Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Home > Products > Integrated Circuits (ICs) > Power Management (PMIC) > Special Purpose Regulators

Renesas DA9130-10RT1-A

Name: DA9130-10RT1-A
Brand: Renesas
SKU: DA9130-10RT1-A
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

Compare

Part No.:: DA9130-10RT1-A

Manufacturer:: Renesas

Category:: Special Purpose Regulators

Package:: 24-PowerUFQFN

Datasheet:: DA9130-10RT1-A.pdf

Description:: DUAL PHASE 10A DC-DC CONVENTER,

Quantity:: RFQ Add To RFQ list

Payment:

Shipping:

Inventory:2,155

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Product details

Overview

DA9130-10RT1-A from Renesas Electronics is a high-performance, dual-phase synchronous buck DC-DC converter PMIC delivering up to 10 A output current at 0.3 V–1.9 V with ±1 % static output voltage accuracy, 4 MHz switching frequency, and integrated power FETs. It supplies CPU/GPU/DDR rails in SIPP modules and portable SoC systems requiring compact, high-efficiency power delivery.

For engineers reviewing the DA9130-10RT1-A datasheet, DA9130-10RT1-A pinout, DA9130-10RT1-A application, or DA9130-10RT1-A equivalent, key selection considerations include its dual-phase 10 A capability, remote sensing for precision regulation, I2C-compatible FM+ interface for dynamic voltage control (DVC), and AEC-Q100 Grade 2 qualification for automotive-grade reliability.

Technical Context

The DA9130-10RT1-A implements a single-channel, dual-phase buck topology with fully integrated high-side and low-side MOSFETs (RON_PMOS = 17–37 mΩ, RON_NMOS = 6–16 mΩ per phase) and supports automatic phase shedding between 1- and 2-phase operation based on load current thresholds (ITHR_2PH_TO_1PH = 1.7 A, ITHR_1PH_TO_2PH = 2.25 A). It operates across 2.8 V–5.5 V input and delivers regulated output from 0.3 V to 1.9 V in 10 mV steps.

Control is implemented via an I2C-compatible FM+ interface (up to 1 MHz) with programmable GPIOs (CONF/GPIO0, GPIO1, GPIO2, SCL/GPIO3, SDA/GPIO4), configurable soft-start, and comprehensive supervision including over-temperature, over-current, and power-good monitoring. Remote sensing on FB1P/FB1N and FB2P/FB2N ensures ±1 % accuracy under varying PCB trace impedance.

Key Specifications

Parameter	Value and Actual Design Meaning
Output Current	Up to 10 A total (5 A per phase), enabling high-current SoC core rail delivery without external FETs.
Input Voltage Range	2.8 V to 5.5 V - compatible with single-cell Li-ion, USB PD, and intermediate bus architectures.
Output Voltage Range	0.3 V to 1.9 V in 10 mV steps - supports modern low-voltage CPU/GPU/DDR I/O and core rails.
Switching Frequency	4 MHz nominal - enables use of ultra-small 220 nH inductors and reduces output capacitor count.
Output Accuracy	±1 % (static, VOUT ≥ 1 V) - ensures tight regulation for sensitive digital loads without external calibration.
Thermal Rating	-40 °C to +105 °C ambient, AEC-Q100 Grade 2 qualified - validated for automotive cabin and industrial edge environments.
Protection Features	Integrated cycle-by-cycle current limiting, thermal shutdown, and power-good monitoring - eliminates need for discrete fault-sensing circuitry.

Pinout & Package

DA9130-10RT1-A is housed in a 24-pin FCQFN package (3.3 mm × 4.8 mm) with wettable flanks for automated optical inspection (AOI) and enhanced solder joint reliability.

Pin/Terminal	Circuit Role	Design Meaning
PVDD1 (Pins 1,2)	Power supply input for Phase 1	Supplies gate drive and internal circuitry for first buck phase; rated for 5 A continuous.
SCL/GPIO3 (Pin 3)	I2C clock / configurable GPIO	Supports FM+ I2C communication (up to 1 MHz) or general-purpose digital I/O with 15 mA drive.
FB1N / FB1P (Pins 4,5)	Negative/positive remote sense inputs for Phase 1	Enables Kelvin sensing to compensate for PCB IR drop - critical for ±1 % accuracy at high load.
SDA/GPIO4 (Pin 6)	I2C data / configurable GPIO	Bi-directional I2C data line or GPIO with interrupt capability; supports DVC command writes and status reads.
IC_EN (Pin 7)	Chip enable input	Active-high logic input controlling global device power-up sequence and sequencing coordination with other PMICs.
AVDD / AGND (Pins 8,9)	Analog supply and ground	Separate low-noise analog domain powers reference, ADC, and feedback comparators - improves regulation stability.
CONF/GPIO0 (Pin 10)	Configuration select / GPIO	Determines I2C slave address during power-up; also usable as general-purpose input/output with register control.
LX1 (Pins 23,24)	Phase 1 switch node output	High-frequency switching node connecting to external 220 nH inductor; requires tight layout for EMI control.
LX2 (Pins 17,18)	Phase 2 switch node output	Second high-current switch node - interleaved 180° with LX1 to reduce input/output ripple and improve thermal balance.
PGND (Pins 19–22)	Power ground return	Dedicated low-impedance ground path for both phases' high di/dt currents - essential for stable transient response.

Key Features

Feature	Design Value
Dual-phase interleaved buck	Reduces input/output ripple by ~70 % vs. single-phase, lowers RMS current in input capacitors, and improves thermal distribution.
Remote sensing (FB1P/FB1N, FB2P/FB2N)	Compensates for voltage drop across PCB traces - maintains ±1 % regulation accuracy even with 50 mΩ trace resistance.
Dynamic voltage control (DVC)	Adjusts output voltage in real time via I2C or dedicated GPIO, enabling processor DVFS and up to 30 % system-level power savings.
Programmable soft-start	Configurable ramp rate limits inrush current during power-up - prevents input rail collapse and avoids false brown-out detection.
Integrated protection suite	On-die thermal sensor, cycle-by-cycle current limit, and power-good flag eliminate external monitoring ICs and reduce BOM count by ≥3 components.
FM+ I2C interface	Supports 1 MHz operation and multiple slave addresses (via CONF pin), enabling daisy-chained PMIC configurations in multi-rail systems.

Applications

Mobile SoC Power Delivery	Automotive Infotainment Core Rail
Use Scenario: Powering ARM Cortex-A78/A715 CPU clusters and Mali-G710 GPU in premium smartphones and tablets. IC Role / Device Role / Timing Role: Dual-phase buck regulator supplying dynamically scaled core voltage (0.6 V–1.2 V) with DVC synchronized to CPU P-states. Use Value: Delivers 10 A peak current with <15 mV line transient deviation and ±1 % accuracy - meets ARM big.LITTLE voltage tolerance requirements.	Use Scenario: Supplying application processor (e.g., NXP i.MX8QXP) in head-unit systems operating across -40 °C to +105 °C ambient. IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 qualified PMIC generating DDR4/LPDDR4 memory rail (1.1 V) and GPU core rail (0.85 V). Use Value: Wettable-flank FCQFN package and integrated thermal protection ensure long-term reliability in thermally constrained automotive enclosures.
SIPP Module Integration	Industrial Edge AI Accelerator
Use Scenario: Embedded power solution inside Renesas SIPP modules housing SoC + DDR + PMIC in a single surface-mount package. IC Role / Device Role / Timing Role: Primary DC-DC converter providing 0.75 V @ 8 A to FPGA fabric and 1.2 V @ 2 A to DDR4 interface within module footprint. Use Value: 218 mm² total solution area (including 2×220 nH inductors and 2×20 µF capacitors) enables ultra-compact module design.	Use Scenario: Powering heterogeneous AI accelerators (e.g., Hailo-8L) in factory-floor vision systems with strict EMI and thermal constraints. IC Role / Device Role / Timing Role: High-efficiency (85 % @ 5–80 % load) dual-phase regulator managing burst-mode workloads with 5 A/μs load slew rate. Use Value: 4 MHz switching and phase shedding reduce audible noise and heat generation - critical for fanless industrial enclosures.

Mobile SoC Power Delivery

Automotive Infotainment Core Rail

Use Scenario: Powering ARM Cortex-A78/A715 CPU clusters and Mali-G710 GPU in premium smartphones and tablets.

IC Role / Device Role / Timing Role: Dual-phase buck regulator supplying dynamically scaled core voltage (0.6 V–1.2 V) with DVC synchronized to CPU P-states.

Use Value: Delivers 10 A peak current with <15 mV line transient deviation and ±1 % accuracy - meets ARM big.LITTLE voltage tolerance requirements.

Use Scenario: Supplying application processor (e.g., NXP i.MX8QXP) in head-unit systems operating across -40 °C to +105 °C ambient.

IC Role / Device Role / Timing Role: AEC-Q100 Grade 2 qualified PMIC generating DDR4/LPDDR4 memory rail (1.1 V) and GPU core rail (0.85 V).

Use Value: Wettable-flank FCQFN package and integrated thermal protection ensure long-term reliability in thermally constrained automotive enclosures.

SIPP Module Integration

Industrial Edge AI Accelerator

Use Scenario: Embedded power solution inside Renesas SIPP modules housing SoC + DDR + PMIC in a single surface-mount package.

IC Role / Device Role / Timing Role: Primary DC-DC converter providing 0.75 V @ 8 A to FPGA fabric and 1.2 V @ 2 A to DDR4 interface within module footprint.

Use Value: 218 mm² total solution area (including 2×220 nH inductors and 2×20 µF capacitors) enables ultra-compact module design.

Use Scenario: Powering heterogeneous AI accelerators (e.g., Hailo-8L) in factory-floor vision systems with strict EMI and thermal constraints.

IC Role / Device Role / Timing Role: High-efficiency (85 % @ 5–80 % load) dual-phase regulator managing burst-mode workloads with 5 A/μs load slew rate.

Use Value: 4 MHz switching and phase shedding reduce audible noise and heat generation - critical for fanless industrial enclosures.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual-phase buck converter applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
MP2965GQ-Z (Monolithic Power Systems)	40 V max input, 60 A max output, external FETs required; no integrated remote sensing or AEC-Q100 rating.	Targeted at higher-power server/industrial rails; lacks automotive qualification and compact 10 A SIPP integration capability.	Choose MP2965GQ-Z only when >20 A output or >12 V input is required - not a drop-in replacement for DA9130-10RT1-A's mobile/automotive use case.
TPS65917B1A1RSLR (Texas Instruments)	Multi-rail PMIC (7 buck + 5 LDO); 3 A max per buck channel; 2.7–5.5 V input; no dual-phase per rail; I2C-only interface.	Designed for full-system power management in AM335x/AM437x-based designs; insufficient per-rail current for CPU cores needing 10 A.	Use TPS65917B1A1RSLR when managing multiple low-current rails (e.g., I/O, RTC, audio) - not suitable as primary CPU core supply.

Compared with MP2965GQ-Z and TPS65917B1A1RSLR, the DA9130-10RT1-A uniquely combines 10 A dual-phase capability, ±1 % remote-sense accuracy, AEC-Q100 Grade 2 qualification, and 24-pin FCQFN packaging - making it the only option optimized for space-constrained, high-reliability mobile and automotive SIPP modules.

Availability

DA9130-10RT1-A is available at Aetrix Electronics and suitable for mobile SoC power delivery, automotive infotainment systems, and SIPP module integration requiring stable component supply, long-lifecycle support, and AEC-Q100 compliance.

Supply support for DA9130-10RT1-A includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics is a global semiconductor leader specializing in microcontrollers, analog power, and SoC solutions for automotive, industrial, and infrastructure markets.

The DA9130-10RT1-A belongs to Renesas' DA-series power management IC portfolio, engineered specifically for high-current, low-voltage digital load applications in mobile, automotive, and compact module platforms.

FAQ

What is the maximum output current capability of the DA9130-10RT1-A?

The DA9130-10RT1-A delivers up to 10 A total output current using dual-phase interleaved operation - 5 A per phase - with integrated MOSFETs eliminating the need for external power switches. This rating is sustained across the full -40 °C to +105 °C ambient temperature range and supports short-duration peak loads beyond 10 A as specified in the datasheet's transient performance section.

Does the DA9130-10RT1-A support dynamic voltage scaling (DVS) for CPU cores?

Yes, the DA9130-10RT1-A supports dynamic voltage control (DVC) via its I2C-compatible FM+ interface or dedicated GPIO pin, enabling real-time adjustment of the output voltage in 10 mV steps. This allows precise synchronization with CPU P-state transitions, reducing dynamic power consumption by up to 30 % in mobile and automotive SoC applications where the DA9130-10RT1-A serves as the primary core rail regulator.

What package type and dimensions does the DA9130-10RT1-A use?

The DA9130-10RT1-A uses a 24-pin FCQFN package measuring 3.3 mm × 4.8 mm with wettable flanks, designed for AOI-compatible reflow assembly and high thermal performance. Its compact footprint and 218 mm² total solution area (including two 220 nH inductors and two 20 µF output capacitors) make it ideal for space-constrained SIPP modules and portable electronics where the DA9130-10RT1-A is deployed.

Is the DA9130-10RT1-A qualified for automotive applications?

Yes, the DA9130-10RT1-A is AEC-Q100 Grade 2 qualified (operating from -40 °C to +105 °C ambient), with built-in over-temperature protection, cycle-by-cycle current limiting, and robust ESD ratings (2 kV HBM, 500 V CDM). These features validate its suitability for automotive infotainment, ADAS domain controllers, and body electronics where the DA9130-10RT1-A supplies critical processor and memory rails.

How does remote sensing improve regulation accuracy in the DA9130-10RT1-A?

The DA9130-10RT1-A employs dedicated FB1P/FB1N and FB2P/FB2N pins for Kelvin-style remote sensing, measuring voltage directly at the load instead of at the IC output. This compensates for IR drop across PCB traces and connectors, maintaining ±1 % static output voltage accuracy even with up to 50 mΩ of trace resistance - a critical capability for high-current CPU/GPU rails where the DA9130-10RT1-A is commonly applied.

DA9130-10RT1-A Specifications

Product attributes: Attribute value

Manufacturer:: Renesas

Series:: -

Package/Case:: 24-PowerUFQFN

Packaging:: Tray

Product Status:: Active

Applications:: Converter, CPU

Voltage - Input:: 2.5V ~ 5.5V

Number of Outputs:: 1

Voltage - Output:: 0.3V ~ 1.9V

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount, Wettable Flank

Supplier Device Package:: 24-FCQFN (3.3x4.8)

DA9130-10RT1-A FAQ

1.How can I place an order for DA9130-10RT1-A through Aetrix?

Please submit a Request for Quotation (RFQ) for DA9130-10RT1-A on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DA9130-10RT1-A reliable?

The price and inventory of DA9130-10RT1-A are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DA9130-10RT1-A is usually 5 days.

3.What payment methods are accepted for DA9130-10RT1-A?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DA9130-10RT1-A transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for DA9130-10RT1-A?

DA9130-10RT1-A orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DA9130-10RT1-A order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DA9130-10RT1-A?

For technical support, including DA9130-10RT1-A datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DA9130-10RT1-A requirements.

6.How does Aetrix verify that DA9130-10RT1-A is sourced from the original manufacturer or authorized distributors?

All DA9130-10RT1-A products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DA9130-10RT1-A meets industry standards.

7.What is the process for return or replacement of DA9130-10RT1-A?

All DA9130-10RT1-A units undergo pre-shipment inspection (PSI). If there is an issue with DA9130-10RT1-A, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DA9130-10RT1-A part is unused and in its original packaging.

Return procedure for DA9130-10RT1-A:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

Tech Hub

2026-09-07 TTL vs CMOS Logic Levels: 74HC and 74HCT Compatibility Explained

TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.

2026-09-04 Logic Level Shifter: How to Connect 3.3V and 5V Logic Safely

A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.

2026-09-03 74HC595 vs TPIC6B595: Output Drive, Pinout, Current, and Load Selection

The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…

2026-09-02 74HC595 Pinout, Timing, Output Current, and Applications

The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…

2026-09-01 Latch vs Flip-Flop: Timing, Differences and Design Choices

A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…

2026-08-30 D Latch Circuit: Truth Table, Timing, ICs and Applications

A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

2026-08-28 SR Latch Explained: NOR and NAND Circuits, Truth Tables, and Applications

An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…

2026-08-27 Latch Circuit: SR and D Latches, Truth Tables, Timing, and Applications

Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…

2026-08-21 What Is an LED Driver? Types, Circuits, Dimming, and Selection

An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

2026-08-18 Operational Amplifier (Op Amp): Basics, Configurations, Feedback and Applications

Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…