Renesas D6417709SBP167BV
- Part No.:
- D6417709SBP167BV
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 240-LFBGA
- Datasheet:
-
D6417709SBP167BV.pdf
- Description:
- IC MCU 32BIT ROMLESS 240LFBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,469
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Product details
Overview
D6417709SBP167BV from Renesas Electronics is a 32-bit RISC microcontroller based on the SuperH™ SH-3 CPU core, featuring an integrated MMU, cache memory, RTC, three serial interfaces (SCI), timer units, interrupt controller, and bus state controller. It operates at up to 167 MHz with 1.7–2.0 V core supply and supports little/big-endian memory access for embedded control applications requiring real-time responsiveness and memory management.
For engineers reviewing the D6417709SBP167BV datasheet, D6417709SBP167BV pinout, D6417709SBP167BV application, or D6417709SBP167BV equivalent, key selection criteria include its SH-3 instruction set compatibility, 208-pin FP package with defined NC pin handling, synchronous DRAM interface support, and module-level standby control for RTC/SCI/TMU peripherals.
Technical Context
The D6417709SBP167BV implements the SH-3 CPU architecture with 8 KB unified instruction/data cache, memory management unit (MMU) supporting virtual memory, and configurable bus interface supporting burst ROM, PCMCIA, and synchronous DRAM. Its clock system includes FRQCR-controlled Iφ/Bφ ratio adjustment and WDT-triggered frequency switching.
Peripheral integration includes three independent serial communication interfaces (SCI) with DMA-triggerable TXI/RXI interrupts, real-time clock with calendar function, four-channel TMU with input capture/output compare, and UBC for hardware breakpoint debugging. All modules are memory-mapped and accessible via 32-bit data bus with little- or big-endian configuration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | SH-3 32-bit RISC engine with unified 8 KB cache and MMU for virtual memory support |
| Max Operating Frequency | 167 MHz Iφ clock with programmable Iφ/Bφ ratio (1:1 to 3:1) via FRQCR register |
| Supply Voltage | VCC = 1.7–2.0 V (core); VCC–RTC = 1.7–2.0 V; VCC–PLL1/PLL2 = 1.7–2.0 V |
| Memory Interface | Supports synchronous DRAM (bank active/auto-precharge), burst ROM, and PCMCIA with MCS[0]–MCS[7] pin control |
| Serial Interfaces | Three full-duplex SCI channels with DMA-triggerable TXI/RXI interrupts and configurable trigger levels |
| Real-Time Clock | Integrated RTC with calendar function, accessible in module standby mode after prior register access |
| Package | 208-pin Fine-Pitch Plastic QFP (FP-208C/FP-208E), 0.5 mm pitch, 28 × 28 mm body |
Pinout & Package
The D6417709SBP167BV is housed in a 208-pin Fine-Pitch Plastic QFP (FP-208C/FP-208E) package with 0.5 mm lead pitch and 28 × 28 mm body size. NC pins must remain unconnected per design specification; unused input pins require fixed high/low biasing to prevent noise-induced pass-through current.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RESETP | Active-low reset input | Must be held low until all power supplies stabilize and CKIO completes ≥4 cycles; undefined pin states otherwise |
| CKIO | External clock input | Accepts 33.34 MHz max crystal or external clock; drives internal PLLs for Iφ/Bφ generation |
| VCC / VCC–RTC / VCC–PLL1 / VCC–PLL2 | Power supply pins | Separate 1.7–2.0 V domains for core, RTC oscillator, and dual PLLs; decoupling required per pin group |
| A25–A0 / D31–D0 | Address/data bus | 32-bit multiplexed address/data bus supporting little/big-endian modes and burst transfers |
| MCS0–MCS7 | Memory chip select outputs | Configurable via MCSCR registers to assert CS for area 0–7; CS2/0 bit in MCSCR0 must be 0 |
Key Features
| Feature | Design Value |
|---|---|
| Unified Cache Management | 8 KB cache with software-controllable entry invalidation and write-back on V/U-bit transitions |
| Flexible Clock Control | FRQCR register enables dynamic Iφ/Bφ ratio changes-except during DMAC transfers with non-1:1 ratios |
| Module Standby Sequencing | RTC can enter module standby only after explicit access to RTC/SCI/TMU registers to ensure state consistency |
| Synchronous DRAM Support | Configurable bank active or auto-precharge mode; requires 32-bit bus width for bank active operation |
| SCI DMA Integration | TXI/RXI interrupts activate DMAC; TDFE/RDF flags require post-trigger-count clearing to avoid spurious reassertion |
Applications
| Industrial HMI Controller | Medical Diagnostic Terminal |
|---|---|
Use Scenario: Embedded panel controller managing touch input, display refresh, and serial device communication in factory-floor HMIs. IC Role / Device Role / Timing Role: Central microcontroller executing real-time UI logic, driving LCD interface via external bus, and synchronizing SCI-based sensor polling. Use Value: SH-3 core delivers deterministic interrupt latency; integrated MMU isolates application tasks; RTC provides timestamping for event logs. | Use Scenario: Portable diagnostic device aggregating data from ultrasound transducers, ECG sensors, and thermal printers via serial links. IC Role / Device Role / Timing Role: System-on-chip host managing multi-channel data acquisition, real-time signal processing, and battery-aware peripheral power sequencing. Use Value: Low-voltage 1.7–2.0 V operation extends battery life; synchronous DRAM interface enables high-bandwidth image buffer storage; SCI DMA minimizes CPU overhead during sensor streaming. |
| Network Edge Gateway | Automated Test Equipment |
Use Scenario: Field-deployable gateway bridging Modbus RTU field devices to Ethernet backhaul using protocol translation firmware. IC Role / Device Role / Timing Role: Protocol stack processor with dual SCI ports handling RS-485 physical layer and UART-to-TCP/IP bridging logic. Use Value: Three SCI channels allow concurrent legacy interface management; memory-mapped peripherals simplify driver development; cache reduces instruction fetch latency during packet parsing. | Use Scenario: Rack-mounted test instrument performing automated calibration of analog sensors using precision timing and digital I/O control. IC Role / Device Role / Timing Role: Precision timing controller generating synchronized stimulus waveforms while capturing response data via TMU input capture and SCI-based instrument commands. Use Value: Four-channel TMU supports simultaneous edge detection and pulse-width measurement; FRQCR-controlled clock scaling enables adaptive test speed optimization; module standby reduces power between test sequences. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit RISC microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SH7727 | SH-4 core, higher performance (200+ MHz), enhanced FPU, larger on-chip RAM (128 KB), no MMU | Targeted at multimedia and complex real-time OS environments rather than MMU-dependent embedded Linux systems | Select SH7727 when floating-point computation or larger code space is required; not suitable for virtual memory applications. |
| SH7750 | SH-4A core, superscalar execution, 512 KB on-chip SRAM, integrated PCI interface, no synchronous DRAM controller | Designed for high-throughput networking and media processing; lacks direct SDRAM support needed for cost-sensitive memory expansion | Choose SH7750 for PCI-connected systems requiring high bandwidth; D6417709SBP167BV remains preferred for SDRAM-based cost-optimized designs. |
Compared with SH7727 and SH7750, the D6417709SBP167BV uniquely balances MMU-enabled OS support, synchronous DRAM interfacing, and low-voltage operation-making it optimal for Linux-capable industrial controllers where memory scalability and power efficiency are critical.
Availability
D6417709SBP167BV is available at Aetrix Electronics and suitable for industrial HMI controllers, medical diagnostic terminals, network edge gateways, automated test equipment, and portable instrumentation requiring stable component supply across extended production lifecycles.
Supply support for D6417709SBP167BV includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, and power devices for industrial, automotive, and infrastructure markets.
The SH7709S Group-including D6417709SBP167BV-is designed for high-performance embedded control applications requiring real-time responsiveness, memory management, and low-power operation in industrial and medical equipment.
FAQ
What is the maximum operating frequency of the D6417709SBP167BV?
The D6417709SBP167BV operates at a maximum internal clock frequency (Iφ) of 167 MHz. This is achieved using an external CKIO clock up to 33.34 MHz fed into the on-chip PLLs. The FRQCR register configures the multiplication ratio and Iφ/Bφ division ratio, with valid combinations documented in Table 9.4 of the Hardware Manual Rev. 5.00. The D6417709SBP167BV's timing specifications assume proper decoupling and thermal management per the absolute maximum ratings.
Does the D6417709SBP167BV support memory management for operating systems like Linux?
Yes, the D6417709SBP167BV integrates a full memory management unit (MMU) compliant with the SH-3 architecture, enabling virtual memory support required by Linux and other protected-mode operating systems. The MMU supports page-based translation with configurable page sizes and access protection bits. This capability is explicitly documented in Section 5.2 "Memory Management Unit (MMU)" of the SH7709S Hardware Manual, making the D6417709SBP167BV suitable for embedded Linux deployments where task isolation and memory protection are essential.
Can the D6417709SBP167BV interface directly with synchronous DRAM?
Yes, the D6417709SBP167BV includes a dedicated synchronous DRAM interface supporting both bank active and auto-precharge modes. Configuration is controlled via the MCR register's RASD bit and MCS[0]–MCS[7] pin assignments. The interface requires a 32-bit bus width for bank active mode and supports standard SDRAM timing parameters including tRAS, tCAS, and tRP. Detailed timing diagrams and setup requirements are provided in Section 10.3.4 and Figure 23.31 of the Hardware Manual Rev. 5.00 for the D6417709SBP167BV.
How does the D6417709SBP167BV handle reset initialization and undefined states?
The D6417709SBP167BV requires a low-level signal on RESETP until all power supplies (VCC, VCC–RTC, VCC–PLL1/PLL2) stabilize and CKIO completes at least four clock cycles. During this period, internal register states and pin outputs are undefined. The Hardware Manual Rev. 5.00 specifies that system design must prevent erroneous operation during this undefined window-e.g., by holding external peripherals in reset or disabling bus arbitration. The D6417709SBP167BV's General Precautions section explicitly prohibits accessing undefined/reserved addresses during initialization.
What are the power supply requirements for the RTC functionality in the D6417709SBP167BV?
The D6417709SBP167BV requires a dedicated 1.7–2.0 V supply on the VCC–RTC pin (Pin 3) to operate the real-time clock oscillator. This supply must be maintained independently during main power-down to preserve timekeeping. Before entering module standby mode, at least one register in the RTC, SCI, or TMU modules must be accessed to ensure consistent internal state-documented in Section 8.5.1 and Note *3 of the Hardware Manual Rev. 5.00. Failure to follow this sequence may result in RTC malfunction or loss of calendar data in the D6417709SBP167BV.
D6417709SBP167BV Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 240-LFBGA
- Series:
- SuperH® SH7700
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- SH-3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 167MHz
- Connectivity:
- EBI/EMI, FIFO, IrDA, SCI, SmartCard
- Peripherals:
- DMA, POR, WDT
- Number of I/O:
- 96
- Program Memory Size:
- -
- Program Memory Type:
- ROMless
- EEPROM Size:
- -
- RAM Size:
- 16K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.75V ~ 2.05V
- Data Converters:
- A/D 8x10b; D/A 2x8b
- Oscillator Type:
- Internal
- Operating Temperature:
- -20°C ~ 75°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
D6417709SBP167BV FAQ
1.How can I place an order for D6417709SBP167BV through Aetrix?
Please submit a Request for Quotation (RFQ) for D6417709SBP167BV on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for D6417709SBP167BV reliable?
The price and inventory of D6417709SBP167BV are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for D6417709SBP167BV is usually 5 days.
3.What payment methods are accepted for D6417709SBP167BV?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for D6417709SBP167BV transactions.
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4.How is shipping managed for D6417709SBP167BV?
D6417709SBP167BV orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your D6417709SBP167BV order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for D6417709SBP167BV?
For technical support, including D6417709SBP167BV datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your D6417709SBP167BV requirements.
6.How does Aetrix verify that D6417709SBP167BV is sourced from the original manufacturer or authorized distributors?
All D6417709SBP167BV products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that D6417709SBP167BV meets industry standards.
7.What is the process for return or replacement of D6417709SBP167BV?
All D6417709SBP167BV units undergo pre-shipment inspection (PSI). If there is an issue with D6417709SBP167BV, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The D6417709SBP167BV part is unused and in its original packaging.
Return procedure for D6417709SBP167BV:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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