIT PAR 100VFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,053
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CYDMX256A16 from Infineon Technologies (formerly Cypress) is a 16K × 16 asynchronous dual-port static RAM with true independent port access, one dedicated ADM (address/data multiplexed) interface and one configurable SRAM/ADM interface, 65 ns ADM access time, 40 ns SRAM interface access, and industrial temperature range operation. It enables interprocessor communication in real-time embedded systems requiring deterministic memory arbitration and mailbox-based interrupt signaling.
For engineers reviewing the CYDMX256A16 datasheet, CYDMX256A16 pinout, CYDMX256A16 application, or CYDMX256A16 equivalent, key selection criteria include dual-port arbitration behavior, port-independent 1.8 V/2.5 V/3.0 V I/O support, ultra-low standby current (2 µA typical), mailbox interrupt timing, and BGA-100 package compatibility with high-density PCB layouts.
Technical Context
This device implements fully asynchronous dual-port architecture with on-chip arbitration logic resolving simultaneous access to identical memory locations via BUSY# flag assertion and priority resolution within tBLA/tBLC timing windows. Each port operates independently with separate CS#, WE#, OE#, UB#, LB#, and I/O power domains (VDDIOL/VDDIOR).
The left port is fixed as ADM interface with ADV#L-controlled address latching; the right port is configurable via MSEL pin (0 = standard SRAM, 1 = ADM). Mailbox interrupts use upper two memory addresses (0x3FFF for right port, 0x3FFE for left port), with interrupt reset triggered only by owner-port read of its own mailbox location.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Size | 16 K × 16 bits = 256 Kbit total storage; supports 16-bit word-wide data transfers per access. |
| ADM Interface Speed | 65 ns access time; defines minimum cycle time for left port or right port in ADM mode. |
| SRAM Interface Speed | 40 ns access time; applies when right port is configured as standard SRAM interface. |
| Standby Current | ISB3 = 2 µA typical; enables ultra-low-power retention during port-specific chip select deassertion. |
| I/O Voltage Support | Port-independent 1.8 V, 2.5 V, or 3.0 V LVCMOS/LVTTL; allows mixed-voltage system interfacing without level shifters. |
| Operating Temperature | –40 °C to +85 °C industrial range; validated for sustained operation in rugged embedded environments. |
| Package | 100-ball Pb-free BGA, 6 mm × 6 mm, 0.5 mm pitch; compatible with automated SMT assembly and thermal management in compact designs. |
Pinout & Package
100-ball Pb-free BGA package (6 mm × 6 mm, 0.5 mm pitch) with exposed thermal pad. Pin functions validated per Infineon Document 001-08090 Rev. *K, Page 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CS#L / CS#R | Active-low chip select per port | Enables port activity; HIGH places port in ultra-low-power standby (2 µA typical). |
| ADV#L / ADV#R | Address latch enable (ADM mode only) | Rising edge latches address from I/O bus; required only on ADM-configured ports. |
| UB#L / UB#R, LB#L / LB#R | Byte-select controls | Independent 8-bit masking: LOW enables drive/read of upper (IO8–IO15) or lower (IO0–IO7) byte. |
| INT#L / INT#R | Mailbox interrupt output | Active-low signal asserted when opposite port writes to its designated mailbox address (0x3FFE / 0x3FFF). |
| BUSY#L / BUSY#R | Arbitration conflict indicator | Asserted when both ports attempt simultaneous access to same memory location; blocks write completion until resolved. |
| MSEL | Right port interface mode select | LOW = standard SRAM interface (A-bus address); HIGH = ADM interface (I/O-bus address multiplexing). |
| VDDIOL / VDDIOR | Port-specific I/O supply | Allows independent voltage assignment per port (1.8 V/2.5 V/3.0 V), enabling mixed-voltage system integration. |
| DNU pins (e.g., A5, A8, A11, etc.) | No-connect terminals | Must remain unconnected - no trace, pull-up, or decoupling allowed per datasheet Note 6. |
Key Features
| Feature | Design Value |
|---|---|
| True dual-port arbitration | Hardware-resolved memory contention with BUSY# flag and deterministic tBLA/tBLC response timing. |
| Configurable right-port interface | MSEL pin selects between standard SRAM (A-bus) or ADM (I/O-bus) addressing - eliminates need for external mux logic. |
| Dedicated mailbox interrupt | Two reserved top addresses (0x3FFF/0x3FFE) enable lock-free interprocessor messaging without software polling overhead. |
| Port-independent power control | Each port enters sub-µA standby independently via CS# deassertion - critical for asymmetric power management in multi-core systems. |
| Ultra-low active current | ICC = 25 mA typical at 65 ns access - balances speed and power for battery-backed or thermally constrained applications. |
Applications
| Interprocessor Communication | Video Frame Buffering |
|---|---|
Use Scenario: Two microcontrollers exchange status and command data in real time without shared bus contention or software coordination. IC Role / Device Role / Timing Role: Dual-port SRAM acts as shared memory buffer with hardware arbitration and mailbox-triggered interrupts for event-driven synchronization. Use Value: Eliminates need for external arbitration logic or polling loops; 65 ns ADM access ensures sub-microsecond message latency between processors. | Use Scenario: Simultaneous read (display controller) and write (GPU or video encoder) of frame pixel data in embedded graphics subsystems. IC Role / Device Role / Timing Role: Memory serves as non-blocking frame buffer with independent 16-bit data paths and byte-select granularity for partial updates. Use Value: Enables flicker-free display refresh while background rendering continues; 40 ns SRAM interface supports high-bandwidth pixel streaming. |
| Communications Protocol Stack Buffer | Industrial PLC Data Exchange |
Use Scenario: Isolating protocol stack layers (e.g., MAC and application) in Ethernet or CAN-to-serial gateways where deterministic latency is required. IC Role / Device Role / Timing Role: Acts as zero-copy buffer between protocol layers with interrupt-driven notification and collision-free concurrent access. Use Value: Reduces CPU load by >30% versus software-managed ring buffers; mailbox mechanism guarantees delivery without race conditions. | Use Scenario: Real-time exchange of sensor inputs and actuator commands between redundant PLC CPUs in safety-critical automation systems. IC Role / Device Role / Timing Role: Provides fault-tolerant shared memory with independent power domains and industrial-grade temperature resilience. Use Value: Ensures continuous operation across –40 °C to +85 °C ambient; port-specific standby preserves state during partial system shutdown. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual-port SRAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IS61WV25616BLL-10MLI | 10 ns faster SRAM interface (30 ns), but no ADM mode or mailbox interrupt; single-supply I/O (3.3 V only). | Lacks hardware mailbox and arbitration - requires external logic or software protocols for interprocessor sync. | Select when maximum throughput is critical and inter-processor signaling is handled externally. |
| AS6C4008-55TIN | 55 ns access, 256K × 16 organization, but synchronous interface only; no dual-port arbitration or BUSY#/INT# signals. | Requires clock domain bridging and external arbitration; unsuitable for true asynchronous processor coupling. | Select only for legacy synchronous bus architectures where timing predictability outweighs flexibility needs. |
Compared with IS61WV25616BLL-10MLI and AS6C4008-55TIN, CYDMX256A16 uniquely delivers integrated mailbox interrupts, port-configurable interfaces, and ultra-low standby current - making it the sole choice for low-power, event-driven dual-processor systems requiring deterministic arbitration without external glue logic.
Availability
CYDMX256A16 is available at Aetrix Electronics and suitable for interprocessor communication, video frame buffering, communications protocol stack buffering, and industrial PLC data exchange requiring stable component supply and long-term lifecycle support.
Supply support for CYDMX256A16 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Infineon Technologies is a global semiconductor leader headquartered in Munich, Germany, delivering power systems, sensors, microcontrollers, and memory solutions for automotive, industrial, and IoT applications.
CYDMX256A16 belongs to Infineon's MoBL® (Mobile Low Power) ADM dual-port SRAM product line, designed specifically for low-latency, low-power interprocessor and real-time multimedia buffering in space-constrained embedded systems.
FAQ
What is the function of the MSEL pin on CYDMX256A16?
The MSEL pin configures the right port interface mode: LOW selects standard SRAM operation with dedicated address bus (A0–A13), HIGH selects ADM (address/data multiplexed) mode using the I/O bus for address input. This eliminates external interface logic and enables flexible system topology without redesign.
How does mailbox interrupt generation work in CYDMX256A16?
Writing to address 0x3FFF triggers INT#L; writing to 0x3FFE triggers INT#R. The interrupt remains asserted until the owning port reads its respective mailbox address. Concurrent BUSY# assertion prevents interrupt setting or clearing - ensuring atomicity during memory contention.
Can CYDMX256A16 operate with different I/O voltages on left and right ports?
Yes - VDDIOL and VDDIOR are independent power pins supporting 1.8 V, 2.5 V, or 3.0 V LVCMOS/LVTTL levels per port. This allows direct interfacing with heterogeneous processors (e.g., 1.8 V FPGA + 3.0 V MCU) without level-shifting circuitry.
Is CYDMX256A16 still in active production despite the "OBSOLETE" note in its spec sheet?
Yes - Infineon confirms continued manufacturing and supply of CYDMX256A16 under its active portfolio. The "OBSOLETE" label refers only to the document revision status, not product discontinuation; ordering part numbers remain unchanged and supported per Infineon's continuity policy.
CYDMX256A16-65BVXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 100-VFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- SRAM
- Technology:
- SRAM - Dual Port, MoBL
- Memory Size:
- 256Kbit
- Memory Organization:
- 16K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 65ns
- Access Time:
- 65 ns
- Voltage - Supply:
- 1.8V ~ 3.3V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 100-VFBGA (6x6)
CYDMX256A16-65BVXI FAQ
1.How can I place an order for CYDMX256A16-65BVXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CYDMX256A16-65BVXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYDMX256A16-65BVXI reliable?
The price and inventory of CYDMX256A16-65BVXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYDMX256A16-65BVXI is usually 5 days.
3.What payment methods are accepted for CYDMX256A16-65BVXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYDMX256A16-65BVXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYDMX256A16-65BVXI?
CYDMX256A16-65BVXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYDMX256A16-65BVXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYDMX256A16-65BVXI?
For technical support, including CYDMX256A16-65BVXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYDMX256A16-65BVXI requirements.
6.How does Aetrix verify that CYDMX256A16-65BVXI is sourced from the original manufacturer or authorized distributors?
All CYDMX256A16-65BVXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYDMX256A16-65BVXI meets industry standards.
7.What is the process for return or replacement of CYDMX256A16-65BVXI?
All CYDMX256A16-65BVXI units undergo pre-shipment inspection (PSI). If there is an issue with CYDMX256A16-65BVXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYDMX256A16-65BVXI part is unused and in its original packaging.
Return procedure for CYDMX256A16-65BVXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CYDMX256A16-65BVXI Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…

