Renesas DA14580-01UNA

Overview

DA14580-01UNA from Renesas Electronics is a Bluetooth Low Energy 4.2 System-on-Chip (SoC) integrating a 16 MHz ARM Cortex-M0 processor, dedicated BLE Link Layer hardware accelerator, AES-128 encryption engine, and fully integrated 2.4 GHz CMOS transceiver with -93 dBm receiver sensitivity and 0 dBm output power. It operates from coin-cell (3.0 V) or alkaline (1.5 V) batteries and supports OTA firmware updates in standalone or hosted system configurations.

For engineers reviewing the DA14580-01UNA datasheet, DA14580-01UNA pinout, DA14580-01UNA application, or DA14580-01UNA equivalent, key selection criteria include its WLCSP34 package (2.436 mm × 2.436 mm), 32 kB OTP + 42 kB SRAM memory architecture, dual UARTs with hardware flow control, 4-channel 10-bit ADC, and compliance with Bluetooth SIG v4.2, FCC Part 15, ETSI EN 300 328, and ARIB STD-T66.

Technical Context

The DA14580-01UNA implements BLE protocol stack layers (GAP, GATT, ATT, SM, L2CAP) in ROM while offloading Link Layer timing-critical operations to dedicated hardware-enabling deterministic low-latency connection handling. Its dual-oscillator clock system combines a ±20 ppm 16 MHz crystal for active mode and a ±50 ppm 32.768 kHz crystal (or RCX oscillator) for deep-sleep timing.

Power management integrates a buck/boost DC-DC converter with four independent LDO domains (SYS, RET, RF), enabling selective retention of 8 kB SRAM across four retention banks during Deep Sleep. GPIOs support programmable pull-up/down and retain state through power-down, with 14 I/Os available in the WLCSP34 package.

Key Specifications

Pinout & Package

DA14580-01UNA uses a Wafer-Level Chip Scale Package (WLCSP34) measuring 2.436 mm × 2.436 mm with 34 solder balls. The package is moisture-sensitive level 1 (MSL1) and requires standard reflow profile handling.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar Bluetooth Low Energy SoC applications.

Compared with nRF52810-QFAA and CC2640R2F, DA14580-01UNA delivers the smallest form factor (WLCSP34), lowest deep-sleep current, and highest integration (OTP + ROM stack + DC-DC) for cost-sensitive, battery-limited BLE endpoints - making it optimal for disposable sensors and miniaturized wearables.

Availability

DA14580-01UNA is available at Aetrix Electronics and suitable for wireless sensor nodes, smart wearables, medical monitoring patches, and industrial asset tags requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant packaging.

Supply support for DA14580-01UNA includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics acquired Dialog Semiconductor in 2022, inheriting its ultra-low-power wireless SoC portfolio. Dialog pioneered highly integrated BLE solutions targeting battery-operated edge devices.

The DA14580-01UNA belongs to Dialog's DA145xx BLE SoC family, designed specifically for space-constrained, energy-harvesting, and disposable IoT endpoints where minimal bill-of-materials, zero external memory, and sub-2 µA deep-sleep current are critical.

FAQ

What is the primary function of the DA14580-01UNA in a BLE system?

The DA14580-01UNA serves as a complete Bluetooth Low Energy 4.2 System-on-Chip, integrating radio transceiver, Link Layer hardware accelerator, ARM Cortex-M0 application processor, ROM-based BLE stack, OTP storage, and power management. It operates as either a standalone application processor or a data pump in hosted systems - eliminating the need for external memory or RF components in most implementations.

Does the DA14580-01UNA require external flash memory for operation?

No, the DA14580-01UNA does not require external flash memory. Its 32 kB One-Time-Programmable (OTP) memory stores application code and BLE profiles, while 84 kB ROM contains the qualified Bluetooth low energy protocol stack. The 42 kB System SRAM mirrors OTP code on wake-up, enabling full autonomous operation from a single chip.

How does the DA14580-01UNA manage power in battery-operated devices?

The DA14580-01UNA integrates a buck/boost DC-DC converter supporting 1.5 V alkaline or 3.0 V coin-cell batteries, four independent LDO domains, and Deep Sleep modes retaining 8 kB SRAM across four banks. Its typical deep-sleep current is under 1.5 µA - enabling multi-year operation on CR2032 cells in sensor beacon applications.

Can the DA14580-01UNA support over-the-air (OTA) firmware updates?

Yes, the DA14580-01UNA supports secure OTA firmware updates. Application code stored in OTP can be updated via BLE using signed images verified against cryptographic keys stored in OTP. This enables field deployment of new features, bug fixes, and security patches without physical access to the device.

What package type and dimensions does the DA14580-01UNA use?

The DA14580-01UNA uses a Wafer-Level Chip Scale Package (WLCSP34) with 34 solder balls, measuring 2.436 mm × 2.436 mm. It is rated Moisture Sensitivity Level 1 (MSL1) and compatible with standard reflow soldering processes - making it suitable for high-density, miniaturized PCB designs such as hearables and medical patches.