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Infineon Technologies CYP15G0401DXB-BGC

Part No.:
CYP15G0401DXB-BGC
Manufacturer:
Infineon Technologies
Category:
Telecom
Package:
256-BGA Exposed Pad
Datasheet:
AetrixCYP15G0401DXB-BGC.pdf
Description:
IC TELECOM INTERFACE 256BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,650

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Product details

Overview

CYP15G0401DXB-BGC from Cypress Semiconductor is a quad-channel HOTLink II™ transceiver IC for high-speed serial point-to-point interconnects, supporting 195–1500 MBaud per channel with 8B/10B encoding, dual PECL-compatible differential I/O per channel, and synchronous multi-channel bonding up to 32-bit width. It operates on a single 3.3V supply, delivers 12 Gbps aggregate throughput, and targets backplane, video transport, and telecom infrastructure links.

For engineers reviewing the CYP15G0401DXB-BGC datasheet, CYP15G0401DXB-BGC pinout, CYP15G0401DXB-BGC application, or CYP15G0401DXB-BGC equivalent, key selection criteria include SMPTE/OBSAI compliance scope, per-channel BIST capability, skew alignment support, Elasticity Buffer configuration, and PECL driver termination requirements without external bias resistors.

Technical Context

The CYP15G0401DXB-BGC implements four independent transmit/receive channels with fully integrated PLL-based clock recovery and serialization/deserialization. Each channel supports selectable 8-bit, 16-bit, or 32-bit bonding modes and configurable input/output clocking (recovered vs. local reference).

Its MultiFrame™ Receive Framer provides bit- and byte-level alignment with K28.5 comma detection, while optional Elasticity Buffer (RX) and Phase Align Buffer (TX) enable jitter tolerance and phase compensation across bonded links. The device uses 0.25µm BiCMOS technology and requires no external PLL components.

Key Specifications

ParameterValue and Actual Design Meaning
Serial data rate195–1500 MBaud per channel; enables interoperability with ESCON, DVB-ASI, Fibre Channel, and Gigabit Ethernet physical layers.
Aggregate throughput12 Gbps; achieved via four synchronized 32-bit bonded channels, eliminating parallel bus skew over long traces or cables.
Encoding mode8B/10B encode/decode or bypass; ensures DC balance and run-length control for reliable fiber/copper transmission.
Supply voltageSingle 3.3V ±5%; simplifies power delivery and eliminates multi-rail design complexity in dense backplanes.
Power dissipation2.5W typical; optimized for thermally constrained telecom and broadcast equipment with 256-ball thermally enhanced BGA package.
I/O interfaceSynchronous LVTTL parallel; supports flexible clocking schemes including recovered RXCLK or local REFCLK for system timing decoupling.
ComplianceNon-SMPTE/OBSAI variant; excludes pathological test requirements of CYV/CYW variants, enabling cost-optimized deployment where full standard conformance is not mandated.

Pinout & Package

256-ball thermally enhanced BGA (17 mm × 17 mm, 1.0 mm pitch), Pb-free option available. Package supports high-density PCB routing and efficient heat dissipation in multi-layer backplane applications.

Pin/TerminalCircuit RoleDesign Meaning
INA1±, INA2±
INB1±, INB2±
INC1±, INC2±
IND1±, IND2±
Dual differential PECL-compatible receive inputs per channelAccept serialized data from optical modules or copper links; internal DC restoration eliminates need for AC-coupling capacitors.
OUTA1±, OUTA2±
OUTB1±, OUTB2±
OUTC1±, OUTC2±
OUTD1±, OUTD2±
Dual differential PECL-compatible transmit outputs per channelDrive 50Ω transmission lines directly; source-matched output stages remove requirement for external bias resistors.
TXDA[7:0]–TXDD[7:0]
RXDA[7:0]–RXDD[7:0]
LVTTL parallel data I/O (8-bit per channel)Interface with FPGA/ASIC logic; supports byte-wide or bonded multi-byte transfers with programmable parity and framing control.
REFCLK±, TXCLKO±, RXCLKA±–RXCLKD±Differential clock inputs/outputsEnable low-jitter clock distribution; REFCLK± feeds internal PLLs, while RXCLKx± provide recovered timing to destination logic.
BOND_ALL, BONDST[1:0], BOND_INHMulti-channel bonding controlConfigure inter-channel synchronization: 4×8-bit, 2×16-bit, or 1×32-bit operation; BOND_ALL enables chip-wide alignment across all four channels.

Key Features

FeatureDesign Value
Per-channel Built-In Self-Test (BIST)Enables at-speed link validation without external test equipment; pulses TXPERx on completion of 511-character sequence for pass/fail indication.
Selectable Elasticity Buffer (RX)Compensates for PVT-induced clock domain mismatches between transmitter and receiver; configurable depth supports variable latency budgets.
Phase Align Buffer (TX)Adjusts transmit path phase relative to reference clock; critical for deterministic timing in bonded multi-channel systems.
JTAG boundary scanSupports IEEE 1149.1-compliant board-level interconnect testing; verifies solder joints and trace integrity on high-pin-count BGA assemblies.
Link Quality Indicator (LQI)Provides analog signal detect and digital signal detect per channel; enables real-time link health monitoring in redundant video or telecom paths.

Applications

Video Backhaul TransportTelecom Baseband Processing

Use Scenario: Transmitting uncompressed HD/SDI video streams across router backplanes or chassis interconnects.

IC Role / Device Role / Timing Role: Serializes parallel pixel data from video processors and deserializes at display or recording endpoints with sub-character-cycle latency.

Use Value: Eliminates timing skew across 32-bit wide video buses, enabling error-free transport at 1.485 Gbps (SMPTE 292M-equivalent rates) without custom delay-matching PCB layout.

Use Scenario: Interfacing FPGA-based channelizers with RF front-end ADC/DAC modules in LTE/5G base stations.

IC Role / Device Role / Timing Role: Bridges wide I/Q data paths between digital baseband and radio units using bonded 32-bit lanes with deterministic phase alignment.

Use Value: Maintains sample coherency across multiple antenna elements by synchronizing all four channels to a common recovered clock, reducing inter-carrier phase drift.

High-Density Switch FabricMedical Imaging Data Acquisition

Use Scenario: Connecting line cards to switching fabric ASICs in modular enterprise switches handling 10/40/100GbE traffic.

IC Role / Device Role / Timing Role: Replaces parallel bus interfaces between packet processors and switch fabric controllers with low-pin-count serial links.

Use Value: Reduces connector count and PCB layer count by >60% versus parallel LVDS, while supporting hot-plug link training via BIST and LQI feedback.

Use Scenario: Moving time-critical CT/MRI sensor data from acquisition front-ends to reconstruction engines in real-time imaging systems.

IC Role / Device Role / Timing Role: Provides deterministic-latency, low-jitter serialization of 16-bit ADC samples across isolated power domains.

Use Value: Ensures sub-nanosecond sample alignment across multi-sensor arrays via Elasticity Buffer tuning and recovered clock forwarding, meeting DICOM timing compliance.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed serial transceiver applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CYV15G0401DXBMeets SMPTE 259M/292M pathological test requirements per EG34-1999; supports identical 195–1500 MBaud range.Required for broadcast video equipment certified to SMPTE standards; includes mandatory burst-error resilience testing.Select when full SMPTE compliance is mandated by system certification-not needed for internal backplane links.
CYW15G0401DXBRated for 195–1540 MBaud; compliant with OBSAI-RP3 specification including 1536 MBaud operation.Targeted at wireless infrastructure baseband units requiring OBSAI-defined framer behavior and CPRI-like timing.Choose for 4G/5G RRH interfaces where OBSAI-RP3 framer alignment and 1536 MBaud support are essential.

Compared with CYV15G0401DXB and CYW15G0401DXB, the CYP15G0401DXB-BGC omits SMPTE/OBSAI-specific compliance testing-reducing cost and test overhead-while retaining full functional equivalence for non-standardized high-speed interconnects where link robustness is verified at system level.

Availability

CYP15G0401DXB-BGC is available at Aetrix Electronics and suitable for video backhaul transport, telecom baseband processing, and high-density switch fabric applications requiring stable component supply and long-term industrial lifecycle support.

Supply support for CYP15G0401DXB-BGC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor Corporation, now part of Infineon Technologies, designs high-performance mixed-signal ICs for connectivity, memory, and programmable systems.

The HOTLink II transceiver product line targets high-reliability serial interconnects in broadcast, telecom, and industrial systems-emphasizing deterministic latency, multi-channel synchronization, and seamless integration with FPGA-based signal processing architectures.

FAQ

What is the maximum supported serial data rate for CYP15G0401DXB-BGC?

The CYP15G0401DXB-BGC supports a maximum serial data rate of 1500 MBaud per channel. This is confirmed in the official datasheet (Document #: 38-02002 Rev. *L, Page 2), which specifies the operating range as 195–1500 MBaud for the CYP variant. Note that CYW15G0401DXB extends to 1540 MBaud, but CYP does not.

Does CYP15G0401DXB-BGC require external termination resistors for its PECL outputs?

No. The device integrates source-matched 50Ω drivers for all PECL-compatible outputs (e.g., OUTA1±, OUTA2±), eliminating the need for external bias or termination resistors. This is explicitly stated in the Functional Description (Page 2): "No external bias resistors required" and "Source matched for 50Ω transmission lines."

Can CYP15G0401DXB-BGC operate without 8B/10B encoding?

Yes. The integrated 8B/10B encoder/decoder can be bypassed to accept pre-encoded or scrambled 10-bit data at the parallel interface. The datasheet (Page 2) states: "The integrated 8B/10B Encoder/Decoder may be bypassed for systems that present externally encoded or scrambled data at the parallel interface."

How many differential serial I/O pairs does CYP15G0401DXB-BGC provide?

The device provides eight differential serial I/O pairs: four dual-input (INA1±/INA2±, etc.) and four dual-output (OUTA1±/OUTA2±, etc.) per channel, totaling 16 differential terminals. Pin Configuration diagrams (Pages 6–7) confirm two dedicated PECL-compatible differential pairs per channel (A–D), with explicit labeling of ± signals.

CYP15G0401DXB-BGC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HOTlink II™
Package/Case:
256-BGA Exposed Pad
Packaging:
Tray
Product Status:
Obsolete
Function:
Transceiver
Interface:
LVTTL
Number of Circuits:
4
Voltage - Supply:
3.135V ~ 3.465V
Current - Supply:
830mA
Power (Watts):
-
Operating Temperature:
0°C ~ 70°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
256-L2BGA (27x27)

CYP15G0401DXB-BGC FAQ

1.How can I place an order for CYP15G0401DXB-BGC through Aetrix?

Please submit a Request for Quotation (RFQ) for CYP15G0401DXB-BGC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CYP15G0401DXB-BGC reliable?

The price and inventory of CYP15G0401DXB-BGC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYP15G0401DXB-BGC is usually 5 days.

3.What payment methods are accepted for CYP15G0401DXB-BGC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYP15G0401DXB-BGC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CYP15G0401DXB-BGC?

CYP15G0401DXB-BGC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CYP15G0401DXB-BGC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CYP15G0401DXB-BGC?

For technical support, including CYP15G0401DXB-BGC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYP15G0401DXB-BGC requirements.

6.How does Aetrix verify that CYP15G0401DXB-BGC is sourced from the original manufacturer or authorized distributors?

All CYP15G0401DXB-BGC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYP15G0401DXB-BGC meets industry standards.

7.What is the process for return or replacement of CYP15G0401DXB-BGC?

All CYP15G0401DXB-BGC units undergo pre-shipment inspection (PSI). If there is an issue with CYP15G0401DXB-BGC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CYP15G0401DXB-BGC part is unused and in its original packaging.

Return procedure for CYP15G0401DXB-BGC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CYP15G0401DXB-BGC Tags

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