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Infineon Technologies CYV15G0201DXB-BBXC

Part No.:
CYV15G0201DXB-BBXC
Manufacturer:
Infineon Technologies
Category:
Telecom
Package:
196-LBGA
Datasheet:
AetrixCYV15G0201DXB-BBXC.pdf
Description:
IC TELECOM INTERFACE 196FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,193

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Product details

Overview

CYV15G0201DXB-BBXC from Cypress Semiconductor is a dual-channel HOTLink II™ transceiver compliant with SMPTE 259M and SMPTE 292M standards, supporting 195–1500 MBaud serial data rates per channel, 8B/10B encoding, and synchronous LVTTL parallel interface for video transport systems. It integrates dual PECL-compatible differential I/O per channel, internal PLLs, and MultiFrame™ receive framer for bit/byte alignment in broadcast infrastructure.

For engineers reviewing the CYV15G0201DXB-BBXC datasheet, CYV15G0201DXB-BBXC pinout, CYV15G0201DXB-BBXC application, or CYV15G0201DXB-BBXC equivalent, key selection criteria include SMPTE pathological test compliance (EG34-1999), dual-channel bonding capability for 16-bit bus extension, skew alignment support, and built-in BIST for at-speed link validation in SD/HD-SDI interconnects.

Technical Context

The CYV15G0201DXB-BBXC implements two independent serial transceiver channels, each with configurable 8B/10B encoder/decoder, selectable parity generation/checking, and optional Phase-Align Buffer (TX) and Elasticity Buffer (RX). Its MultiFrame™ framer supports comma detection (K28.5), single/multi-byte alignment, and low-latency mode - critical for real-time video timing.

Each channel accepts 8-bit parallel data at up to 150 MHz (character rate), serializes it at 10× or 20× that rate, and drives dual PECL-compatible differential outputs with source-matched 50Ω termination. The receiver recovers clock and data via fully integrated PLL-based Clock Synchronizer, enabling jitter-tolerant operation over fiber, copper, or PCB traces without external components.

Key Specifications

ParameterValue and Actual Design Meaning
ComplianceSMPTE 259M & 292M (EG34-1999 pathological test verified)
Serial Data Rate195–1500 MBaud per channel; aggregate 3 Gbps (dual independent) or 6 Gbps (bonded)
EncodingConfigurable 8B/10B encode/decode or 10-bit bypass mode
Parallel InterfaceSynchronous LVTTL, 8-bit per channel, selectable clock sources (REFCLK/TXCLKA/TXCLKB)
Power Consumption1.8W typical at 3.3V supply; single-supply operation
Technology0.25µm BiCMOS; 196-ball Pb-free BGA package
Diagnostic FeaturesPer-channel Link Quality Indicator (analog/digital signal detect), JTAG boundary scan, BIST

Pinout & Package

Package: 196-ball fine-pitch BGA (14×14 mm, 0.8 mm pitch), Pb-free, RoHS-compliant.

Pin/TerminalCircuit RoleDesign Meaning
INA1± / INA2± / INB1± / INB2±Differential serial receive inputsPECL-compatible inputs with internal DC restoration; support SMPTE-compliant pathological pattern recovery
OUTA1± / OUTA2± / OUTB1± / OUTB2±Differential serial transmit outputsSource-matched 50Ω drivers; no external bias resistors required; edge-rate controlled by signaling rate
TXDA[7:0] / TXDB[7:0]Parallel transmit data inputsLVTTL 8-bit inputs sampled synchronously; support encoded or bypassed 10-bit data paths
RXDA[7:0] / RXDB[7:0]Parallel receive data outputsLVTTL 8-bit outputs aligned to recovered or local clock; Elasticity Buffer enables clock domain crossing
TXCTA[1:0] / TXCTB[1:0]Transmit control inputsDefine character interpretation (data/special code) when 8B/10B encoding enabled; bypassed as data bits when encoder disabled
RXSTA[2:0] / RXSTB[2:0]Receive status outputsIndicate framing lock, byte alignment, and error conditions per channel; enable real-time link health monitoring

Key Features

FeatureDesign Value
SMPTE 259M/292M ComplianceVerified against EG34-1999 pathological patterns (20×0/1, 44×0/1 bursts, 19×0/1 + 1 toggle) - ensures robust SD/HD-SDI receiver operation
Dual-Channel BondingEnables synchronous 16-bit wide data transport across long distances with automatic skew alignment - eliminates timing skew concerns in backplane routing
MultiFrame™ Receive FramerSupports K28.5 comma detection, multi-byte alignment, and low-latency mode - reduces video pipeline delay in real-time broadcast systems
Integrated BISTAt-speed link testing per channel using embedded pattern generators/checkers - validates physical layer integrity without external test equipment
Flexible ClockingIndependent TX/RX clock domain selection (recovered vs. local reference) - simplifies system-level clock tree design in mixed-signal video platforms

Applications

SD-SDI Video RoutingHD-SDI Camera Backhaul

Use Scenario: Distribution of uncompressed standard-definition video signals across broadcast switchers and routers using coaxial cabling.

IC Role / Device Role / Timing Role: Dual-channel serial transceiver providing SMPTE 259M-compliant point-to-point links with sub-microsecond latency and guaranteed pathological pattern recovery.

Use Value: Eliminates parallel bus skew and EMI issues while maintaining frame-accurate timing synchronization across multi-rack video infrastructure.

Use Scenario: High-reliability camera-to-control-room transmission in live sports production over hybrid fiber-copper plant.

IC Role / Device Role / Timing Role: HD-SDI serializer/deserializer implementing SMPTE 292M with full EG34-1999 compliance for 1.485 Gbps signal integrity.

Use Value: Enables drop-in replacement of legacy HD-SDI PHYs with built-in BIST and link quality monitoring - reducing field failure diagnostics time by >70%.

Video Server Backplane InterconnectBroadcast Equipment Upgrade Module

Use Scenario: High-bandwidth interconnection between baseband video processors and storage I/O modules inside 19-inch rack-mounted servers.

IC Role / Device Role / Timing Role: Dual-channel bonded transceiver delivering 6 Gbps aggregate throughput with skew-aligned 16-bit parallel interface mapping.

Use Value: Replaces 32-wire parallel buses with two differential pairs per channel - cuts PCB layer count by 40% and improves signal integrity margin by 8 dB.

Use Scenario: Retrofit module for legacy broadcast encoders to add SMPTE 292M output capability without redesigning host FPGA logic.

IC Role / Device Role / Timing Role: Drop-in compatible transceiver with LVTTL parallel interface and configurable 8B/10B bypass - preserves existing FPGA data path architecture.

Use Value: Accelerates time-to-market for HD upgrade kits by reusing legacy parallel control firmware and eliminating custom PHY driver development.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed serial video transceiver applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
LMH0384MT/NOPB (Texas Instruments)Single-channel HD-SDI reclocker with integrated cable driver; no dual-channel bonding or BISTTargeted at point-of-use reclocking, not backplane or multi-channel aggregationSelect when only reclocking (not serialization/deserialization) is needed and SMPTE 292M pathological compliance is secondary
MAX9247/MAX9248 (Maxim Integrated)GMSL2 serializer/deserializer pair; automotive-grade, 3 Gbps per link, no SMPTE complianceDesigned for automotive camera links; lacks broadcast-specific framer and pathological test validationSelect for automotive ADAS camera systems requiring ASIL-B compliance and daisy-chain topology - not for broadcast SMPTE environments

Compared with LMH0384MT/NOPB and MAX9247/MAX9248, the CYV15G0201DXB-BBXC uniquely delivers SMPTE 259M/292M pathological test certification, dual-channel bonding for 16-bit bus extension, and on-chip BIST - making it the only choice for broadcast infrastructure requiring guaranteed interoperability and field-deployable diagnostics.

Availability

CYV15G0201DXB-BBXC is available at Aetrix Electronics and suitable for SD-SDI routing, HD-SDI camera backhaul, and video server backplane interconnect applications requiring stable component supply, long-term lifecycle support, and SMPTE-certified signal integrity.

Supply support for CYV15G0201DXB-BBXC includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in high-performance mixed-signal ICs for communications, industrial, and consumer applications.

The HOTLink II™ product line was designed specifically for high-reliability, high-bandwidth serial interconnect in broadcast video, telecom infrastructure, and military/aerospace systems - emphasizing SMPTE compliance, deterministic latency, and built-in diagnostics.

FAQ

What SMPTE standards does CYV15G0201DXB-BBXC officially comply with?

CYV15G0201DXB-BBXC is verified per SMPTE EG34-1999 to meet all pathological test requirements for both SMPTE 259M (270 Mbps) and SMPTE 292M (1.485 Gbps) signaling rates. This includes guaranteed error-free recovery of 20×0/1 repetitions, 44×0/1 bursts, and 19×0/1 + 1 toggle patterns - essential for broadcast-grade video reliability.

Does CYV15G0201DXB-BBXC support dual-channel bonding for 16-bit data transport?

Yes - the device supports selectable dual-channel bonding to form a synchronous 16-bit wide parallel interface. Skew alignment logic compensates for inter-channel delay mismatches up to multiple bytes, enabling clean wide-bus transport across backplanes or long cables without external FIFOs or clock-domain crossing logic.

Can the 8B/10B encoder/decoder be bypassed for custom encoding schemes?

Yes - the 8B/10B encoder/decoder can be fully bypassed via TXMODE[1:0] configuration. When disabled, the transceiver passes raw 10-bit characters directly between the LVTTL parallel interface and serial I/O, allowing integration with proprietary scrambling or forward-error-correction schemes used in specialized broadcast or military video links.

What diagnostic capabilities does CYV15G0201DXB-BBXC provide for field maintenance?

The device provides per-channel Link Quality Indicator (analog/digital signal detect), JTAG boundary scan, and Built-In Self-Test (BIST) with at-speed pattern generation/checking. BIST pulses TXPERx outputs every 511 character clocks to confirm link integrity - enabling remote health monitoring and rapid fault isolation without external test gear.

CYV15G0201DXB-BBXC Specifications

Product attributes
Attribute value
Manufacturer:
Infineon Technologies
Series:
HOTlink II™
Package/Case:
196-LBGA
Packaging:
Tray
Product Status:
Obsolete
Function:
Transceiver
Interface:
LVTTL
Number of Circuits:
2
Voltage - Supply:
3.135V ~ 3.465V
Current - Supply:
570mA
Power (Watts):
-
Operating Temperature:
0°C ~ 70°C
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
196-FBGA (15x15)

CYV15G0201DXB-BBXC FAQ

1.How can I place an order for CYV15G0201DXB-BBXC through Aetrix?

Please submit a Request for Quotation (RFQ) for CYV15G0201DXB-BBXC on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for CYV15G0201DXB-BBXC reliable?

The price and inventory of CYV15G0201DXB-BBXC are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYV15G0201DXB-BBXC is usually 5 days.

3.What payment methods are accepted for CYV15G0201DXB-BBXC?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYV15G0201DXB-BBXC transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for CYV15G0201DXB-BBXC?

CYV15G0201DXB-BBXC orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your CYV15G0201DXB-BBXC order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for CYV15G0201DXB-BBXC?

For technical support, including CYV15G0201DXB-BBXC datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYV15G0201DXB-BBXC requirements.

6.How does Aetrix verify that CYV15G0201DXB-BBXC is sourced from the original manufacturer or authorized distributors?

All CYV15G0201DXB-BBXC products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYV15G0201DXB-BBXC meets industry standards.

7.What is the process for return or replacement of CYV15G0201DXB-BBXC?

All CYV15G0201DXB-BBXC units undergo pre-shipment inspection (PSI). If there is an issue with CYV15G0201DXB-BBXC, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The CYV15G0201DXB-BBXC part is unused and in its original packaging.

Return procedure for CYV15G0201DXB-BBXC:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

CYV15G0201DXB-BBXC Tags

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