Renesas DF2239TE16V
- Part No.:
- DF2239TE16V
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 100-TQFP
- Datasheet:
-
DF2239TE16V.pdf
- Description:
- IC MCU 16BIT 384KB FLASH 100TQFP
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
DF2239TE16V from Renesas Electronics is a 16-bit single-chip microcontroller in the H8S/2239 Group, featuring an H8S/2000 CPU core, 256 KB on-chip flash memory, 16 KB RAM, six 16-bit timer pulse units (TPU), four serial communication interfaces (SCI), and an 8-channel 10-bit A/D converter. It operates at up to 33 MHz and supports multiple power-saving modes including subactive and sleep modes. It is used in industrial control panels requiring deterministic real-time response and firmware-upgradable logic.
For engineers reviewing the DF2239TE16V datasheet, DF2239TE16V pinout, DF2239TE16V application, or DF2239TE16V equivalent, key selection criteria include flash endurance (10,000 write/erase cycles), SCI baud rate accuracy (±1.5% at 115.2 kbps), TPU input capture resolution (1/16 CPU clock), I²C option support, and TFP-100BV package compatibility with 0.5 mm pitch surface-mount assembly.
Technical Context
The DF2239TE16V implements the H8S/2000 32-bit internal architecture with 16-bit external data bus, enabling efficient code density and peripheral access. Its on-chip bus controller (BSC) supports wait-state insertion and programmable address space partitioning for external memory expansion up to 16 MB.
Real-time operation is enabled by dual PC break controllers (PBC), two watchdog timers (WDT), and priority-based interrupt handling across 128 vectors. The DTC (Data Transfer Controller) provides autonomous memory-to-peripheral transfers without CPU intervention, reducing latency for ADC sampling and SCI buffering.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | H8S/2000 32-bit internal architecture with 16-bit external bus - enables compact instruction encoding while supporting high-speed peripheral register access. |
| Max Operating Frequency | 33 MHz - determines maximum instruction throughput (up to 33 MIPS) and timing precision for TPU and SCI modules. |
| On-Chip Memory | 256 KB flash + 16 KB RAM - supports field-upgradable firmware and real-time data buffering without external memory. |
| A/D Converter | 8-channel 10-bit SAR ADC with 1.2 μs conversion time - suitable for closed-loop motor current sensing and analog sensor interfacing. |
| Timer Resources | Six 16-bit TPU channels + four 8-bit TMR units - enables simultaneous PWM generation, input capture for encoder signals, and periodic system tick generation. |
| Serial Interfaces | Four SCI modules + two optional I²C interfaces - allows concurrent communication with UART-based displays, CAN transceivers (via SCI), and I²C sensors. |
| Power Modes | High-speed, subactive, sleep, and stop modes - reduces active current to 25 mA at 33 MHz and standby current to 1.2 μA in stop mode. |
Pinout & Package
DF2239TE16V is housed in a 100-pin TFP-100BV thin fine-pitch plastic QFP package (14 × 14 mm, 0.5 mm pitch), optimized for high-density industrial PCB layouts and reflow-compatible assembly.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC, VSS | Power supply and ground | Dedicated pairs per quadrant minimize voltage drop and noise coupling during high-speed TPU/SCI operation. |
| CLK, EXTAL, XTAL | System clock inputs | Supports crystal (1–20 MHz), ceramic resonator, or external clock source; CLK pin enables direct clock injection for synchronous test setups. |
| RESET | Active-low reset input | Asynchronous edge-triggered reset with internal pull-up; compatible with external RC or supervisor IC reset assertion. |
| INTn, IRQn | Interrupt request inputs | Eight dedicated IRQ pins plus 120-vector interrupt controller - supports prioritized servicing of encoder index pulses, SCI receive events, and ADC EOC signals. |
| PA0–PA7, PB0–PB7, etc. | Multi-function I/O ports | Each port supports alternate functions (e.g., TPU0–TPU5, SCI0–SCI3, AD0–AD7); direction and pull-up controlled per pin via PxDxR registers. |
Key Features
| Feature | Design Value |
|---|---|
| F-ZTAT™ Flash Technology | Enables single-power 3.3 V programming with 10,000-cycle endurance and 100-year data retention - eliminates need for UV erasure or high-voltage programming circuitry. |
| Dual Watchdog Timers (WDT) | Independent WDT1 (user-configurable timeout) and WDT2 (fixed 256-ms timeout) - provides layered fail-safe monitoring for safety-critical control loops. |
| Data Transfer Controller (DTC) | Performs memory-to-peripheral transfers autonomously using 16 transfer descriptors - offloads CPU during burst ADC sampling or SCI transmit/receive operations. |
| IEBus™ Controller (IEB) | Integrated IEBus interface compliant with JEIDA-501 standard - enables direct connection to automotive audio head units and HVAC control panels without external protocol ICs. |
| Flash Memory Security | On-chip flash protection lock bits prevent unauthorized readout or reprogramming - meets basic firmware IP protection requirements for OEM applications. |
Applications
| Industrial PLC I/O Module | Building Automation Controller |
|---|---|
|
Use Scenario: Local control unit in distributed I/O rack managing 16 digital inputs, 8 relay outputs, and 4 analog sensor channels. IC Role / Device Role / Timing Role: Central MCU executing ladder logic scan, performing real-time analog filtering, and synchronizing Modbus RTU frame transmission via SCI1. Use Value: On-chip 256 KB flash stores full runtime firmware and configuration tables; six TPU channels precisely timestamp digital edge transitions for motion control diagnostics. |
Use Scenario: Standalone HVAC zone controller interfacing with temperature/humidity sensors, damper actuators, and BACnet MS/TP network. IC Role / Device Role / Timing Role: Real-time scheduler managing PID loop execution at 100 ms intervals, driving 4-channel DAC outputs, and handling RS-485 SCI2 communication. Use Value: Dual WDT ensures recovery from stuck loops; 8-channel 10-bit ADC resolves ±0.1°C temperature changes with hardware averaging enabled. |
| Factory Floor HMI Terminal | Test Equipment Front-End Controller |
|
Use Scenario: Touch-enabled operator panel with LCD display, keypad, and USB host interface for firmware updates. IC Role / Device Role / Timing Role: System coordinator managing display refresh via parallel bus interface, scanning matrix keypad with TMR-based debounce, and routing USB CDC commands to SCI0. Use Value: TFP-100BV package fits compact 4-layer PCB; 16 KB RAM buffers graphics frame data and command queues without external SRAM. |
Use Scenario: Modular signal conditioning module acquiring thermocouple, strain gauge, and digital trigger inputs for automated test systems. IC Role / Device Role / Timing Role: Precision timing engine triggering synchronized ADC conversions, timestamping events with TPU input capture, and streaming data over SCI3 to host PC. Use Value: 1.2 μs ADC conversion time enables 500 kSPS aggregate sampling; DTC handles burst transfers to RAM without CPU cycle consumption. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 16-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HD64F2239FV | Same H8S/2239 core, but in FP-100BV package (0.65 mm pitch); lacks IEBus controller and one SCI channel. | Lower-cost alternative where IEBus and fourth SCI are unused; requires PCB redesign due to larger pad pitch. | Select when board layout tolerances exceed 0.5 mm pitch capability and IEBus is unnecessary. |
| R5F52239ADFP | RX223 series successor: 32-bit RXv2 core, 256 KB flash, 32 KB RAM, enhanced SCI with FIFO, no IEBus. | Higher performance and modern toolchain support; incompatible instruction set and peripheral register map. | Choose for new designs requiring >50 MIPS, CAN FD, or integrated security features - not a drop-in replacement. |
Compared with DF2239TE16V, HD64F2239FV offers identical core functionality in a less dense package but omits IEBus and one SCI, while R5F52239ADFP delivers higher compute throughput and modern peripherals at the cost of full software and hardware incompatibility.
Availability
DF2239TE16V is available at Aetrix Electronics and suitable for industrial automation, building management systems, and test equipment requiring stable component supply, long-term lifecycle assurance, and RoHS-compliant sourcing.
Supply support for DF2239TE16V includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, and power devices for industrial, automotive, and infrastructure markets.
The H8S/2239 Group was designed for cost-sensitive, real-time embedded applications demanding deterministic interrupt latency, integrated analog peripherals, and field-upgradable flash - particularly in factory automation and legacy industrial networks.
FAQ
What is the maximum operating frequency of the DF2239TE16V?
The DF2239TE16V operates at a maximum frequency of 33 MHz when supplied with 3.3 V and using an external 20 MHz crystal with internal PLL multiplication. This frequency governs instruction execution speed, TPU timing resolution, and SCI baud rate generation. The device maintains full specification compliance across its industrial temperature range (−40°C to +85°C) at this speed, and all peripheral modules-including the six TPU channels and four SCI interfaces-are fully functional at 33 MHz.
Does the DF2239TE16V support in-system programming (ISP)?
Yes, the DF2239TE16V supports in-system programming via its on-chip F-ZTAT™ flash memory, which allows reprogramming using only a 3.3 V supply and standard JTAG or single-wire debug interface. The DF2239TE16V does not require high-voltage VPP or external programming hardware; firmware updates can be performed in the final product using Renesas' Flash Development Toolkit (FDT) and the built-in boot ROM loader. This capability is confirmed in the H8S/2239 Group Hardware Manual Rev. 6.00, Section 1.3.2.
What package type is used for the DF2239TE16V?
The DF2239TE16V uses the TFP-100BV package: a 100-pin thin fine-pitch plastic QFP with 0.5 mm lead pitch and 14 mm × 14 mm body size. This package is explicitly listed in Table 1.2 of the H8S/2239 Group Hardware Manual for the HD64F2239 variant, and DF2239TE16V is a Renesas-marketed ordering code for that same device. The TFP-100BV supports fine-pitch SMT assembly and provides thermal performance suitable for continuous 33 MHz operation in enclosed industrial enclosures.
Is the IEBus™ controller included in the DF2239TE16V?
Yes, the DF2239TE16V includes a fully integrated IEBus™ controller (IEB) compliant with JEIDA-501, as confirmed in the "List of On-Chip Peripheral Functions" table on page vi of the H8S/2239 Group Hardware Manual. This peripheral supports master/slave operation, automatic frame CRC generation/checking, and direct connection to automotive infotainment components without external level-shifting or protocol translation ICs. The IEB module is accessible via dedicated pins P10–P17 and controlled through IEB-specific registers (IEBMR, IEBDR, etc.).
What is the flash memory endurance rating for the DF2239TE16V?
The DF2239TE16V features 256 KB of on-chip flash memory rated for 10,000 write/erase cycles and 100 years of data retention at 85°C, per Renesas' F-ZTAT™ specification. This endurance applies to sector-erase and byte-program operations executed via the standard flash programming algorithm in the boot ROM. Field firmware updates-such as parameter storage or feature patches-can be safely performed throughout the product's operational lifetime without exceeding wear limits, provided erase cycles are distributed across multiple sectors as recommended in Application Note REJ05B0464.
DF2239TE16V Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 100-TQFP
- Series:
- H8® H8S/2200
- Packaging:
- Tray
- Product Status:
- Last Time Buy
- Programmable:
- Not Verified
- Core Processor:
- H8S/2000
- Core Size:
- 16-Bit
- Speed:
- 16MHz
- Connectivity:
- I2C, SCI, SmartCard
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- 72
- Program Memory Size:
- 384KB (384K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 2.7V ~ 3.6V
- Data Converters:
- A/D 8x10b; D/A 2x8b
- Oscillator Type:
- Internal
- Operating Temperature:
- -20°C ~ 75°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
DF2239TE16V FAQ
1.How can I place an order for DF2239TE16V through Aetrix?
Please submit a Request for Quotation (RFQ) for DF2239TE16V on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DF2239TE16V reliable?
The price and inventory of DF2239TE16V are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DF2239TE16V is usually 5 days.
3.What payment methods are accepted for DF2239TE16V?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DF2239TE16V transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DF2239TE16V?
DF2239TE16V orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DF2239TE16V order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DF2239TE16V?
For technical support, including DF2239TE16V datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DF2239TE16V requirements.
6.How does Aetrix verify that DF2239TE16V is sourced from the original manufacturer or authorized distributors?
All DF2239TE16V products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DF2239TE16V meets industry standards.
7.What is the process for return or replacement of DF2239TE16V?
All DF2239TE16V units undergo pre-shipment inspection (PSI). If there is an issue with DF2239TE16V, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DF2239TE16V part is unused and in its original packaging.
Return procedure for DF2239TE16V:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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