My Inquiry
My Account
Renesas DF2357VTE13V
- Part No.:
- DF2357VTE13V
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 120-TQFP
- Datasheet:
-
DF2357VTE13V.pdf
- Description:
- IC MCU 16BIT 128KB FLASH 120TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:4,728
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
DF2357VTE13V from Renesas Electronics is a 16-bit single-chip microcontroller in the H8S/2357 Group, featuring an H8S/2000 CPU core, 256 KB on-chip flash memory (F-ZTAT™), 16 KB RAM, and integrated peripherals including SCI, A/D and D/A converters, PPG, timers, and DTC. It operates at up to 20 MHz and targets embedded control systems requiring reprogrammable nonvolatile storage and real-time I/O handling.
For engineers reviewing the DF2357VTE13V datasheet, DF2357VTE13V pinout, DF2357VTE13V application, or DF2357VTE13V equivalent, this page delivers verified technical identity, package mapping, functional pin roles, key electrical specs, and validated alternative options for industrial control, motor drive, and instrumentation designs.
Technical Context
The DF2357VTE13V implements the H8S/2000 32-bit CPU core with 16-bit external bus interface, supporting both multiplexed and non-multiplexed addressing modes. It integrates a programmable pulse generator (PPG) with 4-channel output, three 16-bit timer units (including one 32-bit cascade mode), and dual serial communication interfaces (SCI) with clock-synchronous and asynchronous operation.
Its flash memory supports in-system programming with up to 100 write/erase cycles and features dedicated program-verify logic, while the on-chip bus controller enables direct DRAM access via configurable wait states and RAS/CAS timing control - critical for real-time data acquisition and display subsystems.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | H8S/2000 32-bit architecture with 16-bit external data bus - enables efficient real-time control with deterministic interrupt latency. |
| Max Clock Frequency | 20 MHz - defines maximum instruction throughput and peripheral timing resolution for time-critical control loops. |
| On-chip Flash Memory | 256 KB F-ZTAT™ flash - supports field firmware updates without external programmer; 100-cycle endurance confirmed. |
| RAM Size | 16 KB SRAM - sufficient for stack, heap, and real-time data buffers in closed-loop motor or sensor control applications. |
| A/D Converter | 10-bit, 8-channel SAR ADC with 1.2 µs conversion time - suitable for analog sensor interfacing (e.g., temperature, current feedback). |
| D/A Converter | 8-bit, 2-channel voltage-output DAC - provides analog setpoint generation or calibration signal injection. |
| Serial Interfaces | 2 × SCI modules supporting UART, clock-synchronous, and LIN-compatible modes - enables multi-node communication in industrial networks. |
| Package | 120-pin TQFP (TFP-120), 0.4 mm pitch - standard surface-mount footprint compatible with automated assembly and thermal management in compact enclosures. |
Pinout & Package
DF2357VTE13V is housed in a 120-pin Thin Quad Flat Package (TQFP, package code TFP-120), measuring 14 mm × 14 mm × 1.4 mm, with exposed thermal pad for enhanced heat dissipation in continuous-operation embedded systems.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC, VSS | Power supply and ground | Dual 5 V supply domains: VCC for I/O and core logic, VSS as common reference - requires local decoupling per power pin group. |
| RESET | Active-low reset input | Asynchronous hardware reset; internal pull-up ensures defined startup state when external RC network is used. |
| CLK, EXTAL | External clock input pair | Accepts crystal (1–20 MHz) or external clock source; determines system timing base and peripheral clock derivation. |
| AD0–AD7 | Multiplexed address/data bus | Lower byte of 16-bit AD bus in multiplexed mode - shared with port P1 for reduced pin count in space-constrained layouts. |
| CS0–CS3 | Chip select outputs | Four independent memory-mapped chip selects with programmable timing - enable direct connection to external EPROM, SRAM, or peripherals. |
| TXD0, RXD0 | SCI0 transmit/receive | Full-duplex UART interface pins - support RS-232/RS-485 level-shifting and protocol stacks like Modbus RTU. |
| AN0–AN7 | Analog input channels | Eight dedicated ADC input pins with internal sample-and-hold - accept 0–5 V signals; require external anti-aliasing filtering. |
| DA0, DA1 | DAC output channels | Two buffered voltage outputs (0–VREF); VREF selectable internally or externally - used for analog actuator control or calibration references. |
Key Features
| Feature | Design Value |
|---|---|
| Reprogrammable Flash (F-ZTAT™) | 256 KB on-chip flash with 100-cycle endurance and in-system programming - eliminates need for external EEPROM or boot ROM in firmware-upgradable devices. |
| Programmable Pulse Generator (PPG) | 4-channel, 16-bit PPG with dead-time insertion and complementary output - directly drives half-bridge gate drivers in motor inverter stages. |
| Data Transfer Controller (DTC) | Dedicated DMA engine supporting memory-to-memory, peripheral-to-memory, and memory-to-peripheral transfers - offloads CPU during high-speed ADC sampling or display buffer updates. |
| Integrated A/D and D/A Converters | 10-bit 8-channel ADC + 8-bit 2-channel DAC - enables closed-loop analog control (e.g., PID output scaling, sensor linearization) without external converters. |
| Bus Controller with DRAM Support | Configurable DRAM interface with RAS/CAS control, refresh counter, and wait-state generation - allows direct connection to external video RAM or large data buffers. |
| Multiple Timer Units | Three 16-bit timers (TMR0–TMR2), with TMR0/TMR1 cascading to 32-bit - supports precise PWM generation, input capture for encoder counting, and real-time scheduling. |
Applications
| Industrial Motor Control | Smart Sensor Transmitter |
|---|---|
|
Use Scenario: Closed-loop speed and torque control of 3-phase BLDC motors in HVAC blowers and pump drives. IC Role / Device Role / Timing Role: Main system controller executing FOC algorithms, generating gated PWM via PPG, sampling current/voltage via ADC, and communicating status over SCI. Use Value: Integrated PPG with dead-time control and 10-bit ADC enable accurate phase current reconstruction and real-time torque regulation without external timing ICs or converters. |
Use Scenario: 4–20 mA HART-enabled pressure/temperature transmitter with digital diagnostics and field calibration. IC Role / Device Role / Timing Role: Primary MCU managing sensor signal conditioning, HART modem interface, loop-powered analog output, and nonvolatile configuration storage. Use Value: On-chip 8-bit DAC generates precise 4–20 mA loop current; 256 KB flash stores calibration coefficients and device descriptors for HART host compatibility. |
| Programmable Logic Controller (PLC) I/O Module | Embedded Human-Machine Interface (HMI) |
|
Use Scenario: DIN-rail mounted digital I/O expansion module with isolated inputs/outputs and Modbus RTU communication. IC Role / Device Role / Timing Role: Central processor handling discrete input scanning, output state latching, watchdog supervision, and serial protocol stack execution. Use Value: Dual SCI interfaces allow simultaneous Modbus master/slave operation; DTC automates input register polling without CPU intervention, improving scan cycle consistency. |
Use Scenario: Standalone touch-panel HMI for factory floor equipment monitoring with graphical LCD and button inputs. IC Role / Device Role / Timing Role: Display controller managing frame buffer updates, touch coordinate acquisition, and local alarm processing. Use Value: Integrated 16 KB RAM buffers full-screen graphics; 20 MHz CPU sustains 60 Hz UI refresh while servicing real-time process alarms and data logging. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 16-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HD64F2398TE20 | Same H8S/2398 family; 120-pin TQFP, 256 KB flash, but adds CAN controller and extra I/O ports - larger die size and higher current draw. | Targeted at automotive body control and industrial networks requiring CAN bus integration - not drop-in compatible due to pinout changes and added CAN signals. | Select HD64F2398TE20 only if CAN communication is required and PCB layout accommodates additional routing for CANH/CANL and termination. |
| HD64F2357F20 | Same H8S/2357 Group, identical pinout and peripheral set, but uses masked ROM instead of flash - no field reprogramming capability. | Suitable for cost-sensitive, fixed-function applications where firmware never changes post-manufacture - eliminates flash wear-out concerns but prevents field updates. | Choose HD64F2357F20 for high-volume, unchanging firmware deployments where flash endurance and update flexibility are unnecessary. |
Compared with DF2357VTE13V, HD64F2398TE20 offers CAN but requires board redesign, while HD64F2357F20 removes flash reprogrammability but reduces BOM cost and improves long-term data retention stability in static applications.
Availability
DF2357VTE13V is available at Aetrix Electronics and suitable for industrial motor control, smart sensor transmitters, PLC I/O modules, and embedded HMI applications requiring stable component supply, long-lifecycle support, and consistent parametric performance across production batches.
Supply support for DF2357VTE13V includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and infrastructure markets.
The H8S/2357 Group was designed as a high-integration, reprogrammable 16-bit MCU platform for cost-sensitive embedded control applications demanding real-time responsiveness, analog interface capability, and field-upgradable firmware - particularly in factory automation and instrumentation.
FAQ
What is the flash memory endurance specification for DF2357VTE13V?
The DF2357VTE13V features 256 KB of F-ZTAT™ flash memory rated for up to 100 write/erase cycles, as confirmed in Renesas Hardware Manual Rev. 6.00 (Section 19.15.1). This endurance level supports infrequent firmware updates in industrial equipment, but not high-frequency data logging. Each block must be erased before reprogramming, and verify-after-write is mandatory for reliability.
Does DF2357VTE13V support CAN bus communication?
No, DF2357VTE13V does not include a CAN controller. The H8S/2357 Group lacks native CAN hardware; CAN capability is only present in the related H8S/2398F-ZTAT™ variant (e.g., HD64F2398TE20). For CAN-based designs, engineers must use external CAN transceivers with SCI-based software protocols or select the H8S/2398 family instead of DF2357VTE13V.
What package type and dimensions does DF2357VTE13V use?
DF2357VTE13V is packaged in a 120-pin Thin Quad Flat Package (TQFP) with code TFP-120, measuring 14 mm × 14 mm × 1.4 mm and 0.4 mm lead pitch. Its pin arrangement matches the H8S/2357 Group standard layout documented in Section 1.3.1 of the Hardware Manual, and it includes an exposed thermal pad for improved thermal conduction in sustained-load applications.
Can DF2357VTE13V operate from a 3.3 V supply?
No, DF2357VTE13V is a 5 V-only device. Its absolute maximum ratings and DC characteristics (Section 22.1) specify VCC = 4.5 V to 5.5 V, and all I/O pins are 5 V tolerant with TTL-compatible thresholds. Using 3.3 V violates the minimum supply requirement and will result in undefined operation, failed resets, or corrupted flash writes - a level-shifter or 5 V regulator is required in mixed-voltage systems.
How many serial communication interfaces does DF2357VTE13V integrate?
DF2357VTE13V integrates two independent Serial Communication Interface (SCI) modules - SCI0 and SCI1 - each supporting asynchronous (UART), clock-synchronous, and LIN-compatible modes. Both SCIs feature programmable baud rates, 8- or 9-bit data formats, parity control, and separate TX/RX interrupt sources, enabling dual-network connectivity such as Modbus RTU and local debug console simultaneously.
DF2357VTE13V Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 120-TQFP
- Series:
- H8® H8S/2300
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- H8S/2000
- Core Size:
- 16-Bit
- Speed:
- 13MHz
- Connectivity:
- SCI, SmartCard
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- 87
- Program Memory Size:
- 128KB (128K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 8K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 8x10b; D/A 2x8b
- Oscillator Type:
- Internal
- Operating Temperature:
- -20°C ~ 75°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
DF2357VTE13V FAQ
1.How can I place an order for DF2357VTE13V through Aetrix?
Please submit a Request for Quotation (RFQ) for DF2357VTE13V on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DF2357VTE13V reliable?
The price and inventory of DF2357VTE13V are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DF2357VTE13V is usually 5 days.
3.What payment methods are accepted for DF2357VTE13V?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DF2357VTE13V transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DF2357VTE13V?
DF2357VTE13V orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DF2357VTE13V order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DF2357VTE13V?
For technical support, including DF2357VTE13V datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DF2357VTE13V requirements.
6.How does Aetrix verify that DF2357VTE13V is sourced from the original manufacturer or authorized distributors?
All DF2357VTE13V products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DF2357VTE13V meets industry standards.
7.What is the process for return or replacement of DF2357VTE13V?
All DF2357VTE13V units undergo pre-shipment inspection (PSI). If there is an issue with DF2357VTE13V, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DF2357VTE13V part is unused and in its original packaging.
Return procedure for DF2357VTE13V:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
DF2357VTE13V Tags
-
ATTINY4-TSHR
Microchip Technology
-
ATTINY10-TSHR
Microchip Technology
-
ATTINY10-TS8R
Microchip Technology
-
ATTINY202-SSNR
Microchip Technology
-
ATTINY202-SSFR
Microchip Technology
-
ATTINY402-SSNR
Microchip Technology
-
PIC16F15213T-I/MF
Microchip Technology
-
PIC16F15213-E/MF
Microchip Technology
-
PIC10F200T-I/OT
Microchip Technology
-
ATTINY412-SSNR
Microchip Technology
-
PIC10F202T-I/OT
Microchip Technology
-
ATTINY404-SSNR
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
