Diodes Incorporated DDZ8V2CS-7

Overview

DDZ8V2CS-7 from Diodes Incorporated is a surface-mount precision Zener diode with nominal zener voltage 8.2 V (min 8.03 V, max 8.45 V), 20 mA test current, 8 Ω dynamic impedance at 20 mA, 0.5 µA reverse leakage at 6.5 V, and 200 mW power dissipation in SOD323 package. It provides stable voltage reference in low-power analog circuits, power supply feedback paths, and overvoltage protection clamping.

For engineers reviewing the DDZ8V2CS-7 datasheet, DDZ8V2CS-7 pinout, DDZ8V2CS-7 application, or DDZ8V2CS-7 equivalent, this page delivers verified electrical specs, thermal derating behavior, SOD323 terminal mapping, real-world use cases, and validated alternative parts for design flexibility and supply continuity.

Technical Context

This device operates as a two-terminal voltage reference diode, conducting in reverse breakdown with sharp knee characteristics and tight ±1.3% V_Z tolerance (8.03–8.45 V). Its low 8 Ω zener impedance at 20 mA ensures minimal output voltage variation under load changes.

Designed for high-reliability automated assembly, it features matte tin–annealed terminals on Alloy 42 leadframe, UL 94V-0 molded plastic case, and moisture sensitivity level 1. Thermal resistance is 625 °C/W (junction-to-ambient) on FR-4 board with recommended pad layout.

Key Specifications

Pinout & Package

Package: SOD323 - ultra-compact 1.30 mm × 1.70 mm surface-mount plastic case with cathode band marking; weight ≈ 0.004 g; RoHS-compliant, halogen- and antimony-free "Green" construction.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar precision Zener diode applications.

Compared with BZX84-C8V2 and MMBZ5236B, DDZ8V2CS-7 delivers tighter voltage control (±1.3% vs. ±5%), lower dynamic impedance (8 Ω vs. ≥15 Ω), and smaller SOD323 footprint-making it optimal for space-constrained industrial and IoT designs requiring high-precision clamping or referencing.

Availability

DDZ8V2CS-7 is available at Aetrix Electronics and suitable for industrial sensor signal conditioning, USB-C power delivery clamp circuits, and programmable logic controller input protection requiring stable component supply and long-term lifecycle assurance.

Supply support for DDZ8V2CS-7 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Diodes Incorporated is a global manufacturer of discrete semiconductors and analog ICs, specializing in high-reliability, energy-efficient components for industrial, computing, and consumer markets.

DDZ8V2CS-7 belongs to the DDZ5V1BS–DDZ47S precision Zener series, engineered for applications demanding tight voltage tolerance, low leakage, and robust automated assembly performance in compact SOD323 packaging.

FAQ

What is the maximum continuous reverse current the DDZ8V2CS-7 can handle without degradation?

The device is rated for 200 mW total power dissipation at 25°C ambient. At its nominal 8.2 V zener voltage, this corresponds to a maximum continuous reverse current of 24.4 mA (200 mW ÷ 8.2 V). Derating applies above 25°C per Figure 1 - at 70°C ambient, max current drops to ~15.6 mA to maintain junction temperature within 150°C limit.

Does the DDZ8V2CS-7 have a specified temperature coefficient, and how does it affect regulation stability?

Per Figure 12–15 in DS30414 Rev. 10-2, the DDZ8V2CS-7 exhibits a typical temperature coefficient of +0.06 %/°C near 8.2 V. This means V_Z increases by ~4.9 mV/°C over its operating range. For a 50°C ambient swing, total drift is ~245 mV - acceptable for non-critical references but requires compensation in metrology-grade designs.

Can DDZ8V2CS-7 be used in forward-bias applications like standard diodes?

Yes - its forward voltage is specified as 0.9 V at 10 mA, consistent with silicon PN junction behavior. However, it is not optimized for rectification: its forward I-V curve lacks soft recovery or fast switching specs, and its low 200 mW rating limits forward power handling. Use only for low-current biasing or polarity indication, not power conversion.

How does the SOD323 package impact thermal performance compared to SOT-23 alternatives?

The SOD323's smaller footprint (1.30 × 1.70 mm vs. SOT-23's 2.9 × 1.3 mm) reduces copper area for heat spreading, resulting in higher R_θJA (625 °C/W vs. ~350 °C/W for typical SOT-23). This requires careful thermal pad design - e.g., 2 mm² exposed copper connected to internal ground plane - to avoid exceeding 150°C junction temperature at full 200 mW load.