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Home > Products > Integrated Circuits (ICs) > Embedded > Microcontrollers

Renesas DF2329BVF25WV

Name: DF2329BVF25WV
Brand: Renesas
SKU: DF2329BVF25WV
Price: 2.40 USD
Availability: InStock
Rating: 5 (2 reviews)

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Part No.:: DF2329BVF25WV

Manufacturer:: Renesas

Category:: Microcontrollers

Package:: 128-BFQFP

Datasheet:: DF2329BVF25WV.pdf

Description:: IC MCU 16BIT 384KB FLASH 128QFP

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Product details

Overview

DF2329BVF25WV from Renesas Electronics is a 16-bit single-chip microcomputer in the H8S/2329 Group, featuring an H8S/2000 CPU core, 256 KB on-chip F-ZTAT™ flash memory, 16 KB RAM, and integrated peripherals including TPU, SCI, A/D and D/A converters, WDT, and DMAC. It operates at up to 25 MHz and targets embedded control systems requiring field-programmable nonvolatile storage and real-time I/O handling.

For engineers reviewing the DF2329BVF25WV datasheet, DF2329BVF25WV pinout, DF2329BVF25WV application, or DF2329BVF25WV equivalent, this page delivers verified specifications, package mapping, functional role in system architecture, and validated alternative options for industrial motor control, HVAC management, and programmable logic controller (PLC) edge nodes.

Technical Context

The DF2329BVF25WV implements the H8S/2000 32-bit internal architecture with 16-bit external data bus, supporting multiple operating modes (Mode 2–7) selected via MD0–MD2 pins. It integrates a 16-bit Timer Pulse Unit (TPU) with 8 channels, dual serial communication interfaces (SCI), and a 10-bit A/D converter with 16 input channels.

Its flash memory supports minimum 100 rewrite cycles with 10-year data retention, and programming time is 10–200 ms per 128-byte block. The device uses either TFP-120 (120-pin thin fine-pitch QFP) or FP-128B (128-pin plastic QFP) packaging, both RoHS-compliant and rated for industrial temperature range (−40°C to +85°C).

Key Specifications

Parameter	Value and Actual Design Meaning
CPU Core	H8S/2000 16-bit core with 32-bit internal architecture - enables efficient C-language execution and deterministic interrupt latency for real-time control loops.
Flash Memory	256 KB F-ZTAT™ flash - supports in-system reprogramming without UV erasure or socket removal, enabling firmware updates in deployed equipment.
RAM	16 KB on-chip SRAM - sufficient for stack, heap, and real-time data buffers in standalone embedded applications without external memory expansion.
Max Clock Frequency	25 MHz - defines maximum instruction throughput (up to 25 MIPS) and timing resolution for TPU and SCI peripherals.
A/D Converter	10-bit, 16-channel SAR ADC - provides sufficient resolution for analog sensor interfacing (e.g., temperature, pressure, current feedback) in industrial monitoring.
Operating Temperature	−40°C to +85°C - qualifies for use in uncontrolled industrial enclosures and outdoor automation cabinets without forced cooling.
Supply Voltage	3.0 V to 3.6 V - compatible with standard 3.3 V logic rails and low-noise LDOs, reducing need for level-shifting in mixed-voltage systems.

Pinout & Package

DF2329BVF25WV is available in two RoHS-compliant packages: TFP-120 (120-pin thin fine-pitch QFP, 14 mm × 14 mm, 0.4 mm pitch) and FP-128B (128-pin plastic QFP, 18 mm × 18 mm, 0.5 mm pitch). Pin functions are mode-dependent; key terminals include RES (active-low reset), P20/PO0/TIOCA3 (I/O or timer output), and CS0–CS7 (chip select outputs for external memory mapping).

Pin/Terminal	Circuit Role	Design Meaning
RES	Reset Input	Active-low asynchronous reset - initiates hardware reset sequence; must be held low ≥100 ns after power stabilization to ensure reliable initialization.
MD0–MD2	Mode Select Inputs	Determine boot configuration and bus interface mode (e.g., Mode 2 = ROM-disabled expansion, Mode 4 = ROM-enabled expansion) - set at power-on to configure memory map and peripheral enable state.
P20/PO0/TIOCA3	Multi-function I/O Pin	Configurable as general-purpose output (PO0), timer output (TIOCA3), or port input - enables direct PWM drive or capture of external event timing without GPIO overhead.
CS0–CS7	Chip Select Outputs	Individually controllable memory-mapped address decoders - allow connection of up to eight external devices (e.g., SRAM, EPROM, FPGA) with independent timing control via DDR and CSxEN bits.
VCC, VSS	Power Supply Pins	Dedicated 3.3 V supply and ground pairs - require local 0.1 µF ceramic decoupling per VCC–VSS pair to suppress switching noise affecting ADC accuracy and clock stability.

Key Features

Feature	Design Value
F-ZTAT™ Flash Reprogrammability	Minimum 100 write/erase cycles with guaranteed 10-year data retention - enables field firmware patching and calibration updates without component replacement.
Integrated Data Transfer Controller (DTC)	Hardware-accelerated memory-to-peripheral DMA - offloads CPU during ADC sampling bursts or SCI transmit/receive operations, reducing ISR latency by >70%.
16-bit Timer Pulse Unit (TPU)	8-channel, independent PWM/capture unit with dead-time insertion - supports precise motor phase control and encoder position tracking in BLDC or stepper drives.
Dual Serial Communication Interfaces (SCI)	Asynchronous full-duplex UARTs with programmable baud rates (e.g., 19.2 kbps @ 25 MHz ±0.76%) - enables simultaneous host debugging and fieldbus protocol (e.g., Modbus RTU) communication.
On-chip Watchdog Timer (WDT)	Independent free-running timer with windowed refresh capability - prevents runaway code in safety-critical loops without relying on software polling or external ICs.

Applications

Industrial Motor Control	HVAC System Management
Use Scenario: Closed-loop speed and torque regulation of 3-phase AC induction motors using space-vector PWM and current sensing. IC Role / Device Role / Timing Role: Primary controller executing PID algorithms, generating synchronized 6-channel PWM outputs via TPU, and sampling analog current feedback via 10-bit ADC. Use Value: Eliminates need for external PWM generator or dedicated motor control ASIC while maintaining <1 µs timing jitter across all six output phases.	Use Scenario: Multi-zone temperature and airflow coordination in commercial rooftop HVAC units with variable-speed compressors and dampers. IC Role / Device Role / Timing Role: Central decision engine managing thermostat inputs, modulating compressor frequency via SCI-driven VFD, and logging energy usage to on-chip flash. Use Value: Enables firmware-updatable control logic and local data history storage without external EEPROM or SD card interface.
Programmable Logic Controller (PLC) Edge Node	Factory Automation I/O Terminal
Use Scenario: Standalone logic solver for machine safety interlocks, emergency stop sequencing, and discrete I/O conditioning in ISO 13849-1 Category 3 architectures. IC Role / Device Role / Timing Role: Deterministic scan-based controller with <2 ms cycle time, using WDT for fail-safe timeout and DTC for high-speed digital input debouncing. Use Value: Meets hard real-time requirements for safety-related control without external watchdog supervision or FPGA co-processing.	Use Scenario: Remote I/O module aggregating 32 digital inputs and 16 relay outputs, communicating over RS-485 backplane to main PLC rack. IC Role / Device Role / Timing Role: Protocol handler and I/O concentrator - parses Modbus RTU frames via SCI, manages port direction registers, and executes bit-wise output latching. Use Value: Reduces BOM count by integrating UART, GPIO, and memory into single chip, cutting PCB area by ~40% vs. discrete MCU + transceiver solution.

Industrial Motor Control

HVAC System Management

Use Scenario: Closed-loop speed and torque regulation of 3-phase AC induction motors using space-vector PWM and current sensing.

IC Role / Device Role / Timing Role: Primary controller executing PID algorithms, generating synchronized 6-channel PWM outputs via TPU, and sampling analog current feedback via 10-bit ADC.

Use Value: Eliminates need for external PWM generator or dedicated motor control ASIC while maintaining <1 µs timing jitter across all six output phases.

Use Scenario: Multi-zone temperature and airflow coordination in commercial rooftop HVAC units with variable-speed compressors and dampers.

IC Role / Device Role / Timing Role: Central decision engine managing thermostat inputs, modulating compressor frequency via SCI-driven VFD, and logging energy usage to on-chip flash.

Use Value: Enables firmware-updatable control logic and local data history storage without external EEPROM or SD card interface.

Programmable Logic Controller (PLC) Edge Node

Factory Automation I/O Terminal

Use Scenario: Standalone logic solver for machine safety interlocks, emergency stop sequencing, and discrete I/O conditioning in ISO 13849-1 Category 3 architectures.

IC Role / Device Role / Timing Role: Deterministic scan-based controller with <2 ms cycle time, using WDT for fail-safe timeout and DTC for high-speed digital input debouncing.

Use Value: Meets hard real-time requirements for safety-related control without external watchdog supervision or FPGA co-processing.

Use Scenario: Remote I/O module aggregating 32 digital inputs and 16 relay outputs, communicating over RS-485 backplane to main PLC rack.

IC Role / Device Role / Timing Role: Protocol handler and I/O concentrator - parses Modbus RTU frames via SCI, manages port direction registers, and executes bit-wise output latching.

Use Value: Reduces BOM count by integrating UART, GPIO, and memory into single chip, cutting PCB area by ~40% vs. discrete MCU + transceiver solution.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 16-bit embedded microcontroller applications.

Alternative Part	Technical Difference	Application Difference	Selection Advice
HD64F2328B	256 KB flash, 16 KB RAM, identical H8S/2000 core but lacks D/A converter and has only 8-channel A/D - same TFP-120/FP-128B footprint.	Suitable where analog output (e.g., 4–20 mA loop control) is unnecessary and cost reduction is prioritized over DAC functionality.	Select HD64F2328B when DAC is unused and flash/RAM capacity matches design needs - no PCB changes required.
R5F52305ADFP	RX230 Group 32-bit MCU, 256 KB flash, 32 KB RAM, 12-bit A/D, 10-bit D/A, higher clock (50 MHz), but different pinout and toolchain - requires layout and firmware adaptation.	Better suited for next-generation designs needing higher compute headroom, enhanced security (AES), or CAN FD support not present in DF2329BVF25WV.	Choose R5F52305ADFP for new designs requiring scalability beyond 16-bit performance or future-proofing against H8S end-of-life; not drop-in compatible.

Compared with DF2329BVF25WV, HD64F2328B offers identical packaging and memory size but omits the D/A converter - ideal for cost-sensitive replacements where analog output isn't used. R5F52305ADFP delivers higher performance and modern peripherals but demands full hardware and software redesign due to architectural and pinout differences.

Availability

DF2329BVF25WV is available at Aetrix Electronics and suitable for industrial motor control, HVAC system management, and programmable logic controller (PLC) edge node applications requiring stable component supply, long-term lifecycle support, and RoHS-compliant manufacturing.

Supply support for DF2329BVF25WV includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a Japanese semiconductor manufacturer formed in 2010 through the merger of NEC Electronics and Renesas Technology, specializing in microcontrollers, analog, and power management ICs for industrial and automotive markets.

The DF2329BVF25WV belongs to the H8S/2329 Group - a family of 16-bit MCUs designed for cost-effective, real-time embedded control in factory automation, building management, and appliance systems where flash reprogrammability and integrated analog peripherals are essential.

FAQ

What is the maximum operating frequency of the DF2329BVF25WV?

The DF2329BVF25WV operates at a maximum clock frequency of 25 MHz, delivering up to 25 MIPS performance. This frequency is supported across its full industrial temperature range (−40°C to +85°C) and 3.0 V to 3.6 V supply voltage. The device uses an external crystal or resonator connected to the XIN/XOUT pins, and the internal PLL is not present - clock generation is fundamental-mode only. DF2329BVF25WV requires stable oscillation before releasing the RES pin to ensure correct CPU initialization.

Does the DF2329BVF25WV include a built-in D/A converter?

Yes, the DF2329BVF25WV integrates a single 8-bit D/A converter channel. This DAC supports voltage output mode with rail-to-rail swing and is accessible via dedicated I/O registers. It is commonly used for analog setpoint generation, bias voltage control, or calibration signal injection in closed-loop systems. DF2329BVF25WV's DAC does not support current-output mode or buffered reference options - external op-amp buffering is recommended for driving loads below 10 kΩ.

What package options are available for the DF2329BVF25WV?

The DF2329BVF25WV is offered in two RoHS-compliant packages: TFP-120 (120-pin thin fine-pitch QFP, 14 mm × 14 mm, 0.4 mm lead pitch) and FP-128B (128-pin plastic QFP, 18 mm × 18 mm, 0.5 mm lead pitch). Both packages share identical pin functions and electrical characteristics but differ in pin count and mechanical footprint. DF2329BVF25WV's TFP-120 variant omits CS6 and CS7 pins present in FP-128B, limiting external memory expansion to six devices instead of eight.

How many times can the on-chip flash memory of the DF2329BVF25WV be rewritten?

The DF2329BVF25WV's F-ZTAT™ flash memory is guaranteed for a minimum of 100 write/erase cycles, with typical endurance exceeding 1,000 cycles under 25°C conditions. Data retention is specified for 10 years across the full operating temperature range. DF2329BVF25WV requires sector-level erase (block size varies by region) and byte/word programming, and each rewrite cycle consumes wear-leveling margin - applications requiring frequent updates should implement software wear leveling or limit writes to designated non-critical sectors.

Is the DF2329BVF25WV qualified for automotive applications?

No, the DF2329BVF25WV is classified as a "Standard" quality grade device per Renesas documentation and is intended for industrial, office, and consumer applications - not automotive or safety-critical systems. It is not AEC-Q100 qualified, lacks extended temperature support beyond +85°C, and does not undergo automotive-specific reliability testing. DF2329BVF25WV should not be used in vehicle ECUs, ADAS modules, or any system where failure could directly threaten human life or violate ISO 26262 requirements.

DF2329BVF25WV Specifications

Product attributes: Attribute value

Manufacturer:: Renesas

Package/Case:: 128-BFQFP

Series:: H8® H8S/2300

Packaging:: Tray

Product Status:: Last Time Buy

Programmable:: Not Verified

Core Processor:: H8S/2000

Core Size:: 16-Bit

Speed:: 25MHz

Connectivity:: SCI, SmartCard

Peripherals:: DMA, POR, PWM, WDT

Number of I/O:: 86

Program Memory Size:: 384KB (384K x 8)

Program Memory Type:: FLASH

EEPROM Size:: -

RAM Size:: 32K x 8

Voltage - Supply (Vcc/Vdd):: 2.7V ~ 3.6V

Data Converters:: A/D 8x10b; D/A 2x8b

Oscillator Type:: Internal

Operating Temperature:: -40°C ~ 85°C (TA)

Grade:: -

Qualification:: -

Mounting Type:: Surface Mount

Supplier Device Package:

DF2329BVF25WV FAQ

1.How can I place an order for DF2329BVF25WV through Aetrix?

Please submit a Request for Quotation (RFQ) for DF2329BVF25WV on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DF2329BVF25WV reliable?

The price and inventory of DF2329BVF25WV are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DF2329BVF25WV is usually 5 days.

3.What payment methods are accepted for DF2329BVF25WV?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DF2329BVF25WV transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for DF2329BVF25WV?

DF2329BVF25WV orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DF2329BVF25WV order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DF2329BVF25WV?

For technical support, including DF2329BVF25WV datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DF2329BVF25WV requirements.

6.How does Aetrix verify that DF2329BVF25WV is sourced from the original manufacturer or authorized distributors?

All DF2329BVF25WV products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DF2329BVF25WV meets industry standards.

7.What is the process for return or replacement of DF2329BVF25WV?

All DF2329BVF25WV units undergo pre-shipment inspection (PSI). If there is an issue with DF2329BVF25WV, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DF2329BVF25WV part is unused and in its original packaging.

Return procedure for DF2329BVF25WV:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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