Diodes Incorporated DDZ23-7

Overview

DDZ23-7 from Diodes Incorporated is a surface-mount precision Zener diode with nominal zener voltage 22.61–23.77 V at 5 mA test current, ±5% tolerance, 35 Ω dynamic impedance at 5 mA, and 0.05 µA reverse leakage at 19.0 V. It operates in SOD123 package and serves as a stable voltage reference or overvoltage clamp in power supply feedback loops and analog signal conditioning circuits.

For engineers reviewing the DDZ23-7 datasheet, DDZ23-7 pinout, DDZ23-7 application, or DDZ23-7 equivalent, key selection criteria include zener voltage tightness (±5%), low thermal resistance (425 °C/W on minimal pad), automotive-grade availability (Q-variant), RoHS/Green compliance, and SOD123 footprint compatibility with high-density PCB layouts.

Technical Context

This device functions as a two-terminal, cathode-banded voltage reference diode operating in reverse breakdown. Its zener voltage exhibits a positive temperature coefficient (~0.08 %/°C at 23 V), optimized for stability across –65 to +150 °C ambient range. The SOD123 package enables automated placement while maintaining 294 mW power dissipation under minimal copper pad conditions.

It delivers precise regulation with 35 Ω zener impedance at 5 mA and maintains <0.05 µA reverse current at VR = 19.0 V - critical for low-power biasing and sensing applications where leakage-induced error must be minimized.

Key Specifications

Pinout & Package

DDZ23-7 uses a two-terminal SOD123 package with cathode identified by a band on the body. No anode/cathode labeling appears on the die; polarity is defined solely by the molded cathode band. The device has no internal connections beyond the two external terminals.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar precision Zener diode applications.

Compared with BZX84-C24 and MMSZ5248B, DDZ23-7 offers superior low-current regulation (5 mA test point), lower leakage at rated VR, and optimized thermal performance in SOD123 - making it preferred for precision, low-power, and automotive-grade voltage referencing.

Availability

DDZ23-7 is available at Aetrix Electronics and suitable for switch-mode power supplies, industrial sensor interfaces, automotive ECUs, and programmable logic controller input stages requiring stable component supply with full traceability and long-term lifecycle support.

Supply support for DDZ23-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and integrated circuits, headquartered in Plano, Texas, with design, manufacturing, and sales operations across Asia, Europe, and North America.

The DDZ series targets high-precision, surface-mount Zener references for power management and signal conditioning, emphasizing tight voltage tolerance, low leakage, and automotive qualification readiness.

FAQ

What is the maximum reverse voltage (V_R) before significant leakage occurs?

DDZ23-7 specifies 0.05 µA reverse current at V_R = 19.0 V. Below this voltage, leakage remains negligible (<10 nA typical). Operation above 19.0 V enters the soft breakdown region, where current rises exponentially - design must ensure V_R does not exceed 19.0 V in non-regulating roles to maintain signal integrity.

Can DDZ23-7 replace a 24 V Zener in existing SOD123 footprints?

No - DDZ23-7's 22.61–23.77 V range is intentionally below 24 V and not interchangeable with 24 V devices like BZX84-C24 or MMSZ5248B without circuit recalibration. Its 5 mA test current also differs from common 20 mA Zeners, affecting bias point and thermal behavior in shared footprints.

Is the SOD123 package lead-free and RoHS compliant?

Yes - DDZ23-7 uses matte tin annealed terminals over Alloy 42 leadframe and fully complies with EU RoHS 3 (2015/863/EU), contains <900 ppm bromine/chlorine and <1000 ppm antimony, and carries UL 94V-0 flammability rating per its molded green compound construction.

How does thermal resistance change with PCB copper area?

R_θJA is 425 °C/W with minimal recommended pad (1× pad layout) and improves to 266 °C/W with 1 in² copper area. Doubling copper area typically reduces R_θJA by ~15–20%; actual improvement depends on layer count, via stitching, and proximity to ground planes - consult Diodes' AN-501 for layout optimization guidelines.