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Infineon Technologies CYP15G0401DXB-BGI

Part No.:
CYP15G0401DXB-BGI
Manufacturer:
Infineon Technologies
Category:
Telecom
Package:
256-BGA Exposed Pad
Datasheet:
AetrixCYP15G0401DXB-BGI.pdf
Description:
IC TELECOM INTERFACE 256BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,156

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Product details

Overview

CYP15G0401DXB-BGI from Cypress Semiconductor is a quad-channel HOTLink II™ transceiver IC for high-speed serial interconnects, supporting 195–1500 MBaud per channel with 8B/10B encoding, dual PECL-compatible differential I/O per channel, and synchronous multi-channel bonding (up to 32-bit). It enables point-to-point or point-to-multipoint links over fiber, copper, or PCB traces in video backplanes and telecom infrastructure.

For engineers reviewing the CYP15G0401DXB-BGI datasheet, CYP15G0401DXB-BGI pinout, CYP15G0401DXB-BGI application, or CYP15G0401DXB-BGI equivalent, key selection criteria include SMPTE-agnostic data rate range, per-channel BIST capability, selectable elasticity/phase-align buffers, and JTAG boundary scan support for production testability.

Technical Context

The CYP15G0401DXB-BGI implements four independent transmit/receive channels with fully integrated PLL-based clock recovery and serialization/deserialization. Each channel supports configurable 8-bit, 16-bit, or 32-bit bonding modes and operates with either local reference clock or recovered clock alignment.

It features a MultiFrame™ Receive Framer with comma detection (K28.5), bit/byte alignment, and low-latency framer option; the transmit path includes optional phase-align buffer and selectable parity generation/checking, while the receive path offers optional elasticity buffer and per-channel Link Quality Indicator (analog/digital signal detect).

Key Specifications

ParameterValue and Actual Design Meaning
Serial Data Rate195–1500 MBaud per channel; enables interoperability with ESCON, DVB-ASI, Fibre Channel, and Gigabit Ethernet physical layers.
Aggregate Throughput12 Gbps total (4 × 3 Gbps); supports wide-bus transport across backplanes without skew compensation hardware.
Encoding Mode8B/10B encode/decode or bypass; ensures DC balance and run-length control for reliable long-haul transmission.
Supply VoltageSingle 3.3 V supply; eliminates need for multiple rail regulation and simplifies power delivery on dense boards.
Power Dissipation2.5 W typical at 3.3 V; optimized for thermally constrained telecom/video chassis environments.
Package256-ball thermally enhanced BGA; provides low thermal resistance and mechanical stability for high-speed signal integrity.
Process Technology0.25 µm BiCMOS; delivers high-speed analog performance with digital logic integration in single die.

Pinout & Package

256-ball thermally enhanced BGA package (17 mm × 17 mm, 1.0 mm ball pitch), Pb-free option available. Pinout validated per Cypress Document #38-02002 Rev. *L (Pages 6–8).

Pin/TerminalCircuit RoleDesign Meaning
INA1±, INA2±
INB1±, INB2±
INC1±, INC2±
IND1±, IND2±
Dual differential PECL-compatible serial inputs per channelAccept high-speed serial streams; internal DC restoration eliminates external bias networks; 50 Ω source-matched for direct trace coupling.
OUTA1±, OUTA2±
OUTB1±, OUTB2±
OUTC1±, OUTC2±
OUTD1±, OUTD2±
Dual differential PECL-compatible serial outputs per channelDrive optical modules or copper cables directly; edge-rate controlled by signaling rate; no external termination resistors required.
TXDA[7:0]–TXDD[7:0]
RXDA[7:0]–RXDD[7:0]
Synchronous LVTTL parallel interface (8-bit per channel)Supports byte-aligned host CPU/FPGA connection; timing referenced to REFCLK or recovered RXCLK for flexible clock domain bridging.
TXCTA[1:0]–TXCTD[1:0]
RXSTA[2:0]–RXSTD[2:0]
Transmit control / Receive status signalsConfigure encoding mode, parity, bonding, and report link health (signal detect, framing lock, error flags) without software polling overhead.
TCK, TMS, TDI, TDO, TRSTZJTAG boundary scan interfaceEnables IEEE 1149.1-compliant at-speed interconnect testing and system-level diagnostics during manufacturing and field service.

Key Features

FeatureDesign Value
Selectable multi-channel bondingFour 8-bit, two 16-bit, or one 32-bit configuration - reduces FPGA I/O count and simplifies routing of wide buses across backplanes.
Per-channel Built-In Self-Test (BIST)At-speed link validation with deterministic pattern generation/checking - eliminates need for external test equipment during board bring-up.
MultiFrame™ Receive FramerSupports K28.5 comma detection and single/multi-byte alignment - ensures robust synchronization under pathological data patterns (e.g., SMPTE 259M/292M).
Optional Elasticity Buffer (RX)Compensates for PVT-induced clock domain misalignment between transmitter and receiver - enables jitter-tolerant operation without external FIFOs.
Internal PLLs with no external componentsEliminates discrete loop filters and VCO tuning elements - reduces BOM cost and layout sensitivity in high-density designs.

Applications

Video Backplane InterconnectTelecom Baseband Processing

Use Scenario: High-bandwidth interconnection between video processing blades and switching fabric in broadcast routers.

IC Role / Device Role / Timing Role: Quad-channel serializer/deserializer providing deterministic latency and skew-aligned 32-bit parallel bus transport over fiber-optic links.

Use Value: Replaces 64-wire parallel buses with four compact serial lanes, eliminating timing skew and enabling 100+ meter reach without repeaters.

Use Scenario: CPRI-compliant fronthaul between remote radio units (RRUs) and baseband units (BBUs) in LTE/5G infrastructure.

IC Role / Device Role / Timing Role: HOTLink II transceiver implementing CPRI v4.1 data mapping with precise 8B/10B encoding and low-jitter clock recovery.

Use Value: Meets CPRI's 10.1376 Gbps aggregate requirement using four bonded 2.5344 Gbps lanes, with built-in BIST for field-deployable link verification.

High-Performance Computing Switch FabricMedical Imaging Data Acquisition

Use Scenario: Chip-to-chip communication between ASICs and FPGA-based packet processors in modular switch line cards.

IC Role / Device Role / Timing Role: Point-to-point serial bridge replacing parallel memory-mapped interfaces, with JTAG scan for in-system debug and failure isolation.

Use Value: Enables >1 Gbps per lane throughput with sub-10 ns latency and full-duplex operation, reducing PCB layer count and EMI emissions.

Use Scenario: Real-time transfer of uncompressed ultrasound or MRI sensor data from acquisition front-end to reconstruction engine.

IC Role / Device Role / Timing Role: Low-latency, jitter-controlled serial link ensuring deterministic timing for time-critical imaging pipelines.

Use Value: Maintains pixel-perfect data integrity across 1500 MBaud links with built-in elasticity buffer and SMPTE-aligned framer, avoiding frame drops during burst transfers.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed serial transceiver applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
CYV15G0401DXBSMPTE 259M/292M compliant; passes EG34-1999 pathological tests at 270/1485 Mbps.Required for broadcast video systems requiring SMPTE certification.Select CYV variant only when SMPTE compliance is mandated; CYP lacks pathological test validation but supports identical data rates and features otherwise.
CYW15G0401DXBOBSAI-RP3 compliant; supports 1536/768 MBaud OBSAI fronthaul rates; max 1540 MBaud operation.Targeted at legacy OBSAI-based wireless infrastructure deployments.Choose CYW only for OBSAI-RP3 conformance; CYP supports broader standard flexibility (CPRI, DVB-ASI, Fibre Channel) without OBSAI-specific constraints.

Compared with CYV15G0401DXB and CYW15G0401DXB, the CYP15G0401DXB offers maximum protocol flexibility and general-purpose high-speed serial bridging without SMPTE or OBSAI certification overhead-ideal for custom or multi-standard systems where deterministic latency and BIST coverage outweigh standard-specific validation.

Availability

CYP15G0401DXB-BGI is available at Aetrix Electronics and suitable for video backplane interconnect, telecom fronthaul, and high-performance computing switch fabric requiring stable component supply and long-term lifecycle assurance.

Supply support for CYP15G0401DXB-BGI includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a U.S.-based semiconductor company specializing in high-performance mixed-signal ICs for connectivity, memory, and programmable solutions.

The HOTLink II product line was designed for high-reliability, low-latency serial interconnect in bandwidth-constrained systems such as broadcast video, telecom infrastructure, and military/aerospace data links.

FAQ

What is the maximum supported data rate per channel for CYP15G0401DXB-BGI?

The CYP15G0401DXB-BGI supports serial data rates from 195 MBaud to 1500 MBaud per channel, with aggregate throughput up to 12 Gbps across all four channels. This range covers industry standards including CPRI, DVB-ASI, and Gigabit Ethernet physical layers, and is confirmed in Cypress Document #38-02002 Rev. *L.

Does CYP15G0401DXB-BGI require external PLL components?

No. The device integrates fully self-contained PLLs for both transmit and receive paths, eliminating the need for external loop filters, VCOs, or passive components. This simplifies layout, improves jitter performance, and reduces bill-of-materials cost, as specified in the functional description on page 2 of the datasheet.

Can CYP15G0401DXB-BGI operate with externally encoded data?

Yes. The integrated 8B/10B encoder/decoder can be bypassed via configuration pins, allowing direct transport of pre-encoded or scrambled data presented at the LVTTL parallel interface. This mode is explicitly supported for systems that perform encoding upstream, as described in the functional block diagram on page 4.

Is JTAG boundary scan supported on CYP15G0401DXB-BGI?

Yes. The device implements full IEEE 1149.1 JTAG boundary scan with TCK, TMS, TDI, TDO, and TRSTZ pins. It enables at-speed interconnect testing, fault isolation, and in-system programming, as documented in the pin descriptions section (page 8) and functional overview (page 2).

CYP15G0401DXB-BGI Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HOTlink II™
Package/Case:
256-BGA Exposed Pad
Packaging:
Tray
Product Status:
Obsolete
Function:
Transceiver
Interface:
LVTTL
Number of Circuits:
4
Voltage - Supply:
3.135V ~ 3.465V
Current - Supply:
830mA
Power (Watts):
-
Operating Temperature:
-40°C ~ 85°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
256-L2BGA (27x27)

CYP15G0401DXB-BGI FAQ

1.How can I place an order for CYP15G0401DXB-BGI through Aetrix?

Please submit a Request for Quotation (RFQ) for CYP15G0401DXB-BGI on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CYP15G0401DXB-BGI reliable?

The price and inventory of CYP15G0401DXB-BGI are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYP15G0401DXB-BGI is usually 5 days.

3.What payment methods are accepted for CYP15G0401DXB-BGI?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYP15G0401DXB-BGI transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CYP15G0401DXB-BGI?

CYP15G0401DXB-BGI orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CYP15G0401DXB-BGI order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CYP15G0401DXB-BGI?

For technical support, including CYP15G0401DXB-BGI datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYP15G0401DXB-BGI requirements.

6.How does Aetrix verify that CYP15G0401DXB-BGI is sourced from the original manufacturer or authorized distributors?

All CYP15G0401DXB-BGI products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYP15G0401DXB-BGI meets industry standards.

7.What is the process for return or replacement of CYP15G0401DXB-BGI?

All CYP15G0401DXB-BGI units undergo pre-shipment inspection (PSI). If there is an issue with CYP15G0401DXB-BGI, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CYP15G0401DXB-BGI part is unused and in its original packaging.

Return procedure for CYP15G0401DXB-BGI:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CYP15G0401DXB-BGI Tags

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