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Infineon Technologies CYP15G0201DXB-BBC

Part No.:
CYP15G0201DXB-BBC
Manufacturer:
Infineon Technologies
Category:
Telecom
Package:
196-LBGA
Datasheet:
AetrixCYP15G0201DXB-BBC.pdf
Description:
IC TELECOM INTERFACE 196FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,392

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Product details

Overview

CYP15G0201DXB-BBC from Cypress Semiconductor Corporation is a dual-channel HOTLink II™ transceiver IC for high-speed serial point-to-point interconnects in telecom and video infrastructure. It supports 195–1500 MBaud per channel, delivers 6 Gbps aggregate throughput, features integrated 8B/10B encoding/decoding, internal PLLs, and operates from a single 3.3V supply in a 196-ball BGA package. Used in base station backplanes and SMPTE-compliant video transport systems.

For engineers reviewing the CYP15G0201DXB-BBC datasheet, CYP15G0201DXB-BBC pinout, CYP15G0201DXB-BBC application, or CYP15G0201DXB-BBC equivalent, key selection criteria include serial data rate range (195–1500 MBaud), dual-channel bonding capability, PECL-compatible differential I/O, built-in BIST, and MultiFrame™ framer support for byte alignment and low-latency operation.

Technical Context

The CYP15G0201DXB-BBC implements two independent transmit/receive channels with fully integrated PLL-based clock recovery, enabling synchronous or bonded 16-bit parallel bus transport over optical fiber or copper. Each channel supports selectable 8B/10B encoding, parity generation/checking, and skew alignment across multiple bytes.

Its MultiFrame™ Receive Framer provides bit- and byte-level alignment with comma detection (K28.5), configurable single/multi-byte framing, and low-latency mode. The transmit path includes optional Phase-Align Buffer; the receive path includes optional Elasticity Buffer-both configurable per channel via control pins like TXCKSEL, RXCKSEL, and TXMODE[1:0].

Key Specifications

ParameterValue and Actual Design Meaning
Serial Data Rate195–1500 MBaud per channel; enables flexible link speed adaptation across ESCON, DVB-ASI, Fibre Channel, and Gigabit Ethernet physical layers.
Aggregate Throughput6 Gbps; achieved by bonding two 3-Gbps channels, supporting wide parallel bus replacement over long distances.
Encoding SchemeConfigurable 8B/10B or 10-bit unencoded; ensures DC balance and run-length control for reliable transmission over AC-coupled media.
Supply VoltageSingle 3.3V ±5%; eliminates need for multi-rail power design and simplifies system-level power delivery.
Power Dissipation1.8W typical at 3.3V; optimized for dense backplane and base station card layouts with constrained thermal budgets.
Package196-ball BGA (14×14 mm, 0.8 mm pitch); Pb-free option available; matches standard PCB assembly processes for telecom hardware.
Technology Node0.25 μm BiCMOS; balances high-speed analog performance (PECL I/O) with digital logic density for full transceiver integration.

Pinout & Package

Package: 196-ball fine-pitch BGA (14 mm × 14 mm, 0.8 mm pitch), RoHS-compliant, with thermal pad exposed on bottom side for enhanced heat dissipation in high-throughput applications.

Pin/TerminalCircuit RoleDesign Meaning
INA1±, INA2±, INB1±, INB2±Differential PECL-compatible serial inputsAccept high-speed serial data (195–1500 MBaud); internal DC restoration eliminates external biasing components.
OUTA1±, OUTA2±, OUTB1±, OUTB2±Differential PECL-compatible serial outputsDrive 50Ω transmission lines directly; source-matched output impedance avoids external termination resistors.
TXDA[7:0], TXDB[7:0]LVTTL parallel data inputsSynchronous 8-bit parallel interface; sampled by TXCLKx or REFCLK; supports encoded or raw 10-bit input when encoder bypassed.
RXDA[7:0], RXDB[7:0]LVTTL parallel data outputsDeliver recovered 8-bit characters post-deserialization and 8B/10B decoding; aligned to RXCLKC+, RXCLKB+, or local reference clock.
TXCKSEL, RXCKSEL3-level clock source selectConfigure transmit/receive parallel interface clocking: REFCLK, TXCLKA/B, or common clock; enables flexible system timing architecture.
BISTLE, FRAMCHA, TXPERA/BBuilt-in self-test and status signalingEnable at-speed link validation; indicate parity errors, phase-align buffer faults, and BIST completion without external test equipment.

Key Features

FeatureDesign Value
Dual-channel bondingCombines two 8-bit paths into one synchronized 16-bit interface, eliminating inter-lane skew concerns in wide-bus transport.
MultiFrame™ Receive FramerSupports both K28.5 comma detection and programmable byte alignment, enabling robust synchronization under pathological data patterns (e.g., SMPTE 259M).
Integrated PLL clock recoveryEliminates need for external PLL components; recovers embedded clock from serial stream with jitter tolerance compliant to CPRI and OBSAI-RP3.
Selectable parity generation/checkingPer-channel parity enable/disable via PARCTL; error detection triggers automatic C0.7 character substitution for remote fault indication.
JTAG boundary scan & BISTFully IEEE 1149.1-compliant test access; BIST runs at full link speed to validate serial path integrity during production or field diagnostics.

Applications

Base Station Remote Radio Head InterconnectSDI Video Transport over Fiber

Use Scenario: Connecting BBUs to RRHs in LTE/5G macro base stations using CPRI-compliant links over multimode fiber.

IC Role / Device Role / Timing Role: Dual-channel serializer/deserializer providing deterministic latency, clock recovery, and 10-bit encoded transport at 1536 MBaud (CPRI Option 3).

Use Value: Enables precise sample-aligned I/Q data transfer with sub-nanosecond jitter tolerance, meeting CPRI Option 3 timing accuracy requirements.

Use Scenario: Converting SMPTE 259M/292M parallel video signals to serial fiber links for broadcast studio routing and distribution.

IC Role / Device Role / Timing Role: HOTLink II transceiver implementing pathological-pattern-robust framer and 8B/10B encoding for SD/HD-SDI compliance.

Use Value: Passes EG34-1999 SMPTE pathological tests (20-zero/one bursts, 44-zero/one bursts), ensuring error-free transport of uncompressed video payloads.

High-Density Switch Backplane LinkMedical Imaging Data Acquisition

Use Scenario: Replacing parallel bus traces between line cards and fabric modules in modular Ethernet switches operating at 10 Gbps aggregate bandwidth.

IC Role / Device Role / Timing Role: Dual-channel transceiver performing 8B/10B encoding, skew compensation, and elastic buffering to absorb board-level timing variations.

Use Value: Reduces signal count by >80% versus parallel interfaces while maintaining deterministic latency and bit-error-rate <1e−12 at 1500 MBaud.

Use Scenario: Transmitting real-time ultrasound or MRI sensor data from acquisition front-end to processing unit over shielded copper cables.

IC Role / Device Role / Timing Role: High-integrity serial link IC with built-in BIST and link quality indicators (analog/digital signal detect) for safety-critical diagnostics.

Use Value: Provides continuous link health monitoring and at-speed validation, satisfying IEC 62304 Class C software safety requirements for diagnostic imaging systems.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed serial transceiver applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
MAX3875ASingle-channel 155 Mbps–3.2 Gbps transceiver; no integrated 8B/10B encoder; requires external clock synthesis.Targeted at SONET/SDH OC-48 and lower-bandwidth telecom links-not CPRI/OBSAI/SMPTE compliant.Select only if 8B/10B encoding, dual-channel bonding, or SMPTE pathological compliance are not required.
TI TLK2711Single-channel 1.25–2.5 Gbps transceiver; supports 8B/10B but lacks MultiFrame™ framer, BIST, and PECL I/O; uses LVDS outputs.Designed for Gigabit Ethernet and Fibre Channel; no SMPTE or CPRI qualification testing documented.Choose when cost-sensitive designs require basic 8B/10B transport without advanced framer or link diagnostics.

Compared with MAX3875A and TLK2711, the CYP15G0201DXB-BBC uniquely integrates dual-channel bonding, SMPTE-compliant framer logic, and on-chip BIST-making it the only solution qualified for CPRI Option 3, OBSAI-RP3, and broadcast video transport where deterministic latency and pathological pattern immunity are mandatory.

Availability

CYP15G0201DXB-BBC is available at Aetrix Electronics and suitable for base station radio interfaces, SMPTE-compliant video transport, and high-density switch backplanes requiring stable component supply and long-term lifecycle support.

Supply support for CYP15G0201DXB-BBC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor Corporation, now part of Infineon Technologies, designs high-performance mixed-signal ICs for communications, computing, and industrial applications.

The HOTLink II product line was developed specifically for replacing parallel buses with robust, standards-compliant serial links in telecom infrastructure, broadcast video, and high-reliability embedded systems.

FAQ

Does CYP15G0201DXB-BBC support SMPTE 259M/292M compliance?

No-CYP15G0201DXB-BBC is the non-pathological-test-compliant variant. Only CYV15G0201DXB meets SMPTE EG34-1999 requirements for 259M/292M. CYP15G0201DXB-BBC supports the same signaling rates but lacks verification against pathological patterns like 44-zero bursts or 20-one repetitions.

What clocking options are available for the parallel interface?

The device supports three clocking modes per channel: REFCLK (global reference), TXCLKA/B (independent channel clocks), or common clock (RXCKSEL = LOW/HIGH). Configuration is set via TXCKSEL/RXCKSEL pins, enabling synchronous or asynchronous host interface timing.

Can the 8B/10B encoder/decoder be bypassed?

Yes-when TXMODE[1:0] = LL, the encoder/decoder is disabled. The transceiver accepts and outputs raw 10-bit characters on the parallel interface, allowing integration with external scramblers or pre-encoded sources such as CPRI-compliant FPGA logic.

Is JTAG boundary scan supported on CYP15G0201DXB-BBC?

Yes-fully IEEE 1149.1-compliant boundary scan is implemented. TDI, TDO, TMS, TRSTZ, and TCK pins are dedicated and functional. Scan chain access enables manufacturing test, interconnect verification, and in-system debug without requiring external test fixtures.

CYP15G0201DXB-BBC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HOTlink II™
Package/Case:
196-LBGA
Packaging:
Tray
Product Status:
Obsolete
Function:
Transceiver
Interface:
LVTTL
Number of Circuits:
2
Voltage - Supply:
3.135V ~ 3.465V
Current - Supply:
570mA
Power (Watts):
-
Operating Temperature:
0°C ~ 70°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
196-FBGA (15x15)

CYP15G0201DXB-BBC FAQ

1.How can I place an order for CYP15G0201DXB-BBC through Aetrix?

Please submit a Request for Quotation (RFQ) for CYP15G0201DXB-BBC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CYP15G0201DXB-BBC reliable?

The price and inventory of CYP15G0201DXB-BBC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYP15G0201DXB-BBC is usually 5 days.

3.What payment methods are accepted for CYP15G0201DXB-BBC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYP15G0201DXB-BBC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CYP15G0201DXB-BBC?

CYP15G0201DXB-BBC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CYP15G0201DXB-BBC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CYP15G0201DXB-BBC?

For technical support, including CYP15G0201DXB-BBC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYP15G0201DXB-BBC requirements.

6.How does Aetrix verify that CYP15G0201DXB-BBC is sourced from the original manufacturer or authorized distributors?

All CYP15G0201DXB-BBC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYP15G0201DXB-BBC meets industry standards.

7.What is the process for return or replacement of CYP15G0201DXB-BBC?

All CYP15G0201DXB-BBC units undergo pre-shipment inspection (PSI). If there is an issue with CYP15G0201DXB-BBC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CYP15G0201DXB-BBC part is unused and in its original packaging.

Return procedure for CYP15G0201DXB-BBC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CYP15G0201DXB-BBC Tags

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