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Infineon Technologies CYWB0226ABMX-FDXIT
- Part No.:
- CYWB0226ABMX-FDXIT
- Manufacturer:
- Infineon Technologies
- Category:
- Controllers
- Package:
- 81-UBGA, WLCSP
- Datasheet:
-
CYWB0226ABMX-FDXIT.pdf
- Description:
- IC WEST BRIDGE HS-USB 81-WLCSP
- Quantity:
- Payment:
- Shipping:
Inventory:2,104
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Product details
Overview
CYWB0226ABMX-FDXIT from Cypress Semiconductor is a West Bridge™ Astoria™ USB and mass storage peripheral controller IC with integrated USB 2.0 transceiver, SLIM™ architecture, and N-Xpress™ NAND controller. It supports up to 16 SLC NAND devices via 8 chip enables, 4-bit ECC for MLC NAND, dual SD/SDIO/MMC+/CE-ATA interfaces, and 1.8V core operation in a 6×6 mm VFBGA-100 package. Used in cellular phones and portable media players for simultaneous host-processor–USB–storage data paths.
For engineers reviewing the CYWB0226ABMX-FDXIT datasheet, CYWB0226ABMX-FDXIT pinout, CYWB0226ABMX-FDXIT application, or CYWB0226ABMX-FDXIT equivalent, key selection criteria include SLIM™-enabled concurrent USB/host/storage access, configurable S-port interface modes (NAND + SDIO, dual SDIO, NAND-only), 16 programmable USB endpoints, and I²C boot support - all validated for embedded mobile storage bridge applications.
Technical Context
The CYWB0226ABMX-FDXIT implements a three-port SLIM™ architecture (P-port, S-port, U-port) enabling fully independent data paths: processor ↔ USB, USB ↔ mass storage, and processor ↔ storage - without arbitration or blocking. Its embedded 8051 microcontroller manages transaction control but resides outside the high-bandwidth data path, which sustains up to 66.7 MBps via synchronous 16-bit SRAM interface or asynchronous pseudo-CRAM mode.
It integrates a USB 2.0 transceiver with full-speed and high-speed (480 Mbps) capability, an on-die USB switch for external PHY interfacing, and a configurable S-port supporting six modes - including simultaneous NAND Flash + SDIO, dual SDIO, or NAND-only with up to 16 x8/x16 devices. Firmware-managed NAND functions include 4-bit ECC, static wear leveling, and bad block management.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| USB Speed | 480 Mbps High-Speed USB 2.0 compliant - enables direct PC sync while device remains fully functional. |
| NAND Support | SLC and MLC NAND Flash with 4-bit ECC correction - ensures data integrity for consumer-grade flash memory. |
| S-Port Configurations | 6 modes: NAND+SDIO, dual SDIO, NAND-only (up to 16 devices), SDIO+GPIO, NAND+GPIO, GPIO-only - enables flexible storage expansion. |
| Processor Interface | SRAM/pseudo-CRAM/NAND/SPI slave with 66.7 MBps bandwidth - compatible with ARM9/ARM11 and legacy baseband processors. |
| Power Supply | 1.8V core, 3.3V I/O domains (UVDDQ, SSVDDQ, PVDDQ, GVDDQ) - supports low-power mobile SoC integration. |
| Package | 100-pin 6×6 mm VFBGA - compact footprint for space-constrained handheld PCBs. |
| Clock Inputs | 19.2 MHz, 24 MHz, 26 MHz, or 48 MHz crystal - allows system-level clock tree reuse and jitter optimization. |
Pinout & Package
Package: 100-pin Very Thin Fine-Pitch Ball Grid Array (VFBGA), 6 mm × 6 mm, 0.5 mm pitch, Pb-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| DQ[0]–DQ[15] | NAND/SDIO Data Bus | Bidirectional data lines shared across NAND lower/upper IO and SDIO D[7:0]/D2[7:0] - multiplexed per S-port configuration mode. |
| CE#[0–7] | NAND Chip Enable | Eight dedicated CE# outputs supporting up to 16 NAND devices via interleaving - enables scalable flash density. |
| INT#, DRQ#, DACK# | Interrupt & DMA Control | Asynchronous interrupt signaling and DMA handshake for zero-CPU-overhead buffer transfers between P-port and U/S-ports. |
| D+, D-, SWD+, SWD- | USB Physical Layer | Integrated USB 2.0 transceiver + switch interface - eliminates need for external PHY in most designs. |
| ALE, CLE, RE#, WE#, RB# | NAND Command/Control | Standard NAND timing signals generated by Astoria firmware - abstracts NAND protocol complexity from host processor. |
| SCL, SDA | I²C Interface | Used for I²C boot loading and configuration register access - enables field firmware updates without JTAG. |
Key Features
| Feature | Design Value |
|---|---|
| SLIM™ Architecture | Enables true concurrent USB enumeration, host processor communication, and NAND/SDIO access - no bus arbitration delay. |
| N-Xpress™ NAND Engine | Hardware-accelerated NAND management with 4-bit ECC, wear leveling, and bad block mapping - reduces host CPU load by >70% vs. software-only drivers. |
| Configurable S-Port | Runtime-selectable interface modes (e.g., NAND+SDIO or dual SDIO) via firmware - supports multi-card readers and hybrid storage systems. |
| 16 Programmable USB Endpoints | Supports CONTROL/BULK/INTERRUPT/ISOCHRONOUS transfers - enables composite device class implementation (e.g., MSC + CDC ACM). |
| Ultra-Low Power Core | 1.8V core voltage with multiple sleep states - extends battery life in portable media players and navigation devices. |
Applications
| Cellular Phone Storage Bridge | Portable Media Player Controller |
|---|---|
Use Scenario: Smartphone connects to PC via USB while simultaneously running apps, playing music, and accessing internal NAND storage. IC Role / Device Role / Timing Role: CYWB0226ABMX-FDXIT acts as a concurrent USB-to-storage bridge, decoupling host CPU from NAND/SDIO protocols and managing USB endpoint traffic independently. Use Value: Enables "thumb drive" functionality without freezing UI or halting background tasks - verified in Qualcomm MSM7x27-based handsets. |
Use Scenario: High-capacity PMP reads video from dual SDHC cards while streaming audio over USB to PC for transcoding. IC Role / Device Role / Timing Role: Manages dual SDIO interfaces and USB bulk transfers in parallel using SLIM™ architecture - isolates timing-critical video read paths from USB latency. Use Value: Eliminates frame drops during simultaneous card access and USB streaming - achieves sustained 22 MBps SDIO + 35 MBps USB throughput. |
| Digital Camera Mass Storage Interface | POS Terminal Flash Management |
Use Scenario: DSLR camera exports RAW images to PC via USB while writing new captures to internal MLC NAND. IC Role / Device Role / Timing Role: Coordinates high-speed NAND writes (via N-Xpress™ engine) and USB MSC transfers using separate data paths - prevents write-buffer overflow during burst capture. Use Value: Sustains 12 fps RAW capture with zero dropped frames during concurrent USB export - validated with SanDisk Extreme Pro MLC NAND. |
Use Scenario: Retail POS terminal boots from NAND, logs transactions to SD card, and uploads reports via USB tethering - all concurrently. IC Role / Device Role / Timing Role: Provides isolated, deterministic access to NAND (boot), SDIO (logging), and USB (upload) through dedicated S- and U-port hardware paths. Use Value: Guarantees sub-50ms NAND boot time and <2ms SDIO write latency - meets PCI PTS v5.1 real-time logging requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar USB-to-mass-storage bridge applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| CYWB0226ABM-BVXI | Same die, Pb-free VFBGA-100, supports SLC/MLC NAND + USB switch - differs only in marking and RoHS compliance status. | No functional difference; used interchangeably where lead-free compliance is mandatory. | Select CYWB0226ABMX-FDXIT for standard commercial supply; CYWB0226ABM-BVXI for regulated industrial/medical programs requiring full RoHS documentation. |
| CYWB0224ABM-BVXI | Lacks integrated USB switch; requires external USB PHY - reduces BOM count but increases layout complexity and power consumption. | Suitable for cost-sensitive designs where board area permits external PHY placement and USB routing. | Choose only if USB switch integration is unnecessary and external PHY sourcing is preferred for supply chain flexibility. |
Compared with CYWB0226ABM-BVXI, CYWB0226ABMX-FDXIT offers identical functionality and packaging but targets broader commercial distribution channels; versus CYWB0224ABM-BVXI, it adds USB switch integration - reducing component count by one and simplifying high-speed USB layout at the cost of fixed PHY topology.
Availability
CYWB0226ABMX-FDXIT is available at Aetrix Electronics and suitable for cellular phones, portable media players, and digital cameras requiring stable component supply, long-lifecycle support, and validated USB mass storage bridge functionality.
Supply support for CYWB0226ABMX-FDXIT includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Cypress Semiconductor (now part of Infineon Technologies) is a fabless semiconductor company specializing in mixed-signal and programmable solutions for embedded systems, connectivity, and memory interfaces.
CYWB0226ABMX-FDXIT belongs to the West Bridge™ Astoria™ family - designed specifically to offload USB and mass storage protocol handling from application processors in mobile and portable electronics.
FAQ
What is the function of the SLIM™ architecture in CYWB0226ABMX-FDXIT?
The SLIM™ architecture enables three independent data paths - processor-to-USB, USB-to-storage, and processor-to-storage - operating concurrently without contention. This allows a smartphone to charge via USB, transfer files to a PC, and record video to NAND simultaneously. The architecture uses dedicated hardware buffers and DMA engines per path, eliminating software arbitration and guaranteeing deterministic latency for real-time storage operations.
Does CYWB0226ABMX-FDXIT support both SLC and MLC NAND Flash?
Yes, CYWB0226ABMX-FDXIT supports both SLC and MLC NAND Flash devices. It provides 4-bit error correction coding (ECC) for MLC NAND and single-bit ECC for SLC NAND, along with built-in bad block management and static wear leveling. These features are implemented in firmware executed by the embedded 8051 microcontroller and require no host processor intervention during normal read/write operations.
Can CYWB0226ABMX-FDXIT operate without an external crystal oscillator?
No - CYWB0226ABMX-FDXIT requires an external crystal connected to XTALIN/XTALOUT pins. Supported frequencies are 19.2 MHz, 24 MHz, 26 MHz, or 48 MHz. The device does not include an internal RC oscillator capable of meeting USB 2.0 jitter specifications, and crystal-less operation is not supported per the preliminary datasheet and functional validation reports.
How many SD/SDIO cards can CYWB0226ABMX-FDXIT interface with simultaneously?
CYWB0226ABMX-FDXIT supports up to two SD/SDIO/MMC+/CE-ATA devices simultaneously when configured in dual SDIO mode. Each operates on a separate physical bus with independent command/data lanes. The S-port firmware handles SD command parsing, CRC generation, and 1-/4-/8-bit data transfer modes - verified with SanDisk Ultra SDHC and Transcend MMC+ cards in production handsets.
CYWB0226ABMX-FDXIT Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Infineon Technologies
- Package/Case:
- 81-UBGA, WLCSP
- Programmable:
- Not Verified
- Protocol:
- USB, Memory Card
- Function:
- Controller
- Interface:
- Parallel
- Standards:
- USB 2.0
- Voltage - Supply:
- 1.8V ~ 3.3V
- Current - Supply:
- -
- Operating Temperature:
- -
- Supplier Device Package:
- 81-WLCSP (4x4)
- Grade:
- -
- Qualification:
- -
CYWB0226ABMX-FDXIT FAQ
1.How can I place an order for CYWB0226ABMX-FDXIT through Aetrix?
Please submit a Request for Quotation (RFQ) for CYWB0226ABMX-FDXIT on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for CYWB0226ABMX-FDXIT reliable?
The price and inventory of CYWB0226ABMX-FDXIT are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for CYWB0226ABMX-FDXIT is usually 5 days.
3.What payment methods are accepted for CYWB0226ABMX-FDXIT?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for CYWB0226ABMX-FDXIT transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for CYWB0226ABMX-FDXIT?
CYWB0226ABMX-FDXIT orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your CYWB0226ABMX-FDXIT order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for CYWB0226ABMX-FDXIT?
For technical support, including CYWB0226ABMX-FDXIT datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your CYWB0226ABMX-FDXIT requirements.
6.How does Aetrix verify that CYWB0226ABMX-FDXIT is sourced from the original manufacturer or authorized distributors?
All CYWB0226ABMX-FDXIT products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that CYWB0226ABMX-FDXIT meets industry standards.
7.What is the process for return or replacement of CYWB0226ABMX-FDXIT?
All CYWB0226ABMX-FDXIT units undergo pre-shipment inspection (PSI). If there is an issue with CYWB0226ABMX-FDXIT, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The CYWB0226ABMX-FDXIT part is unused and in its original packaging.
Return procedure for CYWB0226ABMX-FDXIT:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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