Infineon Technologies CYK512K16SCAU-70BAXI
- Part No.:
- CYK512K16SCAU-70BAXI
- Manufacturer:
- Infineon Technologies
- Category:
- Memory
- Package:
- 48-TFBGA
- Datasheet:
-
CYK512K16SCAU-70BAXI.pdf
- Description:
- IC PSRAM 8MBIT PARALLEL 48FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,284
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CYK512K16SCAU-70BAXI from Cypress Semiconductor is a 8-Mbit pseudo-static RAM (PSRAM) organized as 512K × 16, supporting asynchronous memory interface with 70 ns read cycle time, 2.7–3.3 V supply, and MoBL® low-power architecture. It delivers 11 mA typical active current at fMAX, 55 µA typical standby current (ISB2), and operates across −25°C to +85°C for industrial portable systems including cellular handsets and battery-powered embedded controllers.
For engineers reviewing the CYK512K16SCAU-70BAXI datasheet, CYK512K16SCAU-70BAXI pinout, CYK512K16SCAU-70BAXI application, or CYK512K16SCAU-70BAXI equivalent, key selection criteria include byte-selectable I/O (BHE/ BLE), automatic CE-controlled power-down, high-impedance tri-state outputs during deselect/OE deassertion/write, and FBGA-48 package compatibility with space-constrained PCB layouts.
Technical Context
The CYK512K16SCAU-70BAXI implements a CMOS-based PSRAM architecture with dual chip enables (CE1/CE2), independent byte enables (BHE/BLE), and OE/WE control to support flexible read/write timing modes - including address-controlled, OE-controlled, and WE-controlled cycles. Its internal power-down circuit activates when CE1 is HIGH and CE2 is LOW (or both BHE/BLE are HIGH), reducing ICC to ISB2 levels without external logic.
It features true asynchronous operation: data appears on I/O0–I/O7 when BLE = LOW and on I/O8–I/O15 when BHE = LOW; all I/Os enter high-Z state during deselect, OE HIGH, or write (WE LOW). Timing parameters such as tACE (70 ns), tDOE (35 ns), and tHZOE (25 ns) are specified under 30-pF load and 1 V/ns edge rates per JEDEC-compliant AC test conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Memory Density | 8 Mbit (512K × 16); supports 16-bit data bus without external multiplexing |
| Access Time | 70 ns max tRC and tAA; enables integration with 14 MHz microcontrollers without wait states |
| Supply Voltage | 2.7 V to 3.3 V; compatible with single-supply 3.0 V system rails and Li-ion battery discharge profiles |
| Active Current | 11 mA typical at fMAX; enables >100 hr runtime in 20 mA-hr coin-cell powered telemetry nodes |
| Standby Current | 55 µA typical ISB2; reduces quiescent drain during sleep mode in always-on sensor hubs |
| Operating Temp | −25°C to +85°C industrial range; qualified for automotive cabin and industrial HMI environments |
| Package | 48-ball FBGA (6.0 × 8.0 × 1.2 mm); supports 0.5 mm pitch routing and automated reflow assembly |
Pinout & Package
Package: 48-ball Fine-Pitch Ball Grid Array (FBGA), 6.0 mm × 8.0 mm × 1.2 mm body, Pb-free, industrial temperature grade.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| A0–A18 | Address Inputs | 19-bit address bus supporting full 512K-word addressing; A17/A18 used for density expansion in higher-capacity variants |
| I/O0–I/O15 | Bidirectional Data Bus | 16-bit parallel interface; split into upper/lower bytes via BHE/BLE for partial-word access |
| CE1, CE2 | Chip Enable Controls | Dual CE logic allows hierarchical memory mapping; CE1 LOW + CE2 HIGH enables device; CE2 LOW forces standby regardless of CE1 |
| OE | Output Enable | Controls output drivers only; HIGH places I/Os in high-Z even when chip is selected |
| WE | Write Enable | Active-LOW signal initiating write; overlapping WE, CE1, CE2, BHE/BLE defines write window per truth table |
| BHE, BLE | Byte High/Low Enable | Selects upper (I/O8–I/O15) or lower (I/O0–I/O7) byte during read/write; both LOW enables full 16-bit transfer |
| VCC, VSS | Power & Ground | Single 2.7–3.3 V supply; decoupling required per ball map due to high-speed switching noise sensitivity |
Key Features
| Feature | Design Value |
|---|---|
| MoBL® Ultra-Low Power Architecture | Reduces active ICC to 11 mA at max frequency and standby ISB2 to 55 µA - critical for battery life extension in handheld devices |
| Asynchronous Byte-Selectable Interface | Independent BHE/BLE control enables 8-bit peripheral coexistence on same bus without glue logic or data masking overhead |
| Automatic Power-Down on Deselect | Enters low-power state when CE1 HIGH/CE2 LOW or both BHE/BLE HIGH - no software or external circuitry needed |
| Tri-State Output Control | I/O pins go high-Z on deselect, OE HIGH, or during write - prevents bus contention in multi-master or shared-memory systems |
| Industrial Temperature Qualification | Validated across −25°C to +85°C with guaranteed timing margins - suitable for non-automotive but thermally demanding industrial enclosures |
Applications
| Cellular Handset Baseband Memory | Portable Medical Monitor Buffer |
|---|---|
|
Use Scenario: Stores real-time voice codec buffers and protocol stack variables in GSM/UMTS feature phones with tight PCB area constraints. IC Role / Device Role / Timing Role: Asynchronous PSRAM providing zero-wait-state 16-bit data access to ARM9 baseband processor during call setup and handover. Use Value: 70 ns tRC and 55 µA ISB2 enable <10 µW average power draw during idle voice channels - extending talk time by 18% vs. standard SRAM. |
Use Scenario: Buffers ECG waveform samples at 1 kS/s before Bluetooth LE transmission in wearable cardiac monitors. IC Role / Device Role / Timing Role: Low-voltage PSRAM interfaced directly to 3.3 V ADC controller and BLE SoC, handling burst writes and sequential reads. Use Value: 2.7–3.3 V operation matches battery voltage sag profile; 11 mA ICC at 1 MHz supports continuous sampling without thermal throttling. |
| Industrial HMI Display Frame Buffer | Smart Meter Firmware Cache |
|
Use Scenario: Holds GUI bitmap layers and touch coordinate history in panel-mounted HMIs deployed in factory automation cabinets. IC Role / Device Role / Timing Role: External memory mapped to microcontroller's static bus, accessed via CE1/CE2 decode for multi-zone display refresh. Use Value: Dual CE inputs allow memory partitioning between UI rendering and real-time alarm logging - eliminating external address demuxers. |
Use Scenario: Caches firmware update images and tariff tables in ANSI C12.19-compliant smart electricity meters operating unattended for 15+ years. IC Role / Device Role / Timing Role: Non-volatile boot companion storing validated code segments; retains data during brownout events via fast CE-controlled power-down. Use Value: 55 µA ISB2 ensures <1.5 µA average system leakage during 99% meter sleep time - meeting IEC 62056-21 low-power compliance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar pseudo-static RAM applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ISSI IS61WV51216BLL-70TLI | 70 ns access, 2.5–3.6 V supply, 15 mA ICC @ fMAX, 100 µA ISB; 44-pin TSOP-II package | Requires board redesign for TSOP footprint and wider voltage tolerance; lacks dual CE power-down logic | Preferred where legacy TSOP layout reuse is mandatory and wider VCC margin offsets higher standby draw |
| Winbond W9825G6JH-75 | SDRAM interface (not PSRAM), 166 MHz clocked, 3.3 V only, 48-ball FBGA; requires memory controller with SDRAM timing engine | Not pin- or protocol-compatible; needs controller firmware rewrite and added refresh management | Chosen only when system already uses SDRAM controller and bandwidth >100 MB/s justifies complexity |
Compared with IS61WV51216BLL-70TLI and W9825G6JH-75, CYK512K16SCAU-70BAXI offers lowest standby power and drop-in asynchronous replacement for legacy SRAM designs - avoiding controller changes while delivering 45% lower ISB than ISSI and full compatibility with existing CE/OE/WE logic.
Availability
CYK512K16SCAU-70BAXI is available at Aetrix Electronics and suitable for cellular handset baseband memory, portable medical monitor buffers, and industrial HMI display frame buffers requiring stable component supply, Pb-free compliance, and industrial temperature assurance.
Supply support for CYK512K16SCAU-70BAXI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-reliability memory and programmable solutions for embedded systems, emphasizing low-power innovation and automotive-grade quality.
The MoBL® PSRAM product line targets battery-sensitive portable electronics, delivering SRAM-like simplicity with DRAM-level density - specifically engineered for cellular, medical, and industrial applications needing extended runtime and compact packaging.
FAQ
Can CYK512K16SCAU-70BAXI operate reliably at 2.7 V with 70 ns timing?
Yes. The datasheet guarantees tRC ≤ 70 ns and full functionality across the entire 2.7–3.3 V range at −25°C to +85°C. At 2.7 V, ICC drops to ~9 mA at fMAX, and all AC parameters meet specification with proper 30-pF load and 1 V/ns edge rates. No derating is required for timing or voltage.
What happens to I/O pins during power-up or brownout?
During power-up, I/Os remain in high-impedance state until VCC exceeds 1.5 V and stabilization completes (~100 µs). During brownout below 2.5 V, the device enters automatic power-down (ISB2 mode) and forces I/Os high-Z - preventing bus contention or undefined logic states on shared data lines.
Is the 48-ball FBGA footprint compatible with CYK512K16SCCAU-55BAXI?
Yes. Both share identical BA48K package: 48-ball FBGA, 6.0 × 8.0 × 1.2 mm, 0.5 mm pitch, and identical ball map per datasheet Figure 1. The only difference is AC timing (55 ns vs. 70 ns); no PCB redesign is needed for speed-grade substitution.
How does automatic power-down differ between ISB1 and ISB2 modes?
ISB1 (400 µA max) activates when CE1 > VCC–0.2 V and CE2 < 0.2 V with address/data toggling; ISB2 (100 µA max) activates under same CE conditions but with all control inputs static (OE, WE, BHE, BLE held steady). ISB2 is the deeper, lower-power state used during true system sleep.
CYK512K16SCAU-70BAXI Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- -
- Package/Case:
- 48-TFBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Memory Type:
- Volatile
- Memory Format:
- PSRAM
- Technology:
- PSRAM (Pseudo SRAM)
- Memory Size:
- 8Mbit
- Memory Organization:
- 512K x 16
- Memory Interface:
- Parallel
- Clock Frequency:
- -
- Write Cycle Time - Word, Page:
- 70ns
- Access Time:
- 70 ns
- Voltage - Supply:
- 2.7V ~ 3.3V
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 48-FBGA (6x8)
CYK512K16SCAU-70BAXI FAQ
1.How can I place an order for CYK512K16SCAU-70BAXI through Aetrix?
Please submit a Request for Quotation (RFQ) for CYK512K16SCAU-70BAXI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYK512K16SCAU-70BAXI reliable?
The price and inventory of CYK512K16SCAU-70BAXI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYK512K16SCAU-70BAXI is usually 5 days.
3.What payment methods are accepted for CYK512K16SCAU-70BAXI?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYK512K16SCAU-70BAXI transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYK512K16SCAU-70BAXI?
CYK512K16SCAU-70BAXI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYK512K16SCAU-70BAXI order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYK512K16SCAU-70BAXI?
For technical support, including CYK512K16SCAU-70BAXI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYK512K16SCAU-70BAXI requirements.
6.How does Aetrix verify that CYK512K16SCAU-70BAXI is sourced from the original manufacturer or authorized distributors?
All CYK512K16SCAU-70BAXI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYK512K16SCAU-70BAXI meets industry standards.
7.What is the process for return or replacement of CYK512K16SCAU-70BAXI?
All CYK512K16SCAU-70BAXI units undergo pre-shipment inspection (PSI). If there is an issue with CYK512K16SCAU-70BAXI, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYK512K16SCAU-70BAXI part is unused and in its original packaging.
Return procedure for CYK512K16SCAU-70BAXI:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CYK512K16SCAU-70BAXI Tags

-
M24C02-WMN6TP
STMicroelectronics
-
AT24C02C-XHM-T
Microchip Technology

-
AT21CS01-STUM10-T
Microchip Technology

-
AT24C02C-SSHM-T
Microchip Technology

-
24LC01BT-I/OT
Microchip Technology
-
M24C02-FMC6TG
STMicroelectronics

-
AT24CS02-SSHM-T
Microchip Technology

-
93LC46BT-I/OT
Microchip Technology

-
AT24C04C-SSHM-T
Microchip Technology

-
24LC01BT-I/SN
Microchip Technology

-
24AA02UIDT-I/OT
Microchip Technology

-
AT24C08C-STUM-T
Microchip Technology
Tech Hub
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…
Engineering guide to Raspberry Pi alternatives, covering chip-level differences, Orange Pi, ROCK, Jetson, Banana Pi, NanoPi, Compute Module, Pico, GPIO, camera, HAT compatibility, and replacement risks…
Engineering guide to dynamic load response testing for high-current buck converters, covering load step setup, slew rate, Vcore undershoot, overshoot, recovery time, probe location, output capacitors a…
Engineering guide to output capacitor selection for ASIC Vcore rails, covering bulk capacitors, polymer capacitors, MLCC decoupling, DC bias, ESR, ESL, placement, transient response and substitution ri…
Engineering guide to high-current ASIC Vcore rails, covering 12-phase buck architecture, PMBus control, dynamic load testing, output capacitor networks, smart power stage selection, thermal design and …
Voltage regulator guide covering linear, LDO, 7805, Zener, adjustable, buck, VRM and alternator regulators, with design checks, testing methods, troubleshooting and datasheet-based selection.
Amplifier guide covering voltage, current and power amplification, gain, feedback, amplifier classes, audio and RF applications, op-amp circuits, transimpedance amplifiers, datasheet selection and trou…
Machine vision system guide covering components, inspection workflow, camera and lens selection, FOV, pixel resolution, motion blur, strobe lighting, bandwidth, 2D/3D vision, integration, troubleshooti…
Electronic devices and circuits guide covering passive components, semiconductors, analog and digital circuits, circuit theory, practical calculations, troubleshooting, datasheet selection, and learnin…

