NXP Semiconductors DC6M501X6/12S,135

Overview

DC6M501X6/12S from NXP Semiconductors is a 6 MHz, 500 mA synchronous step-down DC-DC converter in WLCSP6 package, delivering fixed 1.2 V output from 2.3–5.5 V input with ±2% DC accuracy and up to 92% efficiency. It supports automatic PWM/PFM mode selection or forced PWM operation and integrates soft-start, short-circuit, and over-temperature protection for portable power rail generation.

For engineers reviewing the DC6M501X6/12S datasheet, DC6M501X6/12S pinout, DC6M501X6/12S application, or DC6M501X6/12S equivalent, key selection criteria include its 6 MHz switching frequency enabling ultra-small 470 nH inductor use, 0.4 mm pitch WLCSP6 footprint for space-constrained mobile designs, and MODE-pin configurable auto/forced PWM behavior specific to this /12S variant.

Technical Context

The DC6M501X6/12S implements a synchronous buck topology with integrated P-channel and N-channel MOSFETs (R_DS(on) = 0.15 Ω / 0.3 Ω), operating at a fixed 6 MHz PWM clock (5.4–6.6 MHz range) and supporting automatic transition between PWM and PFM based on load current detection. Its feedback loop uses external resistor divider connected to FB pin for output voltage regulation.

Control logic accepts either DC HIGH or 5–27 MHz clock signal on EN pin for enable, while MODE pin selects between automatic PWM/PFM (LOW) or forced PWM (HIGH); no power-good output is present in this /12S version, distinguishing it from /12A variants.

Key Specifications

Pinout & Package

DC6M501X6/12S uses a 6-bump Wafer-Level Chip-Size Package (WLCSP6) with 3×2 bump array, 0.4 mm pitch, and dimensions 1.36 mm × 0.96 mm × 0.47 mm. Bumps are solder balls facing down; index area located at bump A1.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar buck converter applications.

Compared with TPS62231DRYR and RT8059ZSP, DC6M501X6/12S delivers higher current at 6 MHz in the smallest footprint, making it optimal for space- and efficiency-critical 1.2 V core rails where fixed output suffices.

Availability

DC6M501X6/12S is available at Aetrix Electronics and suitable for smartphone core rails, tablet camera modules, digital still camera sensors, portable media player SoCs, and mobile internet device power management requiring stable component supply across high-volume production cycles.

Supply support for DC6M501X6/12S includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global semiconductor company headquartered in Eindhoven, Netherlands, specializing in secure connectivity solutions for automotive, industrial, and mobile applications.

The DC6M50xX6 family was designed specifically for ultra-compact, high-efficiency power conversion in battery-powered mobile devices, emphasizing minimal PCB area, low quiescent current, and robust protection features for consumer-grade reliability.

FAQ

What is the recommended inductor value for DC6M501X6/12S?

The DC6M501X6/12S is optimized for a 470 nH external inductor, such as Murata LQM21PNR47MC0 or FDK MIPS2012DOR5. This value enables stable 6 MHz operation with minimal output ripple and peak-to-peak voltage variation under full 500 mA load, as validated in NXP's application schematics and efficiency curves for the /12S variant.

Does DC6M501X6/12S support power-good indication?

No, DC6M501X6/12S does not include a power-good (XSHUTDOWN) output. That feature is exclusive to the DC6M503X6 series (e.g., DC6M503X6/12A). The /12S variant provides only MODE-controlled PWM/PFM selection and lacks the dedicated open-drain output pin required for power-good signaling.

Can DC6M501X6/12S be enabled using a clock signal instead of a DC HIGH level?

Yes, DC6M501X6/12S supports clock-enable functionality on its EN pin. A 5–27 MHz square wave with 40–60% duty cycle can be applied to EN to initiate soft-start and regulate output, enabling synchronization with SMIA-compliant camera modules or other clock-driven subsystems without requiring additional logic-level translation.

What is the maximum junction temperature and thermal protection behavior of DC6M501X6/12S?

The DC6M501X6/12S incorporates thermal shutdown at 150 °C junction temperature with 40 K hysteresis. When triggered, the internal PMOS switch disables, halting switching and allowing die temperature to decay. Once below 110 °C, the device automatically resumes operation with full soft-start sequencing to prevent thermal runaway under sustained overload.

Is DC6M501X6/12S compatible with lead-free reflow processes?

Yes, DC6M501X6/12S is a lead-free WLCSP6 device qualified for Pb-free reflow per J-STD-020C. Its peak reflow temperature specification is 230–260 °C, with time above 217 °C limited to 30–150 s. The package thickness (0.47 mm) places it in the <1.6 mm category, requiring 260 °C peak temperature for reliable solder joint formation.