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Renesas DA14580A3DB-P
- Part No.:
- DA14580A3DB-P
- Manufacturer:
- Renesas
- Category:
- RF, RFID, Wireless Evaluation Boards
- Package:
- Datasheet:
-
DA14580A3DB-P.pdf
- Description:
- PRO DAUGHTERBOARD DA14580 QFN48
- Quantity:
- Payment:
- Shipping:
Inventory:3,529
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Product details
Overview
DA14580A3DB-P from Renesas Electronics is a Bluetooth Low Energy 4.2 System-on-Chip (SoC) integrating ARM Cortex-M0 processor, dedicated BLE Link Layer hardware, 32 kB OTP, 42 kB SRAM, and fully compliant 2.4 GHz transceiver with -93 dBm sensitivity and 0 dBm output power. It serves as standalone application processor or data pump in battery-powered wearables and sensor nodes.
For engineers reviewing the DA14580A3DB-P datasheet, DA14580A3DB-P pinout, DA14580A3DB-P application, or DA14580A3DB-P equivalent, key selection factors include its QFN40 package with 24 GPIOs, integrated buck/boost DC-DC converter supporting 1.5 V alkaline or 3.0 V coin cells, dual UARTs with hardware flow control, and 4-channel 10-bit ADC for battery and sensor monitoring.
Technical Context
The DA14580A3DB-P implements BLE protocol stack in ROM (84 kB), executes application code from OTP-mirrored SRAM, and offloads Link Layer processing to dedicated hardware - enabling ultra-low-power operation with deep sleep current under 1.5 µA. Its clock system combines 16 MHz crystal (±20 ppm) and 32.768 kHz crystal (±50 ppm) with RC oscillators for flexible timing across active and sleep modes.
Power management includes integrated buck/boost DC-DC converter with SWITCH pin for external inductor control, four independent LDOs (RF, SYS, RET), and retention RAM partitioning (2 kB + 2 kB + 3 kB + 1 kB) to preserve BLE state and application variables during Deep Sleep. Radio interface uses single-wire RFIOp/RFIOm with no external matching required.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| BLE Standard | Bluetooth 4.2 compliant; meets ETSI EN 300 328, FCC Part 15, ARIB STD-T66 |
| CPU Core | ARM Cortex-M0 @ 16 MHz; 0.9 dMIPS/MHz; SWD debug interface |
| Memory | 32 kB OTP (application/profile storage), 42 kB SRAM (code/data), 84 kB ROM (BLE stack), 8 kB retention SRAM |
| Transceiver | Integrated 2.4 GHz CMOS RF; -93 dBm RX sensitivity; 0 dBm TX output; single-wire antenna interface |
| Power Supply | Supports 1.5 V alkaline (VBAT1V) or 3.0 V coin cell (VBAT3V); integrated buck/boost DC-DC with external inductor |
| Analog Peripherals | 4-channel 10-bit ADC; 32.768 kHz crystal oscillator (±50 ppm); 16 MHz crystal oscillator (±20 ppm) |
| Digital Interfaces | 2× UART (up to 1 MBd, hardware flow control), I²C (100/400 kHz), SPI+™, quadrature decoder (X/Y/Z axes) |
Pinout & Package
DA14580A3DB-P is packaged in QFN40 (5 mm × 5 mm, 0.5 mm pitch) with exposed thermal pad. Pin count and I/O allocation match the QFN40 variant specified in datasheet revision 3.5.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| P0_0–P0_7 | General-purpose I/O | 8-bit port with 3.3 V tolerance, pull-down on reset, retention-capable, configurable as ADC[0–3] |
| P1_0–P1_3, P1_4/SW_CLK, P1_5/SW_DIO | GPIO / Debug | 4 GPIOs + JTAG clock/data pins; SW_CLK and SW_DIO default to debug interface but usable as GPIO |
| P2_0–P2_9 | General-purpose I/O | 10-bit port with 3.3 V tolerance, pull-down on reset, retention-capable; available only on QFN40/QFN48 |
| P3_0–P3_7 | General-purpose I/O | 8-bit port with 3.3 V tolerance, pull-down on reset; available only on QFN48 - not present on DA14580A3DB-P |
| XTAL16Mp/m, XTAL32Kp/m | Clock inputs/outputs | Crystal connections for 16 MHz (±20 ppm) and 32.768 kHz (±50 ppm) oscillators; critical for BLE timing accuracy |
| RFIOp, RFIOm | RF transceiver interface | Differential RF port (50 Ω); enables direct single-wire antenna connection without external matching network |
| VBAT3V, VBAT1V, VDCDC, SWITCH | Power management | Supports dual battery sources; VDCDC output drives internal rails; SWITCH controls external DC-DC inductor |
| RST, GND, VPP | Control & supply | RST is active-high reset; GND is ground reference; VPP = 6.7 V ± 0.1 V only during OTP programming |
Key Features
| Feature | Design Value |
|---|---|
| Dedicated BLE Link Layer Processor | Hardware-accelerated baseband processing reduces CPU load and enables deterministic low-latency connection handling |
| AES-128 Encryption Engine | On-the-fly encryption/decryption of BLE packets without software overhead or memory footprint increase |
| Flexible Power Architecture | Buck/boost DC-DC supports 1.5 V–3.6 V input; four independent LDOs allow selective domain shutdown during sleep |
| Retention Memory Partitioning | Four independent SRAM blocks (2+2+3+1 kB) enable selective retention of BLE link state, application context, and stack variables |
| Quadrature Decoder (3-axis) | Hardware decoding of rotary encoder signals on X/Y/Z channels eliminates CPU polling and improves responsiveness |
| OTA-Ready Memory Layout | OTP + mirrored SRAM + patch area support field-upgradable firmware and profile updates without external flash |
Applications
| Wireless Health Monitor | Smart Home Sensor Node |
|---|---|
|
Use Scenario: Compact wearable measuring heart rate, SpO₂, and motion using optical sensors and accelerometers. IC Role / Device Role / Timing Role: Standalone BLE SoC managing sensor acquisition, signal processing, and encrypted advertising/connection with smartphone. Use Value: Integrated 4-channel ADC and quadrature decoder enable direct analog sensor interfacing; -93 dBm sensitivity ensures reliable connection at 10+ meter range in cluttered indoor environments. |
Use Scenario: Battery-powered temperature/humidity/motion sensor deployed in HVAC ducts or ceiling cavities. IC Role / Device Role / Timing Role: Data pump relaying sensor readings over BLE to gateway; enters Deep Sleep between measurements. Use Value: 1.5 µA deep sleep current extends 2xAA battery life beyond 2 years; integrated DC-DC allows stable operation down to 1.5 V per cell. |
| Industrial Asset Tracker | Human Interface Device (HID) |
|
Use Scenario: Ruggedized tag tracking location, shock events, and ambient temperature on logistics pallets or machinery. IC Role / Device Role / Timing Role: Autonomous edge node performing local event detection, timestamping, and BLE broadcast of compressed telemetry. Use Value: Retention RAM preserves last known GPS fix and motion history across power cycles; 0 dBm TX power ensures robust beacon transmission in metal-rich environments. |
Use Scenario: Wireless keyboard or presenter with multi-button matrix and rotary encoder navigation. IC Role / Device Role / Timing Role: HID host controller interpreting keypresses, encoder rotation, and LED feedback via GPIO and quadrature decoder. Use Value: Hardware quadrature decoder handles high-speed encoder pulses without CPU intervention; keyboard controller supports debounced scanning of up to 64 keys. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar Bluetooth Low Energy SoC applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| nRF52832-QFAA | ARM Cortex-M4F core; 64 kB RAM; higher peak current (5.3 mA RX); no integrated DC-DC | Requires external DC-DC or LDO for 1.5 V battery; better suited for compute-intensive sensor fusion | Select when floating-point math or larger RAM buffer is required; verify PCB layout accommodates higher RF noise sensitivity |
| CC2640R2F | ARM Cortex-M3 core; 275 kB ROM (BLE stack + drivers); 20 kB RAM; integrated DC-DC; different pinout and peripheral mapping | Supports TI's BLE stack and SimpleLink SDK; requires separate antenna matching network | Choose for TI ecosystem integration and certified BLE stack reuse; note RFIO interface differs - no single-wire antenna support |
Compared with nRF52832-QFAA and CC2640R2F, DA14580A3DB-P delivers lower active and deep-sleep current, native single-wire antenna interface, and tighter timing compliance for cost-sensitive, long-life battery applications - at the expense of raw CPU performance and SDK maturity.
Availability
DA14580A3DB-P is available at Aetrix Electronics and suitable for wireless health monitors, smart home sensor nodes, industrial asset trackers, and human interface devices requiring stable component supply and long-term production continuity.
Supply support for DA14580A3DB-P includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics acquired Dialog Semiconductor in 2022, integrating its ultra-low-power connectivity portfolio into a broader embedded solutions offering.
The DA14580A3DB-P belongs to Dialog's DA145xx BLE SoC family, designed specifically for energy-constrained, coin-cell-powered IoT endpoints where RF reliability, minimal bill-of-materials, and OTA update capability are critical.
FAQ
What is the package type and pin count of DA14580A3DB-P?
DA14580A3DB-P uses a QFN40 package (5 mm × 5 mm, 0.5 mm pitch) with 40 terminals, including 24 general-purpose I/Os (P0, P1, P2 ports), RFIOp/m, dual crystal interfaces, power, and debug pins. This matches the "AT" package code in Dialog's ordering nomenclature and is confirmed in datasheet section 2 (Pinout) and Table 2 (Ordering Information).
Does DA14580A3DB-P support over-the-air (OTA) firmware updates?
Yes, DA14580A3DB-P supports OTA updates via its flexible memory architecture: application code resides in OTP, but the boot process copies it to 42 kB SRAM at wake-up; patches can be applied to customer code using dedicated OTP patch areas defined in the OTP header - enabling field-upgradable profiles and firmware without external flash.
What power sources does DA14580A3DB-P support?
DA14580A3DB-P supports both 1.5 V alkaline/NiMH batteries (connected to VBAT1V) and 3.0 V coin cells (connected to VBAT3V), managed by its integrated buck/boost DC-DC converter. The SWITCH pin controls the external inductor, and VDCDC provides regulated output - allowing operation across 1.5 V–3.6 V input while maintaining stable internal rail voltages.
How many ADC channels does DA14580A3DB-P have, and what is their resolution?
DA14580A3DB-P integrates a 4-channel, 10-bit successive-approximation ADC. Inputs ADC[0]–ADC[3] map directly to P0_0–P0_3, supporting battery voltage monitoring and analog sensor interfacing. The ADC includes offset calibration, chopping, and programmable delay counter - delivering usable precision for industrial and medical-grade sensing within its specified operating range.
Is DA14580A3DB-P compatible with Bluetooth 5.0 or later?
No, DA14580A3DB-P implements Bluetooth Low Energy 4.2 only, as confirmed in the General Description and Features sections of the datasheet. It does not support Bluetooth 5.0 features such as LE Long Range, LE 2 Mbps PHY, or extended advertising - those require newer SoCs like DA14585/DA1468x or Renesas' RA4W1 series.
DA14580A3DB-P Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Series:
- SmartBond™
- Packaging:
- Box
- Product Status:
- Obsolete
- Type:
- Transceiver; Bluetooth® Smart 4.x Low Energy (BLE)
- Frequency:
- 2.4GHz
- Contents:
- Board(s)
- Utilized IC / Part:
- DA14580
DA14580A3DB-P FAQ
1.How can I place an order for DA14580A3DB-P through Aetrix?
Please submit a Request for Quotation (RFQ) for DA14580A3DB-P on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DA14580A3DB-P reliable?
The price and inventory of DA14580A3DB-P are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DA14580A3DB-P is usually 5 days.
3.What payment methods are accepted for DA14580A3DB-P?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DA14580A3DB-P transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DA14580A3DB-P?
DA14580A3DB-P orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DA14580A3DB-P order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DA14580A3DB-P?
For technical support, including DA14580A3DB-P datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DA14580A3DB-P requirements.
6.How does Aetrix verify that DA14580A3DB-P is sourced from the original manufacturer or authorized distributors?
All DA14580A3DB-P products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DA14580A3DB-P meets industry standards.
7.What is the process for return or replacement of DA14580A3DB-P?
All DA14580A3DB-P units undergo pre-shipment inspection (PSI). If there is an issue with DA14580A3DB-P, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DA14580A3DB-P part is unused and in its original packaging.
Return procedure for DA14580A3DB-P:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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