Infineon Technologies CYK256K16SCBU-70BVXI
- Part No.:
- CYK256K16SCBU-70BVXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-VFBGA
- Datasheet:
-
CYK256K16SCBU-70BVXI.pdf
- Description:
- IC PSRAM 4MBIT PARALLEL 48VFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,590
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CYK256K16SCBU-70BVXI from Cypress Semiconductor is a 4-Mbit pseudo-static RAM (PSRAM) organized as 256K × 16, supporting asynchronous memory interface with 70 ns read cycle time, 2.7–3.3 V supply range, and ultra-low active current (1 mA @ 1 MHz). It delivers MoBL® low-power performance for battery-constrained portable systems including cellular handsets and handheld computing devices.
For engineers reviewing the CYK256K16SCBU-70BVXI datasheet, CYK256K16SCBU-70BVXI pinout, CYK256K16SCBU-70BVXI application, or CYK256K16SCBU-70BVXI equivalent, key selection criteria include byte-selectable I/O control (BHE/ BLE), automatic CE-based power-down (ISB2 = 17 µA typ), high-impedance tri-state behavior during deselect/write, and VFBGA-48 packaging compatibility with space-constrained PCB layouts.
Technical Context
This PSRAM implements a CMOS-based pseudo-static architecture that emulates SRAM timing while integrating internal refresh logic-eliminating external refresh circuitry. It uses dual chip enables (CE1/CE2) and independent byte enables (BHE/BLE) to support flexible 8-bit or 16-bit data access without bus turnaround overhead.
Power management is implemented via three standby modes: CE1 HIGH/CE2 LOW, CE1 LOW/CE2 HIGH with OE HIGH, or both BHE and BLE HIGH-each reducing ICC to sub-40 µA levels. All I/O pins enter high-impedance state during deselect, write, or output disable, ensuring clean bus sharing in multi-peripheral systems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 4 Mbit (256K × 16) - supports full 16-bit parallel data path with byte-level granularity |
| Access Time | 70 ns max - defines minimum read cycle time for reliable data capture at system clock edges |
| Supply Voltage | 2.7 V to 3.3 V - compatible with modern low-voltage SoC I/O domains and LDO-regulated rails |
| Active Current | 1 mA typ @ 1 MHz - enables >100-hour operation on coin-cell batteries in always-on subsystems |
| Standby Current | 17 µA typ (ISB2) - ensures negligible leakage during sleep modes in portable UI or sensor monitoring |
| I/O Interface | Asynchronous, tri-state - eliminates need for external bus buffers and simplifies address/data multiplexing |
| Operating Temp | −25°C to +85°C - qualified for industrial-grade handheld and automotive infotainment auxiliary modules |
Pinout & Package
Package: 48-ball Very Thin Fine-Pitch Ball Grid Array (VFBGA), 6 mm × 8 mm, 0.5 mm pitch, RoHS-compliant. Pin mapping validated per Cypress Document #38-05526 Rev. *H, Page 3.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A17 | Address Inputs | 18-bit address bus supporting full 256K-word addressing; A17 is MSB |
| I/O0–I/O15 | Bidirectional Data Bus | 16-bit data path with byte-selectable access via BHE/BLE; high-Z when deselected or writing |
| CE1 / CE2 | Chip Enable Controls | Two-level enable hierarchy: CE1 LOW + CE2 HIGH activates device; either HIGH disables and enters ISB2 mode |
| OE | Output Enable | Controls data output assertion; LOW enables read data; HIGH forces I/O into high-Z regardless of CE state |
| WE | Write Enable | Active-LOW signal initiating write cycles; overlapping WE, CE, and BHE/BLE defines write window |
| BHE / BLE | Byte High/Low Enable | Selective 8-bit access: BLE LOW → I/O0–I/O7 active; BHE LOW → I/O8–I/O15 active |
| VCC / VSS | Power / Ground | Single 2.7–3.3 V supply; multiple VSS balls ensure low-noise return paths for high-speed switching |
Key Features
| Feature | Design Value |
|---|---|
| MoBL® Low-Power Architecture | Reduces active ICC to 1 mA @ 1 MHz and standby ISB2 to 17 µA-enabling multi-day battery life in portable UI subsystems |
| Asynchronous PSRAM Core | Integrates hidden refresh logic-no external refresh controller or timing constraints required, unlike DRAM |
| Byte-Selectable I/O Control | BHE/BLE pins allow independent 8-bit reads/writes without glue logic or data bus gating |
| Tri-State Output Management | I/O pins automatically enter high-impedance on deselect, write, or OE HIGH-preventing bus contention in shared-memory systems |
| Industrial Temperature Range | Rated −25°C to +85°C-validated for use in automotive telematics displays and ruggedized handheld terminals |
Applications
| Cellular Handset Baseband | Portable Medical Monitor UI |
|---|---|
Use Scenario: Stores firmware code and real-time display buffers in GSM/UMTS feature phones with tight PCB area and battery budget. IC Role / Device Role / Timing Role: Asynchronous PSRAM providing zero-wait-state execution memory for ARM7/ARM9 baseband processors. Use Value: 70 ns access + 1 mA active current enables responsive UI rendering while extending talk time by >15% vs. standard SRAM. | Use Scenario: Holds graphical overlay data and patient parameter history in battery-powered ECG/SpO₂ monitors. IC Role / Device Role / Timing Role: Standby-optimized memory buffer between microcontroller and monochrome LCD controller. Use Value: 17 µA ISB2 current allows continuous background logging during sleep mode without compromising 72-hour runtime. |
| Industrial HMI Touch Panel | Automotive Infotainment Auxiliary Display |
Use Scenario: Caches GUI assets and touch coordinate history in DIN-rail mounted HMIs operating in factory environments. IC Role / Device Role / Timing Role: Non-refreshing memory co-processor interfacing directly to Cortex-M4 MCU via 16-bit parallel bus. Use Value: Dual CE inputs simplify multi-master arbitration; −25°C to +85°C rating ensures reliability across uncontrolled ambient conditions. | Use Scenario: Supplies dynamic menu content and icon cache for secondary rear-seat entertainment displays. IC Role / Device Role / Timing Role: Low-voltage PSRAM interfaced to video processor ASIC requiring 2.7–3.3 V I/O compliance. Use Value: VFBGA-48 footprint minimizes board area; byte-enable capability reduces bandwidth demand on display controller data bus. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar pseudo-static RAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS61WV25616BLL-70BLI | Same density (256K × 16), 70 ns speed, but 3.3 V only (no 2.7 V min); ISB = 25 µA typ | Lacks wide-voltage flexibility; better suited for fixed 3.3 V systems with higher noise margin tolerance | Choose if board already uses 3.3 V LDO and requires second-source availability |
| Winbond W9825G6JH-75 | SDRAM (not PSRAM); requires external refresh and clock; 75 ns CL3 latency; 3.3 V only | Needs controller-side refresh management and clock tree; incompatible with true SRAM-like interface | Only viable if existing design already supports SDRAM timing and has spare clock resources |
Compared with IS61WV25616BLL-70BLI and W9825G6JH-75, CYK256K16SCBU-70BVXI uniquely combines wide-voltage operation (2.7–3.3 V), integrated refresh, and ultra-low ISB2-making it optimal for battery-critical, space-constrained embedded systems where interface simplicity and power predictability are mandatory.
Availability
CYK256K16SCBU-70BVXI is available at Aetrix Electronics and suitable for cellular handset baseband subsystems, portable medical monitor UIs, and industrial HMI touch panels requiring stable component supply, long-lifecycle support, and guaranteed traceable sourcing.
Supply support for CYK256K16SCBU-70BVXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for embedded, automotive, and industrial markets, with emphasis on low-power innovation and system-level integration.
The MoBL® PSRAM product line targets portable electronics requiring SRAM-like ease-of-use with DRAM-level density and power efficiency-specifically optimized for battery-operated communication and human-interface applications.
FAQ
Does CYK256K16SCBU-70BVXI require external refresh circuitry?
No. It is a pseudo-static RAM with fully integrated refresh logic. The device autonomously manages all row refresh cycles internally-no external refresh signals, timers, or controller intervention are needed. This enables direct drop-in replacement for true SRAM in legacy designs while retaining 4-Mbit density.
What is the function of CE1 and CE2, and can they be tied together?
CE1 and CE2 form a two-input enable hierarchy: the device activates only when CE1 is LOW and CE2 is HIGH. They cannot be tied together-doing so prevents activation. This dual-enable structure supports multi-chip select decoding and enables precise power-down control in systems with multiple memory devices sharing the same bus.
How does byte enable (BHE/BLE) affect power consumption during partial writes?
Asserting only BLE (for lower byte) or BHE (for upper byte) reduces dynamic switching activity on half the I/O bus, lowering transient current spikes. While ICC spec is measured across full 16-bit operation, selective byte writes measurably decrease average power in burst-oriented applications like GUI glyph updates or sensor data streaming.
Is the VFBGA-48 package compatible with standard reflow profiles for lead-free assembly?
Yes. The CYK256K16SCBU-70BVXI's VFBGA-48 package is qualified for IPC/JEDEC J-STD-020D-compliant lead-free reflow, with peak temperature up to 260°C. Cypress specifies thermal resistance θJA = 55°C/W and θJC = 17°C/W, confirming suitability for standard PCB thermal pad layouts and automated SMT lines.
CYK256K16SCBU-70BVXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 48-VFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- PSRAM
- Technology:
- PSRAM (Pseudo SRAM)
- Memory Size:
- 4Mbit
- Memory Organization:
- 256K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 70ns
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.3V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-VFBGA (6x8)
CYK256K16SCBU-70BVXI FAQ
1.How can I place an order for CYK256K16SCBU-70BVXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CYK256K16SCBU-70BVXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYK256K16SCBU-70BVXI reliable?
The price and inventory of CYK256K16SCBU-70BVXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYK256K16SCBU-70BVXI is usually 5 days.
3.What payment methods are accepted for CYK256K16SCBU-70BVXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYK256K16SCBU-70BVXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYK256K16SCBU-70BVXI?
CYK256K16SCBU-70BVXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYK256K16SCBU-70BVXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYK256K16SCBU-70BVXI?
For technical support, including CYK256K16SCBU-70BVXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYK256K16SCBU-70BVXI requirements.
6.How does Aetrix verify that CYK256K16SCBU-70BVXI is sourced from the original manufacturer or authorized distributors?
All CYK256K16SCBU-70BVXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYK256K16SCBU-70BVXI meets industry standards.
7.What is the process for return or replacement of CYK256K16SCBU-70BVXI?
All CYK256K16SCBU-70BVXI units undergo pre-shipment inspection (PSI). If there is an issue with CYK256K16SCBU-70BVXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYK256K16SCBU-70BVXI part is unused and in its original packaging.
Return procedure for CYK256K16SCBU-70BVXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CYK256K16SCBU-70BVXI Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…
Electronic devices and circuits guide covering passive components, semiconductors, analog and digital circuits, circuit theory, practical calculations, troubleshooting, datasheet selection, and learnin…

