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Infineon Technologies CYP15G0403DXB-BGC

Part No.:
CYP15G0403DXB-BGC
Manufacturer:
Infineon Technologies
Category:
Telecom
Package:
256-BGA Exposed Pad
Datasheet:
AetrixCYP15G0403DXB-BGC.pdf
Description:
IC TELECOM INTERFACE 256BGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,832

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Product details

Overview

CYP15G0403DXB-BGC from Cypress Semiconductor is an independent-clock quad HOTLink II™ transceiver IC for high-speed serial interconnects, supporting 195–1500 MBaud per channel with dual PECL-compatible differential I/O per channel, 8B/10B encoding/decoding, and integrated PLL-based clock recovery. It enables multi-protocol backplane and fiber-optic links in telecom aggregation equipment.

For engineers reviewing the CYP15G0403DXB-BGC datasheet, CYP15G0403DXB-BGC pinout, CYP15G0403DXB-BGC application, or CYP15G0403DXB-BGC equivalent, key selection criteria include per-channel independent reference clocking, aggregate 12 Gbps throughput, JTAG boundary scan support, BIST-enabled at-speed link validation, and compliance with ESCON, DVB-ASI, SMPTE-259M/292M, and Gigabit Ethernet physical layer requirements.

Technical Context

This transceiver implements four fully independent serial channels, each with dedicated transmit PLL, receive clock-and-data-recovery (CDR) PLL, and configurable 8B/10B encoder/decoder. Each channel accepts LVTTL parallel data (8-bit or pre-encoded 10-bit) and outputs dual PECL-compatible differential serial streams at 10× or 20× the local reference clock rate.

The device integrates MultiFrame™ framer logic for bit/byte alignment, comma detection (K28.5), and low-latency framing modes; supports synchronous LVTTL parallel interface with selectable input/output clock domains; and includes per-channel analog/digital signal detect, link quality monitoring, and built-in self-test (BIST) pattern generation/checking for end-to-end path validation.

Key Specifications

Parameter Value and Actual Design Meaning
Serial Data Rate 195–1500 MBaud per channel - supports variable-rate multi-protocol links without shared clock domain.
Aggregate Throughput Up to 12 Gbps - enables full-duplex 4×3 Gbps interconnects for high-density switch fabric interfaces.
Encoding Scheme Configurable 8B/10B or bypass mode - ensures DC balance and run-length control for fiber/copper transmission.
Supply Voltage Single 3.3 V ±5% - simplifies power delivery versus mixed-voltage transceivers; typical power draw is 3 W.
Interface Standard LVTTL parallel I/O + dual PECL-compatible differential serial I/O - compatible with FPGA I/O banks and standard 50 Ω transmission lines.
Compliance ESCON, DVB-ASI, SMPTE-259M/292M, Fibre Channel, IEEE 802.3z - validated against industry-standard pathological test patterns.
Package 256-ball thermally enhanced BGA (17 mm × 17 mm, 1.0 mm pitch) - optimized for high-speed signal integrity and thermal dissipation in dense PCB layouts.

Pinout & Package

256-ball thermally enhanced BGA package (17 mm × 17 mm, 1.0 mm ball pitch), RoHS-compliant, with exposed thermal pad on underside for PCB-level heat sinking.

Pin/Terminal Circuit Role Design Meaning
INA1±, INA2±
INB1±, INB2±
INC1±, INC2±
IND1±, IND2±
Differential PECL-compatible serial receive inputs (4 channels × 2 pairs) Accept high-speed serial data; internal DC restoration eliminates need for AC coupling capacitors.
OUTA1±, OUTA2±
OUTB1±, OUTB2±
OUTC1±, OUTC2±
OUTD1±, OUTD2±
Differential PECL-compatible serial transmit outputs (4 channels × 2 pairs) Source-matched to 50 Ω; edge rates controlled by signaling rate - no external bias resistors required.
TXDA[7:0]–TXDD[7:0] LVTTL parallel transmit data inputs (4 channels × 8-bit) Synchronous to TXCLKx or REFCLKx; sampled on rising edge - supports byte-aligned parallel bus interfacing to FPGAs or ASICs.
RXDA[7:0]–RXDD[7:0] LVTTL parallel receive data outputs (4 channels × 8-bit) Present decoded, framed characters; timing referenced to recovered clock (RXCLKx) or local REFCLKx - enables flexible clock domain crossing.
REFCLKA±–REFCLKD± Differential reference clocks (4 channels) Independent per-channel clocking enables heterogeneous data rates and protocol mixing - no global master clock required.
TMS, TDI, TDO, TCLK, TRST JTAG boundary scan interface Enables IEEE 1149.1-compliant testing of PCB interconnects and device I/O during system bring-up and production test.

Key Features

Feature Design Value
Truly independent channels Each channel operates at different baud rates and transports distinct protocols - eliminates clock domain synchronization overhead in multi-standard systems.
Integrated Clock and Data Recovery (CDR) Fully embedded PLL per receive channel - removes need for external clock recovery ICs and associated layout complexity.
MultiFrame™ Receive Framer Supports bit/byte alignment, K28.5 comma detection, and single/multi-byte framing - reduces latency vs. fixed-frame alternatives in real-time video transport.
Built-In Self-Test (BIST) At-speed pattern generation and checking per TX/RX path - enables in-system validation of serial links without external test equipment.
Per-channel Link Quality Indicator Analog signal detect + digital signal detect per channel - provides real-time diagnostics for link health monitoring in carrier-grade equipment.

Applications

SDI Video Transport Multi-Protocol Router Backplane

Use Scenario: Transmission of uncompressed HD/SD-SDI video over coaxial cable or optical fiber in broadcast infrastructure.

IC Role / Device Role / Timing Role: Serializes parallel video data with SMPTE-259M/292M compliance and pathological test support.

Use Value: Eliminates external clock recovery and line drivers - reduces bill-of-materials and PCB area while meeting SMPTE EG34-1999 timing jitter limits.

Use Scenario: Interconnecting line cards in modular routers supporting ESCON, Fibre Channel, and Gigabit Ethernet simultaneously.

IC Role / Device Role / Timing Role: Quad-channel serializer/deserializer with independent clock domains per port.

Use Value: Enables protocol-flexible port design - one transceiver handles four disparate standards without clock domain translation logic.

CPRI-Based Wireless Baseband OBSAI-RP3 Aggregation Equipment

Use Scenario: High-speed fronthaul between baseband unit (BBU) and remote radio head (RRH) in LTE/5G systems.

IC Role / Device Role / Timing Role: CPRI-compliant serial transceiver with deterministic latency and 8B/10B encoding.

Use Value: Meets CPRI Option 3/4 timing budgets (<10 ns jitter) via integrated CDR and low-latency framing - avoids external jitter cleaners.

Use Scenario: Aggregating multiple OBSAI RP3-compliant radio units into a central processing node.

IC Role / Device Role / Timing Role: Supports 1536 MBaud OBSAI-RP3 data rate (via CYW variant family); CYP variant provides fallback compatibility.

Use Value: Enables field-upgradable OBSAI support through firmware configuration - no hardware change needed when migrating to CYW15G0403DXB.

Equivalent & Alternatives

The following parts are listed as comparable options for similar quad-channel high-speed serial transceiver applications.

Alternative Part Technical Difference Application Difference Selection Advice
CYV15G0403DXB-BGC SMPTE-259M/292M pathological test compliant; max 1500 MBaud Required for broadcast SDI/HD-SDI equipment certification Select when SMPTE EG34-1999 compliance is mandatory for video transport.
CYW15G0403DXB-BGC Supports 1540 MBaud; OBSAI-RP3 compliant at 1536/768 MBaud Required for OBSAI-based wireless infrastructure deployments Select when OBSAI-RP3 1536 MBaud operation is specified in system architecture.

Compared with CYV15G0403DXB-BGC and CYW15G0403DXB-BGC, the CYP15G0403DXB-BGC offers broadest interoperability across non-certified multi-protocol links but excludes SMPTE pathological and OBSAI-RP3 validation - ideal for cost-sensitive, non-certified aggregation platforms where flexibility outweighs standard-specific compliance.

Availability

CYP15G0403DXB-BGC is available at Aetrix Electronics and suitable for telecom aggregation equipment, broadcast video transport systems, and CPRI-based wireless fronthaul requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for CYP15G0403DXB-BGC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) designs high-performance mixed-signal ICs for communications, computing, and industrial applications, with expertise in programmable logic, memory, and interface solutions.

The HOTLink II transceiver product line targets high-speed point-to-point serial interconnects in telecom, broadcast, and wireless infrastructure - emphasizing protocol flexibility, per-channel independence, and system-level testability.

FAQ

Is CYP15G0403DXB-BGC pin-compatible with CYV15G0403DXB-BGC and CYW15G0403DXB-BGC?

Yes - all three variants share identical 256-ball BGA footprint, pin assignment, and electrical interface specifications. Differences are limited to internal firmware configuration and compliance validation; no PCB redesign is required when substituting within the same package option.

Does CYP15G0403DXB-BGC support 8B/10B encoding bypass for externally scrambled data?

Yes - the integrated 8B/10B encoder/decoder can be disabled per channel via configuration registers, allowing direct transport of pre-scrambled or pre-encoded 10-bit data across the serial link without modification.

What clocking options are available for the parallel interface?

The parallel I/O supports multiple clocking modes: transmit data may be clocked by local REFCLKx or TXCLKx; receive data may be output relative to recovered RXCLKx or local REFCLKx - enabling synchronous, source-synchronous, or elastic buffer-based timing architectures.

How is link quality monitored per channel?

Each channel provides two independent status signals: analog signal detect (ASD) confirms presence of valid differential amplitude, and digital signal detect (DSD) validates lock to incoming data stream - both accessible via dedicated LVTTL pins (e.g., RXSTA[2:0]) for real-time diagnostics.

CYP15G0403DXB-BGC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HOTlink II™
Package/Case:
256-BGA Exposed Pad
Packaging:
Tray
Product Status:
Obsolete
Function:
Transceiver
Interface:
LVTTL
Number of Circuits:
4
Voltage - Supply:
3.135V ~ 3.465V
Current - Supply:
900mA
Power (Watts):
-
Operating Temperature:
0°C ~ 70°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
256-L2BGA (27x27)

CYP15G0403DXB-BGC FAQ

1.How can I place an order for CYP15G0403DXB-BGC through Aetrix?

Please submit a Request for Quotation (RFQ) for CYP15G0403DXB-BGC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CYP15G0403DXB-BGC reliable?

The price and inventory of CYP15G0403DXB-BGC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYP15G0403DXB-BGC is usually 5 days.

3.What payment methods are accepted for CYP15G0403DXB-BGC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYP15G0403DXB-BGC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CYP15G0403DXB-BGC?

CYP15G0403DXB-BGC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CYP15G0403DXB-BGC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CYP15G0403DXB-BGC?

For technical support, including CYP15G0403DXB-BGC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYP15G0403DXB-BGC requirements.

6.How does Aetrix verify that CYP15G0403DXB-BGC is sourced from the original manufacturer or authorized distributors?

All CYP15G0403DXB-BGC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYP15G0403DXB-BGC meets industry standards.

7.What is the process for return or replacement of CYP15G0403DXB-BGC?

All CYP15G0403DXB-BGC units undergo pre-shipment inspection (PSI). If there is an issue with CYP15G0403DXB-BGC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CYP15G0403DXB-BGC part is unused and in its original packaging.

Return procedure for CYP15G0403DXB-BGC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CYP15G0403DXB-BGC Tags

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  • Infineon Technologies
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