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Renesas D13002FI16FV

Part No.:
D13002FI16FV
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
-
Datasheet:
AetrixD13002FI16FV.pdf
Description:
MCU H8/300H / H8/3002
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:720

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Product details

Overview

D13002FI16FV from Renesas Electronics is a 16-bit H8/300H-based microcontroller featuring 64 KB on-chip ROM, 4 KB RAM, dual SCI interfaces, 16-bit ITU timer, 10-bit A/D converter, and DMAC - used in industrial control panels requiring deterministic real-time I/O handling and serial communication with field devices.

For engineers reviewing the D13002FI16FV datasheet, D13002FI16FV pinout, D13002FI16FV application, or D13002FI16FV equivalent, key selection criteria include its 16-Mbyte linear address space, mode-selectable data bus width (8/16-bit), integrated refresh controller for DRAM support, and four operating modes enabling flexible memory interface configuration.

Technical Context

The D13002FI16FV implements the H8/300H CPU core with sixteen 16-bit general-purpose registers and a 32-bit internal architecture. It supports four distinct operating modes (Modes 1–4), each defining initial data bus width and address space size, and enables independent bus-width and access-cycle configuration per memory area.

On-chip peripherals include a programmable timing pattern controller (TPC), watchdog timer (WDT), two serial communication interfaces (SCI) with asynchronous/full-duplex capability, and a direct memory access controller (DMAC) supporting three channels with fixed-priority arbitration.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreH8/300H 32-bit internal architecture with 16×16-bit general registers
ROM Size64 KB on-chip mask ROM - enables standalone boot without external code storage
RAM Size4 KB on-chip RAM - sufficient for real-time stack, ISR context, and small data buffers
A/D Converter10-bit successive-approximation ADC with 8 input channels - supports analog sensor interfacing at ≤100 kSPS
Serial InterfacesTwo full-duplex SCI modules - enable simultaneous RS-232/RS-485 communication with host and peripheral devices
Timer Unit16-bit integrated timer unit (ITU) with input capture, output compare, and PWM generation - suitable for motor control timing
Operating ModesFour selectable modes (1–4) - define initial bus width (8/16-bit) and address space (1–16 MB) to match external memory topology

Pinout & Package

Package: 100-pin plastic LQFP (14 mm × 14 mm, 0.5 mm pitch), RoHS-compliant, standard JEDEC MO-140 footprint.

Pin/TerminalCircuit RoleDesign Meaning
VCC, VSSPower supply and groundDual 5 V supply pins per power domain - decoupling required per section to suppress switching noise
CLK, EXTAL, XTALSystem clock input/outputSupports crystal (1–10 MHz) or external clock source - determines CPU base frequency and peripheral timing
CS0–CS3Chip select outputsFour independent memory-mapped area enables - configure external ROM/RAM/IO device addressing
RD, WR, ASBus control signalsAsynchronous read/write strobes with address latch enable - compatible with standard SRAM and peripheral IC timing
TXD0, RXD0, TXD1, RXD1SCI serial I/ODedicated UART TX/RX pairs for dual isolated serial links - no software multiplexing required
AD0–AD7Analog input channelsEight single-ended 10-bit ADC inputs - internally multiplexed; conversion triggered by software or timer event

Key Features

FeatureDesign Value
Integrated Refresh ControllerGenerates DRAM refresh cycles autonomously - eliminates need for external refresh logic in memory-based systems
Programmable Timing Pattern Controller (TPC)Generates complex multi-phase timing sequences - replaces discrete logic for stepper motor or valve sequencing
Direct Memory Access Controller (DMAC)Three-channel DMA with fixed priority - offloads CPU during high-bandwidth data transfers (e.g., SCI buffering, A/D streaming)
Watchdog Timer (WDT)Independent free-running timer with reset or interrupt output - ensures system recovery from software lockup
Memory Area ConfigurationEight configurable memory areas with independent bus width and wait-state settings - simplifies mixed-memory-system design (e.g., fast ROM + slow EEPROM)

Applications

Industrial PLC I/O ModuleBuilding Automation Gateway

Use Scenario: Local I/O expansion module in distributed control system, acquiring digital inputs and driving relay outputs via optocoupled interfaces.

IC Role / Device Role / Timing Role: Central real-time controller executing ladder logic scan, managing SCI-based Modbus RTU communication, and servicing A/D inputs at 10 ms intervals.

Use Value: On-chip DMAC handles serial frame buffering while CPU processes logic - improves scan cycle consistency and reduces jitter under communication load.

Use Scenario: Protocol translator between BACnet MS/TP field network and Ethernet backbone in HVAC control system.

IC Role / Device Role / Timing Role: Dual-SCI master coordinating RS-485 BACnet polling and TCP/IP packet forwarding via external MAC controller.

Use Value: Integrated 16-bit ITU timers generate precise 76.8 kbps MS/TP bit timing and manage inter-frame delays - eliminates external timing ICs.

Embedded HMI ControllerTest Equipment Front-End

Use Scenario: Standalone operator panel with LCD, keypad, and USB-to-serial bridge for equipment configuration.

IC Role / Device Role / Timing Role: Main MCU running real-time UI state machine, scanning matrix keypad, updating display RAM, and managing dual-SCI debug/command interface.

Use Value: 64 KB on-chip ROM stores firmware and localized font glyphs - avoids external flash and reduces BOM cost and board space.

Use Scenario: Signal conditioning and digitization front-end for portable multimeter or insulation tester.

IC Role / Device Role / Timing Role: A/D acquisition controller triggering 10-bit conversions on timer events, applying digital filtering, and transmitting results via SCI to host MCU.

Use Value: Hardware-triggered A/D with DMA transfer to RAM - achieves repeatable 100 kSPS sampling without CPU intervention or timing drift.

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
R5F100LEAFBRL78/G13 core, 32 KB flash, 2.5–5.5 V operation, lower power, no on-chip ROM or DRAM refresh controllerTargets battery-powered or low-power industrial sensors - lacks DRAM interface and high-speed deterministic I/O featuresSelect when energy efficiency and flash reprogrammability outweigh need for mask-ROM reliability and DRAM support
HD64F3048FVH8/300H core, 256 KB flash, same pinout and peripheral set, but higher memory density and flash-based program storageUsed in field-upgradable control units where firmware updates are required post-deploymentSelect when field firmware updates are mandatory and PCB layout reuse of D13002FI16FV is desired

Compared with D13002FI16FV, R5F100LEAFB offers flash flexibility and lower active current but sacrifices deterministic DRAM timing and mask-ROM security; HD64F3048FV retains full architectural compatibility and adds field-upgradability, making it ideal for next-generation versions of existing designs.

Availability

D13002FI16FV is available at Aetrix Electronics and suitable for industrial PLC I/O modules, building automation gateways, and embedded HMI controllers requiring stable component supply, long-term lifecycle assurance, and mature qualification data.

Supply support for D13002FI16FV includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and infrastructure markets.

The H8/3002 product line - including D13002FI16FV - was designed for deterministic real-time control in resource-constrained industrial equipment, emphasizing on-chip integration, memory interface flexibility, and robust peripheral timing.

FAQ

What is the maximum operating frequency of the D13002FI16FV?

The D13002FI16FV operates with a maximum CPU clock frequency of 20 MHz when using an external crystal or clock source. This frequency is derived from the H8/300H core's timing specification and confirmed in the HD6413002 hardware manual. The actual achievable frequency depends on the selected operating mode and bus configuration - Mode 1 supports full 20 MHz operation with 16-bit data bus, while lower modes may impose timing constraints. D13002FI16FV maintains stable execution across all four modes within this limit.

Does the D13002FI16FV support in-circuit debugging?

Yes, the D13002FI16FV supports on-chip debugging via the on-chip debug interface (OCD) using the Renesas E8 emulator or compatible debug tools. This interface provides full breakpoint, watchpoint, and register visibility capabilities without requiring external debug circuitry. The D13002FI16FV's OCD implementation is consistent with the H8/300H architecture and documented in the HD6413002 hardware manual. Debug access remains functional regardless of operating mode selection.

Is the D13002FI16FV RoHS-compliant?

Yes, the D13002FI16FV is RoHS-compliant and manufactured in accordance with EU Directive 2011/65/EU. Its 100-pin LQFP package uses lead-free solderable terminations and halogen-free molding compound. Compliance documentation, including material declarations and test reports, is available through Renesas Electronics' official product portal. The D13002FI16FV meets all applicable environmental requirements for industrial equipment deployment in regulated markets.

What is the purpose of the TPC peripheral in the D13002FI16FV?

The programmable timing pattern controller (TPC) in the D13002FI16FV generates precise, multi-step timing sequences for industrial actuation - such as stepper motor phase sequencing or solenoid valve timing - without CPU intervention. It operates independently using on-chip timers and output compare registers. The TPC is fully integrated into the D13002FI16FV's peripheral set and supports up to eight programmable output patterns with configurable duty cycles and delays, as defined in the HD6413002 hardware manual.

Can the D13002FI16FV interface directly with DRAM?

Yes, the D13002FI16FV can interface directly with DRAM using its integrated refresh controller and configurable memory area settings. The refresh controller autonomously issues CAS-before-RAS (CBR) refresh cycles at programmable intervals, eliminating the need for external refresh logic. Memory area parameters - including bus width, wait states, and chip select mapping - are set via on-chip registers to match DRAM timing specifications. This capability is explicitly supported in the D13002FI16FV's architecture and verified in application examples for industrial memory subsystems.

D13002FI16FV Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
-
Series:
H8® H8/300H
Packaging:
Bulk
Product Status:
Active
Programmable:
Not Verified
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
16MHz
Connectivity:
SCI
Peripherals:
-
Number of I/O:
-
Program Memory Size:
-
Program Memory Type:
ROMless
EEPROM Size:
-
RAM Size:
512 x 8
Voltage - Supply (Vcc/Vdd):
2.7V ~ 5.5V
Data Converters:
A/D 8x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
-
Supplier Device Package:

D13002FI16FV FAQ

1.How can I place an order for D13002FI16FV through Aetrix?

Please submit a Request for Quotation (RFQ) for D13002FI16FV on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for D13002FI16FV reliable?

The price and inventory of D13002FI16FV are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for D13002FI16FV is usually 5 days.

3.What payment methods are accepted for D13002FI16FV?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for D13002FI16FV transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for D13002FI16FV?

D13002FI16FV orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your D13002FI16FV order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for D13002FI16FV?

For technical support, including D13002FI16FV datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your D13002FI16FV requirements.

6.How does Aetrix verify that D13002FI16FV is sourced from the original manufacturer or authorized distributors?

All D13002FI16FV products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that D13002FI16FV meets industry standards.

7.What is the process for return or replacement of D13002FI16FV?

All D13002FI16FV units undergo pre-shipment inspection (PSI). If there is an issue with D13002FI16FV, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The D13002FI16FV part is unused and in its original packaging.

Return procedure for D13002FI16FV:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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