Infineon Technologies CYP15G0403DXB-BGC
- Part No.:
- CYP15G0403DXB-BGC
- Manufacturer:
- Infineon Technologies
- Category:
- Telecom
- Package:
- 256-BGA Exposed Pad
- Datasheet:
-
CYP15G0403DXB-BGC.pdf
- Description:
- IC TELECOM INTERFACE 256BGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,832
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Product details
Overview
CYP15G0403DXB-BGC from Cypress Semiconductor is an independent-clock quad HOTLink II™ transceiver IC for high-speed serial interconnects, supporting 195–1500 MBaud per channel with dual PECL-compatible differential I/O per channel, 8B/10B encoding/decoding, and integrated PLL-based clock recovery. It enables multi-protocol backplane and fiber-optic links in telecom aggregation equipment.
For engineers reviewing the CYP15G0403DXB-BGC datasheet, CYP15G0403DXB-BGC pinout, CYP15G0403DXB-BGC application, or CYP15G0403DXB-BGC equivalent, key selection criteria include per-channel independent reference clocking, aggregate 12 Gbps throughput, JTAG boundary scan support, BIST-enabled at-speed link validation, and compliance with ESCON, DVB-ASI, SMPTE-259M/292M, and Gigabit Ethernet physical layer requirements.
Technical Context
This transceiver implements four fully independent serial channels, each with dedicated transmit PLL, receive clock-and-data-recovery (CDR) PLL, and configurable 8B/10B encoder/decoder. Each channel accepts LVTTL parallel data (8-bit or pre-encoded 10-bit) and outputs dual PECL-compatible differential serial streams at 10× or 20× the local reference clock rate.
The device integrates MultiFrame™ framer logic for bit/byte alignment, comma detection (K28.5), and low-latency framing modes; supports synchronous LVTTL parallel interface with selectable input/output clock domains; and includes per-channel analog/digital signal detect, link quality monitoring, and built-in self-test (BIST) pattern generation/checking for end-to-end path validation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Serial Data Rate | 195–1500 MBaud per channel - supports variable-rate multi-protocol links without shared clock domain. |
| Aggregate Throughput | Up to 12 Gbps - enables full-duplex 4×3 Gbps interconnects for high-density switch fabric interfaces. |
| Encoding Scheme | Configurable 8B/10B or bypass mode - ensures DC balance and run-length control for fiber/copper transmission. |
| Supply Voltage | Single 3.3 V ±5% - simplifies power delivery versus mixed-voltage transceivers; typical power draw is 3 W. |
| Interface Standard | LVTTL parallel I/O + dual PECL-compatible differential serial I/O - compatible with FPGA I/O banks and standard 50 Ω transmission lines. |
| Compliance | ESCON, DVB-ASI, SMPTE-259M/292M, Fibre Channel, IEEE 802.3z - validated against industry-standard pathological test patterns. |
| Package | 256-ball thermally enhanced BGA (17 mm × 17 mm, 1.0 mm pitch) - optimized for high-speed signal integrity and thermal dissipation in dense PCB layouts. |
Pinout & Package
256-ball thermally enhanced BGA package (17 mm × 17 mm, 1.0 mm ball pitch), RoHS-compliant, with exposed thermal pad on underside for PCB-level heat sinking.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| INA1±, INA2± INB1±, INB2± INC1±, INC2± IND1±, IND2± |
Differential PECL-compatible serial receive inputs (4 channels × 2 pairs) | Accept high-speed serial data; internal DC restoration eliminates need for AC coupling capacitors. |
| OUTA1±, OUTA2± OUTB1±, OUTB2± OUTC1±, OUTC2± OUTD1±, OUTD2± |
Differential PECL-compatible serial transmit outputs (4 channels × 2 pairs) | Source-matched to 50 Ω; edge rates controlled by signaling rate - no external bias resistors required. |
| TXDA[7:0]–TXDD[7:0] | LVTTL parallel transmit data inputs (4 channels × 8-bit) | Synchronous to TXCLKx or REFCLKx; sampled on rising edge - supports byte-aligned parallel bus interfacing to FPGAs or ASICs. |
| RXDA[7:0]–RXDD[7:0] | LVTTL parallel receive data outputs (4 channels × 8-bit) | Present decoded, framed characters; timing referenced to recovered clock (RXCLKx) or local REFCLKx - enables flexible clock domain crossing. |
| REFCLKA±–REFCLKD± | Differential reference clocks (4 channels) | Independent per-channel clocking enables heterogeneous data rates and protocol mixing - no global master clock required. |
| TMS, TDI, TDO, TCLK, TRST | JTAG boundary scan interface | Enables IEEE 1149.1-compliant testing of PCB interconnects and device I/O during system bring-up and production test. |
Key Features
| Feature | Design Value |
|---|---|
| Truly independent channels | Each channel operates at different baud rates and transports distinct protocols - eliminates clock domain synchronization overhead in multi-standard systems. |
| Integrated Clock and Data Recovery (CDR) | Fully embedded PLL per receive channel - removes need for external clock recovery ICs and associated layout complexity. |
| MultiFrame™ Receive Framer | Supports bit/byte alignment, K28.5 comma detection, and single/multi-byte framing - reduces latency vs. fixed-frame alternatives in real-time video transport. |
| Built-In Self-Test (BIST) | At-speed pattern generation and checking per TX/RX path - enables in-system validation of serial links without external test equipment. |
| Per-channel Link Quality Indicator | Analog signal detect + digital signal detect per channel - provides real-time diagnostics for link health monitoring in carrier-grade equipment. |
Applications
| SDI Video Transport | Multi-Protocol Router Backplane |
|---|---|
|
Use Scenario: Transmission of uncompressed HD/SD-SDI video over coaxial cable or optical fiber in broadcast infrastructure. IC Role / Device Role / Timing Role: Serializes parallel video data with SMPTE-259M/292M compliance and pathological test support. Use Value: Eliminates external clock recovery and line drivers - reduces bill-of-materials and PCB area while meeting SMPTE EG34-1999 timing jitter limits. |
Use Scenario: Interconnecting line cards in modular routers supporting ESCON, Fibre Channel, and Gigabit Ethernet simultaneously. IC Role / Device Role / Timing Role: Quad-channel serializer/deserializer with independent clock domains per port. Use Value: Enables protocol-flexible port design - one transceiver handles four disparate standards without clock domain translation logic. |
| CPRI-Based Wireless Baseband | OBSAI-RP3 Aggregation Equipment |
|
Use Scenario: High-speed fronthaul between baseband unit (BBU) and remote radio head (RRH) in LTE/5G systems. IC Role / Device Role / Timing Role: CPRI-compliant serial transceiver with deterministic latency and 8B/10B encoding. Use Value: Meets CPRI Option 3/4 timing budgets (<10 ns jitter) via integrated CDR and low-latency framing - avoids external jitter cleaners. |
Use Scenario: Aggregating multiple OBSAI RP3-compliant radio units into a central processing node. IC Role / Device Role / Timing Role: Supports 1536 MBaud OBSAI-RP3 data rate (via CYW variant family); CYP variant provides fallback compatibility. Use Value: Enables field-upgradable OBSAI support through firmware configuration - no hardware change needed when migrating to CYW15G0403DXB. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar quad-channel high-speed serial transceiver applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CYV15G0403DXB-BGC | SMPTE-259M/292M pathological test compliant; max 1500 MBaud | Required for broadcast SDI/HD-SDI equipment certification | Select when SMPTE EG34-1999 compliance is mandatory for video transport. |
| CYW15G0403DXB-BGC | Supports 1540 MBaud; OBSAI-RP3 compliant at 1536/768 MBaud | Required for OBSAI-based wireless infrastructure deployments | Select when OBSAI-RP3 1536 MBaud operation is specified in system architecture. |
Compared with CYV15G0403DXB-BGC and CYW15G0403DXB-BGC, the CYP15G0403DXB-BGC offers broadest interoperability across non-certified multi-protocol links but excludes SMPTE pathological and OBSAI-RP3 validation - ideal for cost-sensitive, non-certified aggregation platforms where flexibility outweighs standard-specific compliance.
Availability
CYP15G0403DXB-BGC is available at Aetrix Electronics and suitable for telecom aggregation equipment, broadcast video transport systems, and CPRI-based wireless fronthaul requiring stable component supply, long-term lifecycle support, and traceable sourcing.
Supply support for CYP15G0403DXB-BGC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance mixed-signal ICs for communications, computing, and industrial applications, with expertise in programmable logic, memory, and interface solutions.
The HOTLink II transceiver product line targets high-speed point-to-point serial interconnects in telecom, broadcast, and wireless infrastructure - emphasizing protocol flexibility, per-channel independence, and system-level testability.
FAQ
Is CYP15G0403DXB-BGC pin-compatible with CYV15G0403DXB-BGC and CYW15G0403DXB-BGC?
Yes - all three variants share identical 256-ball BGA footprint, pin assignment, and electrical interface specifications. Differences are limited to internal firmware configuration and compliance validation; no PCB redesign is required when substituting within the same package option.
Does CYP15G0403DXB-BGC support 8B/10B encoding bypass for externally scrambled data?
Yes - the integrated 8B/10B encoder/decoder can be disabled per channel via configuration registers, allowing direct transport of pre-scrambled or pre-encoded 10-bit data across the serial link without modification.
What clocking options are available for the parallel interface?
The parallel I/O supports multiple clocking modes: transmit data may be clocked by local REFCLKx or TXCLKx; receive data may be output relative to recovered RXCLKx or local REFCLKx - enabling synchronous, source-synchronous, or elastic buffer-based timing architectures.
How is link quality monitored per channel?
Each channel provides two independent status signals: analog signal detect (ASD) confirms presence of valid differential amplitude, and digital signal detect (DSD) validates lock to incoming data stream - both accessible via dedicated LVTTL pins (e.g., RXSTA[2:0]) for real-time diagnostics.
CYP15G0403DXB-BGC Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Series:
- HOTlink II™
- Package/Case:
- 256-BGA Exposed Pad
- Packaging:
- Tray
- Product Status:
- Obsolete
- Function:
- Transceiver
- Interface:
- LVTTL
- Number of Circuits:
- 4
- Voltage - Supply:
- 3.135V ~ 3.465V
- Current - Supply:
- 900mA
- Power (Watts):
- -
- Operating Temperature:
- 0°C ~ 70°C
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 256-L2BGA (27x27)
CYP15G0403DXB-BGC FAQ
1.How can I place an order for CYP15G0403DXB-BGC through Aetrix?
Please submit a Request for Quotation (RFQ) for CYP15G0403DXB-BGC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYP15G0403DXB-BGC reliable?
The price and inventory of CYP15G0403DXB-BGC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYP15G0403DXB-BGC is usually 5 days.
3.What payment methods are accepted for CYP15G0403DXB-BGC?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYP15G0403DXB-BGC transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYP15G0403DXB-BGC?
CYP15G0403DXB-BGC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYP15G0403DXB-BGC order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYP15G0403DXB-BGC?
For technical support, including CYP15G0403DXB-BGC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYP15G0403DXB-BGC requirements.
6.How does Aetrix verify that CYP15G0403DXB-BGC is sourced from the original manufacturer or authorized distributors?
All CYP15G0403DXB-BGC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYP15G0403DXB-BGC meets industry standards.
7.What is the process for return or replacement of CYP15G0403DXB-BGC?
All CYP15G0403DXB-BGC units undergo pre-shipment inspection (PSI). If there is an issue with CYP15G0403DXB-BGC, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYP15G0403DXB-BGC part is unused and in its original packaging.
Return procedure for CYP15G0403DXB-BGC:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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