Texas Instruments DDC316CGXGR

Overview

DDC316CGXGR from Texas Instruments is a 16-bit, 16-channel current-input analog-to-digital converter with dual-switched integrator front-end, programmable full-scale range (3–12 pC), adjustable integration time (10 µs to 1 ms), and serial/parallel data output. It directly digitizes low-level photodiode currents in medical CT scanner detector acquisition systems.

For engineers reviewing the DDC316CGXGR datasheet, DDC316CGXGR pinout, DDC316CGXGR application, or DDC316CGXGR equivalent, key selection criteria include integration time flexibility, current-to-voltage conversion linearity, channel-to-channel range matching (±1% FSR), noise performance (≤6 LSB rms at 10 pF sensor capacitance), and BGA-64 package compatibility with high-density medical imaging PCB layouts.

Technical Context

The DDC316CGXGR implements continuous current integration using paired integrators per channel: while Side A integrates input current, Side B is digitized by the on-chip 16-bit ADC-enabling uninterrupted charge collection. Integration timing is externally controlled via the CONV pin synchronized to CLK (up to 40 MHz), with HI_SPEED bit enabling 10 µs minimum integration.

It supports two output modes: TDM (multiplexed 16-channel data on DOUT1) and parallel (simultaneous 4-channel outputs on DOUT1–DOUT4). The device uses separate analog (+5 V AVDD) and digital (+3.3 V DVDD) supplies, with dedicated AGND/DGND/QGND pins and internal reference buffer (VREF = 4.096 V) or external reference option (VREF_IN).

Key Specifications

Pinout & Package

BGA-64 package (GXG variant), 8×8 mm, 0.8 mm pitch, bottom-side solder balls. Thermal pad exposed on underside for enhanced power dissipation in high-channel-count CT modules.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar current-input ADC applications.

Compared with ADAS1000-4BCPZ and ADS131M04IPBSR, the DDC316CGXGR uniquely delivers 16-channel current-input integration with programmable 10 µs–1 ms timing, eliminating external I-to-V stages and enabling direct photodiode interfacing in high-channel-density medical imaging systems.

Availability

DDC316CGXGR is available at Aetrix Electronics and suitable for CT scanner detector acquisition systems, photodiode array readout modules, X-ray security imaging systems, and medical PET detector front-ends requiring stable component supply across multi-year production cycles.

Supply support for DDC316CGXGR includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company headquartered in Dallas, Texas, specializing in analog, embedded processing, and high-reliability ICs for industrial, automotive, and medical applications.

The DDC316CGXGR belongs to TI's precision current-input ADC product line, engineered specifically for direct digitization of low-level photodiode and radiation detector currents in diagnostic imaging equipment.

FAQ

What is the minimum integration time supported by the DDC316CGXGR?

DDC316CGXGR supports a minimum integration time of 10 µs when the HI_SPEED bit is set to 0 and CLK = 40 MHz. This timing is enforced by internal state machines and must be met for both Side A and Side B integrations to ensure valid conversion results. At lower CLK frequencies or with HI_SPEED = 1, minimum tINT increases to 20 µs.

How does the DDC316CGXGR handle channel-to-channel gain matching?

The DDC316CGXGR achieves ±1% full-scale range (FSR) matching across all 16 channels through laser-trimmed on-chip integration capacitors and matched integrator architectures. This specification is measured at TA = +25°C and holds over 0°C–70°C with ±10 ppm/°C range drift match-enabling uniform response in multi-element detector arrays without per-channel calibration.

Can the DDC316CGXGR operate with an external voltage reference?

Yes, the DDC316CGXGR supports external reference operation via the VREF_IN pin (Pin 4B). When BUFDIS bit = 1 in the configuration register, the internal reference buffer is disabled and VREF_IN accepts a stable 4.096 V ±0.1 V source. This mode reduces total power dissipation by ~100 mW and improves long-term drift performance compared to internal buffering.

What are the power supply requirements for the DDC316CGXGR?

DDC316CGXGR requires two independent supplies: AVDD = +5 V (4.75–5.25 V) for analog circuitry including integrators and reference buffer, and DVDD = +3.3 V (3.0–3.6 V) for digital logic and serial interface. Total power dissipation is 440–640 mW depending on BUFDIS setting and output mode-requiring thermal-aware PCB layout with exposed thermal pad soldering.

Does the DDC316CGXGR support daisy-chain configuration for multiple devices?

Yes, the DDC316CGXGR supports daisy-chain readback via DIN (Pin 7E) and DOUT1 (Pin 8E). In TDM mode, up to four DDC316CGXGR devices can be cascaded using shared CLK, CONV, and DCLK lines, with DVALID synchronized to the last device. Maximum daisy-chain clock rate is 20 MHz, limiting aggregate throughput in multi-device configurations.