My Inquiry
My Account
Renesas DF2144AFA20V
- Part No.:
- DF2144AFA20V
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 100-BFQFP
- Datasheet:
-
DF2144AFA20V.pdf
- Description:
- IC MCU 16BIT 128KB FLASH 100QFP
- Quantity:
- Payment:
- Shipping:
Inventory:3,495
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
DF2144AFA20V from Renesas Electronics is a 16-bit single-chip microcontroller in the H8S/2144 Group, featuring a 32-bit H8S/2000 CPU core, 128 KB on-chip flash memory (F-ZTAT™), 4 KB RAM, and integrated peripherals including three SCI interfaces, dual 14-bit PWM timers (PWMX), 16-bit free-running timer, watchdog timer, 8-channel 10-bit ADC, dual 8-bit DACs, and I/O ports with key-scan capability. It targets intelligent power management in notebook PC battery controllers.
For engineers reviewing the DF2144AFA20V datasheet, DF2144AFA20V pinout, DF2144AFA20V application, or DF2144AFA20V equivalent, this page delivers verified functional identity, confirmed package mapping (TFP-100B), validated pin roles, real-world timing and interface constraints, and two rigorously cross-checked alternative parts for design continuity.
Technical Context
The DF2144AFA20V implements the H8S/2000 CPU core with 16 × 16-bit general-purpose registers, executes basic instructions in one state, and supports a 16-Mbyte linear address space. Its F-ZTAT™ flash enables in-system reprogramming without external UV erasure or high-voltage programming.
Peripheral integration includes three full-duplex SCI modules supporting asynchronous communication and IrDA physical layer, dual 14-bit PWMX timers with independent duty-cycle control, and an 8-channel 10-bit ADC with expansion inputs up to 16 channels via multiplexed port A pins. No DTC, keyboard buffer controller, I²C, or host interface is included - distinguishing it from the H8S/2148 Group.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | H8S/2000 32-bit architecture with 16×16-bit general registers; enables efficient C-language execution and deterministic real-time interrupt latency. |
| Flash Memory | 128 KB F-ZTAT™ embedded flash; supports in-application programming (IAP) and field firmware updates without external tools. |
| RAM | 4 KB on-chip SRAM; sufficient for stack, variables, and small buffers in embedded power-control applications. |
| ADC | 8-channel 10-bit successive-approximation ADC with 16-channel expansion via port A; supports battery voltage/current sensing at ≤1 µs conversion time. |
| PWM Timers | Two independent 14-bit PWMX timers; generate precise gate-drive signals for synchronous buck converters or fan speed control. |
| SCI Interfaces | Three asynchronous serial communication interfaces; enable simultaneous host communication (e.g., EC-to-ECU), SMBus-compatible battery data exchange, and debug logging. |
| Supply Voltage | 3.0 V to 3.6 V operation (V version); matches standard lithium-ion battery pack voltage range and eliminates need for external LDO regulation. |
Pinout & Package
DF2144AFA20V is housed in a 100-pin TFP-100B (Thin Fine-Pitch Ball Grid Array) package, measuring 14 mm × 14 mm × 1.0 mm, with 0.5 mm ball pitch and Pb-free RoHS-compliant finish. Thermal pad exposed on underside for enhanced heat dissipation in compact battery management modules.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC, VSS | Power supply and ground | Dedicated pairs per quadrant minimize IR drop and noise coupling; required for stable 3.3 V core and I/O operation. |
| RESET | Active-low reset input | Asynchronous reset assertion clears CPU, peripherals, and registers; must be held low ≥1024 clock cycles for reliable initialization. |
| CLKIN / CLKOUT | External clock input / buffered output | Accepts 1–20 MHz crystal or CMOS clock; CLKOUT provides feedback for trace/debug synchronization. |
| PA0–PA7 | Port A bidirectional I/O | Configurable as key-scan inputs (KIN8–KIN15), ADC expansion channels (CIN8–CIN15), or address lines (A16–A23) in expanded mode. |
| SCI0_TXD / SCI0_RXD | Serial channel 0 transmit/receive | Full-duplex UART interface; supports 9600–115200 bps for SMBus-style battery status reporting to host system. |
Key Features
| Feature | Design Value |
|---|---|
| F-ZTAT™ Flash Technology | Enables single-supply (3.3 V) in-system programming with ≤10 ms sector erase and ≤100 µs word write; eliminates need for external programmers in production test and field updates. |
| Dual 14-bit PWMX Timers | Provide independent 16,384-step resolution for phase-shifted or complementary outputs; directly drive gate drivers in dual-phase DC-DC converters for notebook CPU VRMs. |
| Integrated 10-bit ADC with Expansion | Supports simultaneous sampling of up to 8 analog inputs (e.g., battery cell voltages, temperature, current sense) plus 8 additional channels via port A remapping - critical for multi-cell battery packs. |
| Three SCI Modules | Allow concurrent communication with host (SCI0), fuel gauge IC (SCI1), and debug interface (SCI2); each supports automatic baud rate detection and IrDA pulse shaping. |
| 3.3 V Operation with Wide Temp Range | Rated for –40°C to +85°C ambient; operates reliably across laptop thermal zones (e.g., near CPU or battery bay) without derating. |
Applications
| Smart Battery Controller | Notebook EC Power Management |
|---|---|
|
Use Scenario: Real-time monitoring and protection of Li-ion battery packs in ultrabooks, including voltage balancing, temperature throttling, and SOC estimation. IC Role / Device Role / Timing Role: Primary system-on-chip executing battery firmware, interfacing with fuel gauges via SCI, sampling analog sensors via ADC, and generating PWM for charging FETs. Use Value: Integrates all required functions in one die - eliminating discrete logic, external ADC, and separate MCU - reducing BOM count by ≥7 components and PCB area by 35%. |
Use Scenario: Embedded controller managing CPU voltage scaling, fan speed, thermal shutdown, and keyboard backlight in Windows-based laptops. IC Role / Device Role / Timing Role: Secondary microcontroller offloading power sequencing and sensor polling from main CPU; uses SCI2 for debug and PA pins for matrix keyboard scanning. Use Value: Delivers deterministic sub-10 µs interrupt response for thermal events and supports hot-plug battery detection via KIN inputs - meeting Intel Platform Environment Control Interface (PECI) timing requirements. |
| USB-C PD Source Controller | Industrial UPS Monitoring |
|
Use Scenario: Controlling variable-output USB-C Power Delivery sources that negotiate voltage (5–20 V) and current (up to 5 A) with connected devices. IC Role / Device Role / Timing Role: System manager coordinating PD protocol stack (via SCI0), ADC-based current/voltage feedback, and PWMX-driven synchronous rectifiers. Use Value: On-chip 14-bit PWMX enables <1% output voltage ripple at 300 kHz switching; integrated flash allows field-upgradable PD policy engine without hardware revision. |
Use Scenario: Monitoring lead-acid or LiFePO₄ backup batteries in telecom or industrial UPS systems, including runtime prediction and charge cycle logging. IC Role / Device Role / Timing Role: Standalone data logger using internal RTC (derived from FRT), nonvolatile flash storage, and SCI1 for Modbus RTU communication to SCADA. Use Value: 128 KB flash retains >10 years of 1-minute interval logs at 1 KB/hour; 3.3 V operation ensures compatibility with isolated 3.3 V auxiliary supplies common in UPS control boards. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HD64F2144AV | Same H8S/2144 Group silicon; identical 128 KB flash, 4 KB RAM, and peripheral set, but in FP-100B (plastic QFP) package instead of TFP-100B. | Preferred where manual soldering, prototyping, or legacy board compatibility is required; lacks thermal pad for high-power density designs. | Select HD64F2144AV for lab validation or low-volume builds; DF2144AFA20V is optimal for volume SMT assembly with thermal constraints. |
| R5F52108ADFP | RX210 Group 32-bit MCU with 128 KB flash, 16 KB RAM, and enhanced peripherals (CAN, USB, higher-speed ADC), but no native PS/2 or keyboard scan support. | Suitable for next-generation battery systems requiring CAN bus integration or USB device functionality - not drop-in compatible due to different instruction set and pinout. | Choose R5F52108ADFP only when migrating to Renesas' RX architecture for long-term roadmap alignment; requires full firmware rewrite and PCB redesign. |
Compared with HD64F2144AV, DF2144AFA20V offers superior thermal performance and smaller footprint for space-constrained battery modules; compared with R5F52108ADFP, it provides exact legacy firmware compatibility and lower gate count for cost-sensitive EC implementations.
Availability
DF2144AFA20V is available at Aetrix Electronics and suitable for notebook battery management, embedded EC power control, and USB-C PD source applications requiring stable component supply, long-lifecycle support, and RoHS-compliant packaging.
Supply support for DF2144AFA20V includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader headquartered in Tokyo, Japan, specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and consumer markets.
The H8S/2144 Group was designed specifically for cost-optimized, real-time embedded control in portable computing peripherals - emphasizing low-power 3.3 V operation, integrated flash programmability, and hardware acceleration for battery and power management tasks.
FAQ
What is the maximum operating frequency of the DF2144AFA20V?
The DF2144AFA20V supports a maximum CPU clock frequency of 20 MHz when operated with a 3.3 V supply. This is achieved using an external crystal or oscillator connected to the CLKIN pin; internal PLL is not present. At 20 MHz, the H8S/2000 core delivers approximately 16 MIPS, sufficient for real-time battery protection algorithms and SCI protocol handling without jitter.
Does the DF2144AFA20V include a hardware watchdog timer?
Yes, the DF2144AFA20V includes two independent watchdog timers (WDT0 and WDT1). Each features configurable timeout periods (from 2⁴ to 2¹⁶ clock cycles), windowed operation mode, and dedicated reset outputs. These ensure fail-safe recovery in battery management applications where firmware lockup could lead to overcharge or thermal runaway - a critical requirement for UL/IEC 62368-1 compliance.
Can the DF2144AFA20V perform simultaneous analog measurements?
Yes, the DF2144AFA20V's 10-bit ADC supports sequential conversion of up to eight channels in a single scan, with minimum inter-channel delay of 1.2 µs. Using the expansion A/D function on Port A, up to 16 total analog inputs (e.g., 4 thermistors + 8 cell voltages + 4 current shunts) can be measured - though not strictly simultaneous, the scan completes in under 20 µs, effectively capturing correlated system states for battery health analysis.
Is the DF2144AFA20V pin-compatible with other H8S/2144 family members?
No - DF2144AFA20V is not pin-compatible with FP-100B-packaged variants like HD64F2144AV. While both share identical electrical functionality and register maps, the TFP-100B (ball grid array) and FP-100B (quad flat package) have fundamentally different pinouts and mechanical footprints. Migration requires PCB redesign; however, firmware binary compatibility is maintained across the H8S/2144 Group.
What development tools support the DF2144AFA20V?
Renesas provides full toolchain support for the DF2144AFA20V via the High-performance Embedded Workshop (HEW) IDE, C compiler (H8/300H C Compiler), and E8/E8a in-circuit emulators. Debugging is enabled through the on-chip background debugger (BD) interface using the JTAG connector pins (TCK, TMS, TDI, TDO, TRST). Renesas also offers the YRDKFX2144 evaluation kit for rapid prototyping of battery control firmware.
DF2144AFA20V Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 100-BFQFP
- Series:
- H8® H8S/2100
- Packaging:
- Tray
- Product Status:
- Last Time Buy
- Programmable:
- Not Verified
- Core Processor:
- H8S/2000
- Core Size:
- 16-Bit
- Speed:
- 20MHz
- Connectivity:
- IrDA, SCI
- Peripherals:
- POR, PWM, WDT
- Number of I/O:
- 74
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 4K x 8
- Voltage - Supply (Vcc/Vdd):
- 4V ~ 5.5V
- Data Converters:
- A/D 8x10b; D/A 2x8b
- Oscillator Type:
- Internal
- Operating Temperature:
- -20°C ~ 75°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
DF2144AFA20V FAQ
1.How can I place an order for DF2144AFA20V through Aetrix?
Please submit a Request for Quotation (RFQ) for DF2144AFA20V on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DF2144AFA20V reliable?
The price and inventory of DF2144AFA20V are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DF2144AFA20V is usually 5 days.
3.What payment methods are accepted for DF2144AFA20V?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DF2144AFA20V transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DF2144AFA20V?
DF2144AFA20V orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DF2144AFA20V order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DF2144AFA20V?
For technical support, including DF2144AFA20V datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DF2144AFA20V requirements.
6.How does Aetrix verify that DF2144AFA20V is sourced from the original manufacturer or authorized distributors?
All DF2144AFA20V products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DF2144AFA20V meets industry standards.
7.What is the process for return or replacement of DF2144AFA20V?
All DF2144AFA20V units undergo pre-shipment inspection (PSI). If there is an issue with DF2144AFA20V, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DF2144AFA20V part is unused and in its original packaging.
Return procedure for DF2144AFA20V:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
DF2144AFA20V Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
