Diodes Incorporated DCX68-13

Overview

DCX68-13 from Diodes Incorporated is an NPN bipolar junction transistor in SOT89-3L package, rated for 20 V V_CEO, 1.0 A continuous collector current, and 1 W power dissipation at 25°C ambient. It delivers h_FE = 160–375 at V_CE = 1.0 V and I_C = 500 mA, with V_CE(SAT) ≤ 0.5 V at I_C = 1.0 A / I_B = 100 mA, and is used in medium-power switching circuits such as DC-DC converter output stages and relay drivers.

For engineers reviewing the DCX68-13 datasheet, DCX68-13 pinout, DCX68-13 application, or DCX68-13 equivalent, key selection criteria include verified V_CEO/I_C derating behavior, SOT89 thermal performance on FR-4 PCBs, h_FE consistency across production lots, and compatibility with automated pick-and-place systems due to its RoHS-compliant matte tin plating and Level 1 moisture sensitivity rating.

Technical Context

This NPN transistor employs epitaxial planar die construction for stable gain and low leakage. Its complementary PNP counterpart is DCX69, enabling push-pull configurations. The device operates across –55°C to +150°C junction temperature range and exhibits f_T = 330 MHz under V_CE = 5 V, I_C = 100 mA conditions.

Designed for surface-mount assembly, it features a three-terminal SOT89-3L outline with Collector (pins 1 & 4), Emitter (pin 2), and Base (pin 3) - confirmed by top-view schematic and mechanical drawings. Thermal resistance R_θJA is 125°C/W when mounted per Diodes' AP02001 pad layout.

Key Specifications

Pinout & Package

Package: SOT89-3L - surface-mount plastic package with exposed collector tab for thermal enhancement; dimensions per Diodes AP02001 (D = 4.50 mm, E = 2.50 mm, H = 4.10 mm, L = 1.05 mm); UL 94V-0 rated, moisture sensitivity Level 1.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar NPN medium-power switching applications.

Compared with BCX68-25, DCX68-13 offers identical performance and drop-in compatibility; versus MJD122G, it trades voltage headroom for higher gain and better thermal efficiency in compact SOT89 form factor - critical for space-constrained 12 V systems.

Availability

DCX68-13 is available at Aetrix Electronics and suitable for DC-DC converters, relay drivers, LED power switches, and linear regulator pass elements requiring stable component supply and RoHS-compliant manufacturing.

Supply support for DCX68-13 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, headquartered in Plano, Texas, with design, manufacturing, and sales operations across Asia, Europe, and North America.

The DCX68 series belongs to Diodes' general-purpose bipolar transistor product line, engineered for cost-effective, high-reliability medium-power switching and amplification in consumer, industrial, and automotive subsystems.

FAQ

Is DCX68-13 still in active production?

No - DCX68-13 is officially obsolete per Diodes' DS31163 Rev. 5 (May 2021). It has been discontinued and replaced by BCX68-25, which shares identical electrical and mechanical specifications. Aetrix Electronics maintains legacy inventory for design continuity and last-time buy support.

What is the maximum allowable power dissipation at 85°C ambient?

Using R_θJA = 125°C/W and T_J(max) = 150°C, the maximum allowable power at T_A = 85°C is (150 − 85) / 125 = 0.52 W. This must be validated with actual PCB copper area and airflow; Diodes recommends using their AP02001 pad layout for rated performance.

Can DCX68-13 be used in linear amplifier applications?

Yes - its f_T = 330 MHz and h_FE stability across I_C make it suitable for low-frequency linear amplification (e.g., audio preamp stages up to ~10 MHz). However, thermal derating is essential: at I_C = 500 mA and V_CE = 5 V, power dissipation reaches 2.5 W, exceeding its 1 W rating unless actively cooled.

How does the dual-collector configuration affect PCB layout?

Pins 1 and 4 are internally shorted to the collector and must be connected to the same net - typically a large copper pour for thermal relief. Diodes' suggested pad layout (AP02001) specifies a 3.0 mm × 2.7 mm thermal pad with 0.4 mm clearance; bridging both pins improves thermal transfer by ~15% versus single-pin connection.