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Renesas D6417709SF100B

Part No.:
D6417709SF100B
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
208-LQFP
Datasheet:
AetrixD6417709SF100B.pdf
Description:
IC MCU 32BIT ROMLESS 208LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:179

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Product details

Overview

D6417709SF100B from Renesas Electronics is a 32-bit RISC microcontroller based on the SuperH™ SH-3 CPU core, featuring an integrated MMU, cache memory, real-time clock (RTC), three serial interfaces (SCI/SCIF), timer units, interrupt controller, and bus state controller - operating at up to 100 MHz with 1.7–2.0 V core supply voltage. It targets embedded control applications requiring deterministic real-time response and low-power operation in industrial HMI and networked edge devices.

For engineers reviewing the D6417709SF100B datasheet, D6417709SF100B pinout, D6417709SF100B application, or D6417709SF100B equivalent, key selection criteria include its SH-3 instruction set compatibility, 208-pin FP package with configurable I/O, on-chip memory management for OS support, and dual-voltage power domains (VCC = 1.7–2.0 V, VCCQ = 3.3 V) enabling mixed-signal interface integration.

Technical Context

The D6417709SF100B implements the SH-3E CPU architecture with 8 KB unified instruction/data cache, four-stage pipeline, and hardware multiply/divide unit. It supports little-endian and big-endian memory access modes, with programmable bus timing for synchronous DRAM, PCMCIA, and peripheral memory mapping across eight chip-select areas.

Its system-level features include a programmable frequency control register (FRQCR) for dynamic clock ratio adjustment (Iφ:Bφ = 1:1 to 4:1), module standby control for RTC and peripheral clocks, and UDI debug interface compliant with IEEE 1149.1 JTAG. The device uses separate power domains for core (VCC), I/O (VCCQ), RTC (VCC–RTC), and PLL (VCC–PLL1/PLL2) to optimize noise isolation and power sequencing.

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreSH-3E 32-bit RISC, 100 MHz max operation - enables real-time deterministic execution with 1.25 ns instruction cycle time at full speed.
Cache Memory8 KB unified instruction/data cache - reduces external memory bandwidth demand and improves code execution efficiency in burst-access scenarios.
Memory ManagementMMU with 64-entry TLB - supports full virtual memory addressing and multitasking OS environments like μITRON or Linux.
Supply VoltagesVCC = 1.7–2.0 V, VCCQ = 3.3 V - allows direct interfacing with 3.3 V peripherals while minimizing core power consumption.
Real-Time ClockRTC with battery-backed calendar/time registers - provides autonomous timekeeping during main power-off states without external components.
Serial Interfaces3 × SCI/SCIF channels (1 with FIFO, 2 with DMA trigger) - enables concurrent UART, IrDA, and RS-485 communication with minimal CPU overhead.
Package208-pin FP (Fine Pitch) plastic QFP - supports high-density PCB layout with 0.5 mm pitch and thermal pad for enhanced heat dissipation.

Pinout & Package

Package: 208-pin FP (Fine Pitch) plastic QFP, 28 × 28 mm body, 0.5 mm lead pitch, exposed thermal pad (pin 208 = VSS).

Pin/TerminalCircuit RoleDesign Meaning
RESETPActive-low reset inputAsynchronous reset signal; must be held low for ≥4 CKIO cycles after power stabilization to ensure reliable initialization.
CKIOExternal clock inputAccepts 1–33.34 MHz crystal or clock source; drives internal PLLs to generate 100 MHz Iφ clock.
VCC / VCCQ / VCC–RTCPower supply pinsThree independent supply domains: core (1.7–2.0 V), I/O (3.3 V), RTC (1.7–2.0 V) - require separate decoupling and sequencing per Renesas guidelines.
A25–A0 / D31–D0Address/data bus26-bit address + 32-bit data multiplexed bus - supports burst transfers, synchronous DRAM, and PCMCIA with programmable wait states.
CS0–CS7Chip select outputsEight independent memory/peripheral select signals - enable flexible memory mapping across up to 8 banks with configurable timing.

Key Features

FeatureDesign Value
On-chip MMU with TLBEnables full virtual memory support for RTOS/Linux - eliminates need for external memory management logic.
Programmable FRQCRAllows dynamic Iφ:Bφ clock ratio switching (1:1 to 4:1) - supports performance scaling and low-power sleep mode transitions without external clock sources.
Module Standby ControlIndependent clock gating for RTC, TMU, SCI - reduces active current to ≤30 mA in sleep mode while retaining calendar functionality.
UDI Debug InterfaceIEEE 1149.1 JTAG-compliant on-chip debugger - enables non-intrusive breakpointing, register inspection, and flash programming without dedicated debug pins.
Configurable EndiannessRuntime switch between little-endian and big-endian memory access - simplifies interoperability with legacy peripherals and network protocols.

Applications

Industrial HMI ControllerNetwork Edge Gateway

Use Scenario: Human-machine interface in factory automation panels with touch display, Ethernet connectivity, and local I/O expansion.

IC Role / Device Role / Timing Role: Central application processor executing real-time UI rendering, protocol stack (TCP/IP, Modbus), and deterministic I/O scanning.

Use Value: Integrated MMU and cache enable responsive multitasking; dual-voltage I/O supports direct connection to 3.3 V Ethernet PHY and 24 V digital input buffers via level-shifting.

Use Scenario: Low-power cellular-to-Ethernet protocol translator in remote monitoring systems with battery backup.

IC Role / Device Role / Timing Role: Primary host controller managing LTE modem UART, Ethernet MAC, RTC timestamping, and sensor data aggregation.

Use Value: Module standby control extends battery life by powering down unused peripherals; SCIF DMA triggers offload serial traffic handling from CPU during sleep intervals.

Medical Diagnostic InstrumentAutomated Test Equipment

Use Scenario: Portable ultrasound or ECG device requiring precise timing, analog front-end control, and waveform storage.

IC Role / Device Role / Timing Role: Real-time data acquisition controller synchronizing ADC sampling, DMA transfer to SDRAM, and display refresh.

Use Value: 100 MHz SH-3E core delivers sufficient MIPS for FIR filtering and FFT computation; synchronous DRAM interface supports high-bandwidth frame buffering.

Use Scenario: Benchtop functional tester with GPIB/USB host interface, pattern generator, and measurement capture.

IC Role / Device Role / Timing Role: Embedded test executive processor coordinating stimulus generation, response analysis, and report generation.

Use Value: On-chip UDI debug port enables in-system firmware updates and calibration parameter tuning; PCMCIA interface supports legacy instrument card expansion.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 32-bit RISC microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Renesas SH7750RSH-4 core, 200 MHz, 16 KB cache, no MMU - higher performance but larger die and higher power.Targets more complex multimedia or networking stacks where SH-3 instruction set compatibility is not required.Select when >150 DMIPS and floating-point acceleration are needed; not drop-in compatible due to different pinout and voltage requirements.
Renesas SH7264SH-2A core, 120 MHz, 4 KB cache, integrated CAN controller - lower cost, no MMU, automotive AEC-Q100 qualified.Suitable for automotive body electronics or industrial CAN networks where OS virtualization is unnecessary.Choose for CAN-based distributed control; requires board redesign due to 144-pin LQFP package and different peripheral register map.

Compared with D6417709SF100B, the SH7750R offers higher compute throughput but lacks MMU-based OS support and requires significant PCB and firmware rework, while the SH7264 trades MMU and cache size for CAN integration and automotive qualification - making D6417709SF100B optimal for general-purpose embedded Linux or μITRON systems needing memory protection and mixed-voltage I/O.

Availability

D6417709SF100B is available at Aetrix Electronics and suitable for industrial HMI, network edge gateways, medical diagnostic instruments, and automated test equipment requiring stable component supply across multi-year production cycles.

Supply support for D6417709SF100B includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader headquartered in Japan, specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and enterprise markets.

The SH7709S Group belongs to Renesas' SuperH™ RISC engine family and was designed specifically for high-performance, low-power embedded applications requiring real-time OS support, rich peripheral integration, and flexible memory management - targeting industrial control, medical instrumentation, and communications infrastructure.

FAQ

What is the maximum operating frequency of the D6417709SF100B?

The D6417709SF100B operates at a maximum CPU clock frequency of 100 MHz, achieved via internal PLL multiplication of the external CKIO input (up to 33.34 MHz). This frequency is sustained under specified conditions: VCC = 1.7–2.0 V, ambient temperature ≤ 85°C, and proper decoupling. The device's FRQCR register allows dynamic adjustment of the internal Iφ:Bφ clock ratio, supporting performance scaling without changing the external crystal.

Does the D6417709SF100B include a memory management unit (MMU)?

Yes, the D6417709SF100B integrates a full-featured MMU with a 64-entry translation lookaside buffer (TLB), enabling virtual memory addressing and multitasking OS support such as μITRON or Linux. This MMU supports both page-based and segment-based memory protection, allowing secure partitioning of application code, OS kernel, and peripheral drivers - a critical capability for safety-critical and certified embedded systems.

What power supply voltages does the D6417709SF100B require?

The D6417709SF100B requires three distinct supply voltages: VCC (1.7–2.0 V) for the core logic, VCCQ (3.3 V) for I/O buffers, and VCC–RTC (1.7–2.0 V) for the real-time clock domain. These domains must be powered in sequence - VCC first, then VCCQ, then VCC–RTC - with appropriate decoupling capacitors per Renesas Hardware Manual Rev.5.00. Failure to observe this sequencing may result in undefined pin states or initialization failure.

Can the D6417709SF100B operate in low-power sleep mode?

Yes, the D6417709SF100B supports multiple low-power modes including sleep mode, where CPU execution halts but selected peripherals remain active. In sleep mode with only RTC and refresh cycles enabled, typical current consumption is ≤30 mA (Icc) and ≤20 mA (IccQ) at VCC = 1.9 V and Bφ = 33 MHz. Module standby control allows individual clock gating for TMU, SCI, and RTC - enabling fine-grained power optimization without full system reset.

Is the D6417709SF100B pin-compatible with other SH7700-series microcontrollers?

No, the D6417709SF100B is not pin-compatible with other SH7700-series variants such as SH7705 or SH7727 due to differences in pin assignment, power domain allocation (e.g., VCC–PLL2 placement), and peripheral signal routing. While sharing the same SH-3E core architecture and register-level compatibility, its 208-pin FP package and specific pin functions (e.g., CSn mapping, UDI interface location) are unique to the SH7709S Group - requiring dedicated PCB layout and schematic design.

D6417709SF100B Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
208-LQFP
Series:
SuperH® SH7700
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Core Processor:
SH-3
Core Size:
32-Bit Single-Core
Speed:
100MHz
Connectivity:
EBI/EMI, FIFO, IrDA, SCI, SmartCard
Peripherals:
DMA, POR, WDT
Number of I/O:
96
Program Memory Size:
-
Program Memory Type:
ROMless
EEPROM Size:
-
RAM Size:
16K x 8
Voltage - Supply (Vcc/Vdd):
1.55V ~ 1.95V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

D6417709SF100B FAQ

1.How can I place an order for D6417709SF100B through Aetrix?

Please submit a Request for Quotation (RFQ) for D6417709SF100B on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for D6417709SF100B reliable?

The price and inventory of D6417709SF100B are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for D6417709SF100B is usually 5 days.

3.What payment methods are accepted for D6417709SF100B?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for D6417709SF100B transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for D6417709SF100B?

D6417709SF100B orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your D6417709SF100B order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for D6417709SF100B?

For technical support, including D6417709SF100B datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your D6417709SF100B requirements.

6.How does Aetrix verify that D6417709SF100B is sourced from the original manufacturer or authorized distributors?

All D6417709SF100B products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that D6417709SF100B meets industry standards.

7.What is the process for return or replacement of D6417709SF100B?

All D6417709SF100B units undergo pre-shipment inspection (PSI). If there is an issue with D6417709SF100B, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The D6417709SF100B part is unused and in its original packaging.

Return procedure for D6417709SF100B:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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