Diodes Incorporated DCX54-16-13

Overview

DCX54-16-13 from Diodes Incorporated is an NPN epitaxial planar silicon transistor in SOT89-3L package, rated for 45 V V_CEO, 1 A continuous collector current, and 1 W power dissipation at T_A = 25°C; it delivers h_FE = 100–250 at I_C = 150 mA, V_CE = 2 V, and is optimized for medium-power switching in DC-DC converters and linear regulators.

For engineers reviewing the DCX54-16-13 datasheet, DCX54-16-13 pinout, DCX54-16-13 application, or DCX54-16-13 equivalent, key selection criteria include verified V_CEO/V_CBO = 45 V rating, confirmed SOT89-3L thermal resistance (R_θJA = 125 °C/W), h_FE binning consistency (–16 suffix), and RoHS-compliant matte tin plating on copper leadframe.

Technical Context

This NPN transistor uses epitaxial planar die construction to ensure stable gain and low leakage across –55°C to +150°C operating range. Its 15 pF C_obo at V_CB = 10 V and 200 MHz f_T support moderate-frequency switching up to ~10 MHz in hard-switched topologies.

Designed for surface-mount automated assembly, the device features a defined thermal pad layout per AP02001 and meets J-STD-020C Level 1 moisture sensitivity-enabling reflow without preconditioning. The SOT89-3L package provides enhanced thermal performance over SOT23 while maintaining compatibility with standard pick-and-place equipment.

Key Specifications

Pinout & Package

Package: SOT89-3L - Molded plastic case with exposed thermal pad, UL 94V-0 rated, 0.072 g mass, lead-free matte tin plating over copper leadframe.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar NPN medium-power switching applications.

Compared with ZTX653 and MJD122G, DCX54-16-13 offers tighter h_FE control and lower saturation voltage in the same SOT89-3L footprint-making it optimal for space-constrained, efficiency-critical 1 A switching applications where 45 V rating suffices.

Availability

DCX54-16-13 is available at Aetrix Electronics and suitable for DC-DC converters, linear regulators, motor drivers, and LED current sources requiring stable component supply with consistent h_FE binning and RoHS-compliant manufacturing.

Supply support for DCX54-16-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability, industry-standard components for power management and signal conditioning.

The DCX54 series belongs to Diodes' general-purpose bipolar transistor product line, designed specifically for cost-sensitive, medium-power switching and amplification tasks in industrial and consumer power supplies.

FAQ

What does the "–16" suffix indicate in DCX54-16-13?

The "–16" suffix denotes the h_FE gain bin: guaranteed 100–250 at I_C = 150 mA and V_CE = 2 V. This binning enables predictable base drive design without oversizing resistors for worst-case gain, improving board-level consistency in production.

Is the thermal pad (Pin 4) electrically connected to any internal node?

No-the exposed thermal pad in the SOT89-3L package is electrically isolated and serves only for thermal conduction. It must be soldered to a dedicated PCB copper pour tied to system ground or left floating, depending on layout constraints; no internal semiconductor connection exists.

Can DCX54-16-13 replace DCX54-13 in existing designs?

Yes-DCX54-16-13 and DCX54-13 share identical electrical specifications, package, and pinout; the only difference is h_FE binning (–16 = 100–250, –13 = 63–120). Substitution is safe if the circuit tolerates higher minimum gain or benefits from tighter h_FE spread.

What is the maximum allowable PCB temperature rise when operating at full 1 W dissipation?

At full 1 W dissipation and R_θJA = 125 °C/W, junction temperature rise is 125°C above ambient. To stay within the 150°C max T_j, PCB ambient must not exceed 25°C-so thermal design must limit board temperature rise via copper area, airflow, or heatsinking to maintain safe margins.