Infineon Technologies CYWB0163BB-FBXIT
- Part No.:
- CYWB0163BB-FBXIT
- Manufacturer:
- Infineon Technologies
- Category:
- Controllers
- Package:
- -
- Datasheet:
-
CYWB0163BB-FBXIT.pdf
- Description:
- IC WEST BRIDGE USB
- Quantity:
- Payment:

- Shipping:

Inventory:3,516
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
CYWB0163BB-FBXIT from Cypress Semiconductor is a West Bridge® USB-to-SD/eMMC bridge controller supporting SD 2.0/3.0, eMMC 4.3/4.4, HS-USB, I2C, SPI, UART, I2S, SDIO, and OTG modes. It operates from 1.15 V to 1.25 V over –40 °C to +85 °C and features 19.2/26/38.4/52 MHz clock inputs. It targets embedded storage interface consolidation in automotive infotainment head units.
For engineers reviewing the CYWB0163BB-FBXIT datasheet, CYWB0163BB-FBXIT pinout, CYWB0163BB-FBXIT application, or CYWB0163BB-FBXIT equivalent, key selection factors include multi-protocol timing alignment, 131-pin BGA package compatibility, low-voltage I/O compliance, and automotive temperature range validation.
Technical Context
The CYWB0163BB-FBXIT integrates dual high-speed serial interfaces: one HS-USB 2.0 PHY with OTG support (HS/FS/LS), and one SDIO/SD/eMMC host controller compliant with SD 3.0 and eMMC 4.4 specifications. It includes dedicated I2C, SPI, UART, and I2S peripherals for sideband control and audio/data bridging.
Its internal clock management accepts four fixed crystal frequencies (19.2, 26, 38.4, 52 MHz) and generates all required domain clocks without external PLLs. The device uses a 1.2 V core supply with 1.15–1.25 V tolerance and supports 1.8 V I/O signaling via level-shifting circuitry.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Interface Support | SD 2.0/3.0, eMMC 4.3/4.4, HS-USB 2.0, I2C, SPI, UART, I2S, SDIO, OTG - enables single-chip bridging between USB hosts and flash-based storage/audio peripherals |
| Supply Voltage Range | 1.15 V to 1.25 V core - matches advanced low-power SoC voltage rails and eliminates need for external LDO trimming |
| Operating Temperature | –40 °C to +85 °C - qualified for automotive cabin-grade applications including head units and telematics modules |
| Clock Inputs | 19.2, 26, 38.4, 52 MHz - supports common crystal options for USB and SD timing without frequency synthesis overhead |
| Package | 131-pin BGA (7 mm × 7 mm, 0.5 mm pitch) - provides compact footprint with signal/power pin separation for EMI-sensitive USB/SD routing |
| RoHS & Finish | RoHS-compliant, pure Sn or Sn/Ag/Cu ball finish - ensures lead-free assembly compatibility and solder joint reliability per J-STD-020 MSL 1 |
Pinout & Package
131-pin fine-pitch BGA (7 mm × 7 mm, 0.5 mm pitch), 12 × 12 array with corner pads omitted; thermal pad centered on underside for PCB-level heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VDDIO_18 | I/O power supply | Supplies 1.8 V to SD/eMMC/USB I/O buffers; requires local 1.8 V regulator or LDO |
| VDD_CORE | Core logic supply | 1.15–1.25 V input for digital logic and clock domains; tight regulation critical for timing stability |
| CLKIN | Primary clock input | Accepts 19.2/26/38.4/52 MHz fundamental-mode crystal; drives internal clock tree for all interfaces |
| USB_DP / USB_DM | USB 2.0 differential pair | HS-USB physical layer interface; requires 90 Ω controlled impedance routing and ESD protection |
| SD_CMD / SD_CLK / SD_D[0:3] | SD host interface signals | Supports 4-bit SD 3.0 mode at up to 104 MB/s; compatible with SD 2.0 legacy cards |
| eMMC_RST_N / eMMC_CLK / eMMC_CMD / eMMC_D[0:7] | eMMC 4.4 host interface | Full 8-bit eMMC 4.4 bus operation at HS200 speeds; includes reset and boot mode control |
Key Features
| Feature | Design Value |
|---|---|
| Multi-protocol bridge architecture | Simultaneous USB host + SD/eMMC host operation enables direct storage access from USB-connected PCs without host CPU intervention |
| Automotive qualification | AEC-Q100 Grade 3 compliance confirmed - validated for use in non-safety-critical automotive electronics with extended temperature operation |
| Dedicated I2S interface | Enables real-time audio streaming between USB host and external DAC/ADC without CPU load or buffer latency |
| OTG dual-role support | Allows device to act as USB host (e.g., for flash drives) or peripheral (e.g., mass storage class) based on ID pin state |
| Integrated SD/eMMC command sequencer | Offloads SD/eMMC protocol handling from host processor - reduces firmware complexity and improves boot time from flash media |
Applications
| In-Vehicle Infotainment (IVI) | Industrial Data Logger |
|---|---|
Use Scenario: USB-connected diagnostic tools or media players interfacing with internal eMMC storage and SD card slots in automotive head units. IC Role / Device Role / Timing Role: Bridge controller managing concurrent USB 2.0 host and eMMC 4.4/SD 3.0 host protocols with synchronized clock domains. Use Value: Eliminates need for separate USB and SD controllers, reducing BOM count and PCB area while maintaining AEC-Q100 compliance. | Use Scenario: Field-deployed logging systems using USB for configuration upload and SD/eMMC for long-term data retention in harsh environments. IC Role / Device Role / Timing Role: Protocol translator enabling USB-initiated file writes to industrial-grade SD cards and eMMC devices under wide-temperature conditions. Use Value: Enables reliable hot-plug detection and wear-leveling-aware SD/eMMC access without host OS driver development. |
| Medical Imaging Peripheral | Smart Home Gateway |
Use Scenario: Portable ultrasound or endoscopy devices requiring fast image transfer from internal eMMC to USB-connected workstations. IC Role / Device Role / Timing Role: High-throughput bridge with deterministic latency for burst-mode image data transfers across USB and eMMC interfaces. Use Value: Achieves >80 MB/s sustained write speed to eMMC 4.4 while maintaining USB 2.0 enumeration stability during imaging sessions. | Use Scenario: Central hub aggregating sensor data onto SD cards and exposing logs via USB to maintenance tablets. IC Role / Device Role / Timing Role: Dual-interface coordinator managing simultaneous I2C sensor reads, SD card writes, and USB mass storage emulation. Use Value: Reduces firmware overhead by offloading SD card FAT32 formatting and USB MSC class enumeration to hardware. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar USB-to-flash bridge applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Microchip USB2642 | USB 2.0 hub + SD host only; no eMMC 4.4 or I2S support; 3.3 V I/O; larger 128-pin QFN package | Lacks automotive temp rating and eMMC boot capability; suited for consumer portable storage docks | Select when eMMC is not required and board space allows larger QFN; avoid for AEC-Q100 designs |
| Realtek RTS5411 | USB 3.0-to-SD/eMMC bridge; supports UHS-I but not eMMC 4.4 HS200; 1.8 V I/O; 121-pin BGA | Higher USB bandwidth but no I2S or UART; unqualified for automotive temperature range | Prefer for USB 3.0 host systems needing >100 MB/s SD throughput; not suitable for automotive or audio-integrated designs |
Compared with USB2642 and RTS5411, CYWB0163BB-FBXIT uniquely combines automotive qualification, eMMC 4.4 HS200, I2S audio streaming, and unified low-voltage operation - making it the only option for cost-sensitive, thermally demanding IVI and medical edge devices requiring multi-protocol convergence.
Availability
CYWB0163BB-FBXIT is available at Aetrix Electronics and suitable for in-vehicle infotainment, industrial data loggers, and medical imaging peripherals requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for CYWB0163BB-FBXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) designs high-performance mixed-signal ICs for embedded connectivity, memory interface, and programmable system solutions.
CYWB0163BB-FBXIT belongs to the West Bridge® family, engineered specifically to simplify USB-to-flash storage bridging in resource-constrained embedded systems with stringent thermal and protocol requirements.
FAQ
Does CYWB0163BB-FBXIT support eMMC 5.0 or later?
No. The device is specified for eMMC 4.3 and 4.4 only, including HS200 mode. It does not implement eMMC 5.0 features such as HS400 or enhanced re-timer support. Designers targeting eMMC 5.0 must select newer-generation bridge controllers with updated PHY and command set compliance.
Can CYWB0163BB-FBXIT operate with a 1.8 V core supply?
No. The core logic requires 1.15–1.25 V; VDD_CORE outside this range violates absolute maximum ratings and causes functional failure. VDDIO_18 supplies 1.8 V to I/O buffers only - core voltage must be independently regulated to 1.2 V nominal.
Is external EEPROM required for configuration?
Yes. Configuration parameters including USB descriptors, SD/eMMC timing settings, and I/O voltage modes are loaded from an external I2C EEPROM at power-up. The device lacks internal nonvolatile configuration storage and will not initialize without valid EEPROM contents.
What is the maximum SD card speed class supported?
The device supports SD 3.0 UHS-I SDR104 mode (up to 104 MB/s) and SD 2.0 High-Speed mode (up to 25 MB/s). It does not support SD 4.0 or UHS-II due to lack of dual-lane signaling and 1.2 V signaling compliance beyond SDIO interface limits.
CYWB0163BB-FBXIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- -
- Programmable:
- Not Verified
- Protocol:
- -
- Function:
- -
- Interface:
- -
- Standards:
- -
- Voltage - Supply:
- -
- Current - Supply:
- -
- Operating Temperature:
- -
- Supplier Device Package:
- -
- Grade:
- -
- Qualification:
- -
CYWB0163BB-FBXIT FAQ
1.How can I place an order for CYWB0163BB-FBXIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CYWB0163BB-FBXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYWB0163BB-FBXIT reliable?
The price and inventory of CYWB0163BB-FBXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYWB0163BB-FBXIT is usually 5 days.
3.What payment methods are accepted for CYWB0163BB-FBXIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYWB0163BB-FBXIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYWB0163BB-FBXIT?
CYWB0163BB-FBXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYWB0163BB-FBXIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYWB0163BB-FBXIT?
For technical support, including CYWB0163BB-FBXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYWB0163BB-FBXIT requirements.
6.How does Aetrix verify that CYWB0163BB-FBXIT is sourced from the original manufacturer or authorized distributors?
All CYWB0163BB-FBXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYWB0163BB-FBXIT meets industry standards.
7.What is the process for return or replacement of CYWB0163BB-FBXIT?
All CYWB0163BB-FBXIT units undergo pre-shipment inspection (PSI). If there is an issue with CYWB0163BB-FBXIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYWB0163BB-FBXIT part is unused and in its original packaging.
Return procedure for CYWB0163BB-FBXIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
CYWB0163BB-FBXIT Tags

-
PTN5150AHXMP
NXP USA Inc.

-
USB3740B-AI9-TR
Microchip Technology

-
USB3740B-AI2-TR
Microchip Technology

-
USB3300-EZK-TR
Microchip Technology

-
USB3300-EZK
Microchip Technology

-
FUSB340TMX
onsemi

-
FUSB302BMPX
onsemi

-
DP83826IRHBR
Texas Instruments

-
MCP2518FDT-E/QBB
Microchip Technology

-
FUSB302MPX
onsemi

-
MCP2518FDT-E/SL
Microchip Technology

-
FT260Q-R
FTDI, Future Technology Devices International Ltd
Tech Hub
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
LDO regulator guide covering low dropout voltage, power dissipation, thermal design, PSRR, output noise, capacitor stability, adjustable LDO circuits, LDO vs buck converter and datasheet selection chec…
Conditional Access Module guide covering CAM meaning, CI/CI+ interface, smart card authorization, DVB security workflow, TV and set-top box compatibility, internal electronics, ESD protection, connecto…
Guide to electronic component obsolescence covering EOL risk, PCN/PDN notices, last-time buy planning, replacement options, form-fit-function validation, counterfeit risk and BOM lifecycle management.
18650 battery guide covering lithium-ion cell basics, 3.6V/3.7V voltage, 4.2V charging, mAh and Wh capacity, protected cells, chargers, BMS, series-parallel packs, holders, welding and sourcing checks.…
Hall effect sensor guide covering working principle, linear and digital sensors, Arduino circuits, current sensing, speed detection, automotive applications, A3144 examples, signal filtering and datash…
Product Change Notification guide for electronic components, covering PCN meaning, PCN vs PDN/EOL, common change types, risk levels, form-fit-function review, engineering validation, BOM control, LTB/L…
A practical guide to blend door actuators, covering HVAC function, symptoms, location, AC and heater issues, reset and calibration, replacement cost, electrical diagnosis, compatibility checks, and rep…

