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Renesas D6417709SHX200BV
- Part No.:
- D6417709SHX200BV
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- -
- Datasheet:
-
D6417709SHX200BV.pdf
- Description:
- IC MCU 32BIT ROMLESS 208QFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,091
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Product details
Overview
D6417709SHX200BV from Renesas Electronics is a 32-bit RISC microcontroller based on the SuperH™ SH-3 CPU core, featuring an integrated MMU, cache memory, real-time clock (RTC), three serial interfaces (SCI/SCIF), timer units, interrupt controller, and bus state controller. It operates at up to 200 MHz with 1.7–2.0 V core supply and supports little/big-endian memory access for embedded control applications in industrial and office equipment.
For engineers reviewing the D6417709SHX200BV datasheet, D6417709SHX200BV pinout, D6417709SHX200BV application, or D6417709SHX200BV equivalent, key selection criteria include its 208-pin FP package, 200 MHz max CPU frequency, 16 KB on-chip cache, MMU support for OS-based systems, and dual-voltage operation (1.7–2.0 V core / 3.3 V I/O).
Technical Context
The D6417709SHX200BV implements the SH-3 instruction set architecture with five-stage pipeline execution, supporting both little- and big-endian data formats. Its on-chip memory management unit (MMU) enables virtual memory mapping and protection, while the 16 KB unified cache improves instruction/data throughput in real-time OS environments.
It integrates a programmable bus state controller (BSC) for flexible external memory interface timing, synchronous DRAM support with bank-active and auto-precharge modes, and dedicated peripheral clocks for SCI, TMU, and RTC modules-each independently configurable via the FRQCR register.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | SuperH™ SH-3 32-bit RISC, 5-stage pipeline, 200 MHz max operation |
| Cache Memory | 16 KB unified instruction/data cache with write-back capability |
| Memory Management | On-chip MMU supporting 4 KB page size and virtual-to-physical address translation |
| Real-Time Clock | Integrated RTC with battery-backed operation and alarm interrupt capability |
| Serial Interfaces | Three independent SCI/SCIF modules supporting asynchronous communication up to 15 Mbps |
| Power Supply | VCC = 1.7–2.0 V (core), VCCQ = 3.3 V (I/O), VCC–RTC = 1.7–2.0 V (RTC oscillator) |
| Package | 208-pin Fine-Pitch Plastic QFP (FP-208C/E), 28 × 28 mm, 0.5 mm pitch |
Pinout & Package
Package: 208-pin Fine-Pitch Plastic QFP (FP-208C/E), 28 × 28 mm body, 0.5 mm lead pitch, lead-free and RoHS compliant.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| RESETP | Active-low reset input | Asynchronous reset assertion requires low level for ≥4 CKIO cycles; must be held low until power stabilization and clock startup |
| CKIO | External clock input | Accepts crystal or external clock source (1–33.34 MHz); drives internal PLL for CPU/bus clock generation |
| VCC / VCCQ / VCC–RTC | Power supply pins | VCC (pins 29, 81, 134, 154, 175): 1.7–2.0 V core; VCCQ (pins E2, F16, E17): 3.3 V I/O; VCC–RTC (pin 3): 1.7–2.0 V RTC oscillator domain |
| AD[31:0] | Address/data multiplexed bus | 32-bit multiplexed address/data bus supporting burst transfers, synchronous DRAM, and PCMCIA interfaces |
| CS0–CS7 | Chip select outputs | Eight independent chip select signals for memory-mapped peripheral and external memory segmentation |
Key Features
| Feature | Design Value |
|---|---|
| Integrated MMU | Enables full POSIX-compliant OS deployment (e.g., Linux, μITRON) with memory protection and virtual addressing |
| Configurable Bus Timing | BSC allows per-area wait-state, burst-length, and bus-width configuration for SRAM, SDRAM, ROM, and PCMCIA |
| Dual Clock Domains | Independent Iφ (CPU), Bφ (bus), and peripheral clocks enable dynamic frequency scaling without system stall |
| Low-Power Modes | Supports sleep mode (Icc ≤ 30 mA) and module standby (RTC active while CPU/PLL idle) for energy-sensitive designs |
| Hardware Debug Support | On-chip UDI (User Debug Interface) enables non-intrusive real-time debugging and trace without JTAG overhead |
Applications
| Industrial HMI Controller | Networked Office Equipment |
|---|---|
Use Scenario: Embedded controller for touch-panel-based human-machine interface in factory automation panels with Ethernet connectivity and local display rendering. IC Role / Device Role / Timing Role: Primary application processor executing real-time OS, managing LCD controller, Ethernet MAC, and serial peripherals via integrated SCIF and TMU. Use Value: MMU and 16 KB cache enable deterministic response under multitasking load; dual-voltage design reduces overall system power vs. single-rail alternatives. |
Use Scenario: Central control unit in multifunction printers/scanners requiring document processing, USB host, and network stack execution. IC Role / Device Role / Timing Role: Main system-on-chip handling print job queuing, raster image processing acceleration, and peripheral I/O coordination. Use Value: Three SCIF channels support simultaneous USB bridge, network PHY, and internal motor control UARTs; SDRAM interface enables large buffer allocation for high-resolution scan buffers. |
| Medical Diagnostic Instrument | Test & Measurement System |
Use Scenario: Data acquisition and display subsystem in portable ultrasound or ECG analyzers requiring deterministic interrupt latency and secure memory partitioning. IC Role / Device Role / Timing Role: Real-time signal processing host with DMA-managed ADC data ingestion, RTC timestamping, and secure UI rendering. Use Value: MMU isolates diagnostic firmware from UI code; RTC with battery backup ensures accurate event logging across power cycles. |
Use Scenario: Embedded controller in automated test equipment performing waveform generation, capture, and analysis with external memory expansion. IC Role / Device Role / Timing Role: High-speed data co-processor interfacing with FPGA-based signal generators and 16-bit ADC/DAC via synchronous bus. Use Value: 200 MHz SH-3 core delivers >300 MIPS for real-time FFT and filtering; BSC-tuned SDRAM interface sustains 266 MB/s sustained bandwidth. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 32-bit RISC microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Renesas SH7750R | SH-4 core, 266 MHz, 32 KB cache, no integrated RTC, 256-pin PBGA package | Higher performance but larger footprint and higher power; lacks RTC and dual-voltage I/O | Select when raw CPU throughput >200 MHz is required and RTC is implemented externally |
| Renesas SH7727 | SH-2A core, 100 MHz, 8 KB cache, no MMU, 144-pin LQFP package | Lower cost and power, but no virtual memory support; limited peripheral integration | Select for cost-sensitive, single-tasking applications where OS abstraction is unnecessary |
Compared with D6417709SHX200BV, the SH7750R offers higher clock speed and cache but requires PCB redesign and external RTC; the SH7727 reduces BOM cost and layout complexity but sacrifices MMU-based security and multitasking capability.
Availability
D6417709SHX200BV is available at Aetrix Electronics and suitable for industrial HMI controllers, networked office equipment, medical diagnostic instruments, and test & measurement systems requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant sourcing.
Supply support for D6417709SHX200BV includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and enterprise applications.
The SH7709S Group-including D6417709SHX200BV-is designed for high-performance embedded control in resource-constrained, real-time systems requiring OS support, deterministic timing, and multi-interface connectivity.
FAQ
What is the maximum operating frequency of the D6417709SHX200BV?
The D6417709SHX200BV operates at a maximum CPU frequency of 200 MHz, achieved using its internal PLL driven by an external CKIO clock (1–33.34 MHz). This frequency is validated under specified voltage (VCC = 1.7–2.0 V) and temperature conditions per the SH7709S Hardware Manual Rev. 5.00. The D6417709SHX200BV's bus clock (Bφ) and peripheral clocks are independently configurable via the FRQCR register to maintain system stability during dynamic scaling.
Does the D6417709SHX200BV include a memory management unit (MMU)?
Yes, the D6417709SHX200BV integrates a full-featured MMU supporting 4 KB page size, virtual-to-physical address translation, and memory protection attributes. This enables deployment of full-featured operating systems such as Linux or μITRON. The MMU is documented in Section 5.2 of the SH7709S Hardware Manual and is accessible via dedicated system registers including TTBR and PTEA. The D6417709SHX200BV's MMU implementation is functionally identical to that of the SH7709S group.
What package type and pin count does the D6417709SHX200BV use?
The D6417709SHX200BV is housed in a 208-pin Fine-Pitch Plastic QFP (FP-208C/E) package measuring 28 × 28 mm with 0.5 mm lead pitch. Pin assignments-including power, clock, reset, address/data bus, and peripheral I/O-are fully defined in Section 1.3 of the SH7709S Hardware Manual. This package is RoHS compliant and supports standard reflow soldering profiles per J-STD-020.
Can the D6417709SHX200BV operate with different voltage domains for core and I/O?
Yes, the D6417709SHX200BV supports dual-voltage operation: VCC (core) = 1.7–2.0 V, VCCQ (I/O) = 3.3 V, and VCC–RTC (RTC domain) = 1.7–2.0 V. This separation allows optimized power efficiency and noise isolation between logic and interface circuits. Voltage tolerance and sequencing requirements-including minimum hold time on RESETP during power-up-are specified in Section 23.1 (Absolute Maximum Ratings) and Section A.2 (Pin Specifications) of the hardware manual.
Is the D6417709SHX200BV supported by Renesas development tools?
Yes, the D6417709SHX200BV is fully supported by Renesas' legacy SH toolchain, including the C/C++ Compiler (ADE-702-246), Simulator/Debugger (ADE-702-186), and Embedded Workshop IDE. Debugging is enabled via the on-chip UDI interface, which provides real-time trace and non-intrusive breakpoint capability. Reference schematics and evaluation board documentation for the SH7709S group are available through Renesas' archive portal and remain applicable to the D6417709SHX200BV.
D6417709SHX200BV Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- -
- Series:
- SuperH® SH7700
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Core Processor:
- SH-3
- Core Size:
- 32-Bit Single-Core
- Speed:
- 200MHz
- Connectivity:
- EBI/EMI, FIFO, IrDA, SCI, SmartCard
- Peripherals:
- DMA, POR, WDT
- Number of I/O:
- 96
- Program Memory Size:
- -
- Program Memory Type:
- ROMless
- EEPROM Size:
- -
- RAM Size:
- 16K x 8
- Voltage - Supply (Vcc/Vdd):
- 1.85V ~ 2.15V
- Data Converters:
- A/D 8x10b; D/A 2x8b
- Oscillator Type:
- Internal
- Operating Temperature:
- -20°C ~ 75°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
D6417709SHX200BV FAQ
1.How can I place an order for D6417709SHX200BV through Aetrix?
Please submit a Request for Quotation (RFQ) for D6417709SHX200BV on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for D6417709SHX200BV reliable?
The price and inventory of D6417709SHX200BV are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for D6417709SHX200BV is usually 5 days.
3.What payment methods are accepted for D6417709SHX200BV?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for D6417709SHX200BV transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for D6417709SHX200BV?
D6417709SHX200BV orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your D6417709SHX200BV order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for D6417709SHX200BV?
For technical support, including D6417709SHX200BV datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your D6417709SHX200BV requirements.
6.How does Aetrix verify that D6417709SHX200BV is sourced from the original manufacturer or authorized distributors?
All D6417709SHX200BV products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that D6417709SHX200BV meets industry standards.
7.What is the process for return or replacement of D6417709SHX200BV?
All D6417709SHX200BV units undergo pre-shipment inspection (PSI). If there is an issue with D6417709SHX200BV, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The D6417709SHX200BV part is unused and in its original packaging.
Return procedure for D6417709SHX200BV:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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