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Renesas DF2364VTE34V
- Part No.:
- DF2364VTE34V
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 120-TQFP
- Datasheet:
-
DF2364VTE34V.pdf
- Description:
- IC MCU 16BIT 384KB FLASH 120TQFP
- Quantity:
- Payment:
- Shipping:
Inventory:4,317
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Product details
Overview
DF2364VTE34V from Renesas Electronics is a 16-bit single-chip microcontroller (MCU) in the H8S/2364F group, featuring an H8S/2600 CPU core, 384 KB on-chip ROM, 32 KB RAM, and integrated peripherals including TPU, PPG, SCI, IrDA, 10-bit A/D, 8-bit D/A, DMAC, DTC, and I²C interface. It operates at up to 33 MHz and supports expanded memory mode with external bus interface for industrial control and embedded instrumentation.
For engineers reviewing the DF2364VTE34V datasheet, DF2364VTE34V pinout, DF2364VTE34V application, or DF2364VTE34V equivalent, key selection criteria include its 128-pin QFP package, 3.3 V operation, boot-mode flexibility, flash reprogrammability via F-ZTAT™, and support for real-time peripheral control in resource-constrained systems.
Technical Context
The DF2364VTE34V implements the H8S/2600 CPU with a 32-bit internal architecture, sixteen 16-bit general-purpose registers, and linear 16-Mbyte addressing. It supports multiple operating modes-including boot mode, expanded mode with ROM disabled, and single-chip activation mode-controlled via SYSCR register bits EXPE and RAME.
Its peripheral set includes dual serial interfaces (SCI + IrDA), a 16-bit timer pulse unit with PWM output capability, programmable pulse generator, watchdog timer, and direct memory access controller with chain transfer support. The on-chip bus controller enables seamless DRAM interfacing with configurable wait-state control.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | H8S/2600 16-bit architecture with 32-bit internal data path and 16-Mbyte linear address space |
| ROM Size | 384 KB on-chip flash (F-ZTAT™), enabling field reprogramming without external programmers |
| RAM Size | 32 KB on-chip SRAM, usable as system RAM or flash programming buffer |
| Max Clock Frequency | 33 MHz system clock, supporting real-time deterministic execution for control loops |
| Supply Voltage | 3.3 V ±0.3 V, compatible with modern low-voltage logic and reducing power consumption |
| Operating Modes | 7 configurable modes including boot, expanded, and single-chip activation-enabling flexible BOM and boot-source selection |
| A/D Converter | 10-bit successive-approximation ADC with 8 channels, suitable for analog sensor interfacing |
| D/A Converter | 8-bit DAC with single channel, providing analog output for calibration or actuator control |
Pinout & Package
DF2364VTE34V is housed in a 128-pin plastic quad flat pack (QFP) with 0.4 mm lead pitch, compliant with JEDEC MS-026. The package supports standard surface-mount assembly and provides full external bus interface (address/data multiplexed), dedicated interrupt inputs, and peripheral signal routing across port groups PA–PE.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Vcc (Pins 2, 60, 83, 84) | Power supply input | Four dedicated 3.3 V supply pins reduce IR drop and improve noise immunity for core and I/O domains |
| Vss (Pins 3, 4, 12, 21, 26, 35, 36, 64, 68, 88, 95, 99, 100) | Ground reference | Thirteen ground pins ensure low-impedance return paths and minimize ground bounce during high-speed I/O switching |
| PA0–PA7 / A16–A23 / CS7 / IRQ7 | Port A multiplexed I/O | Upper address bus (A16–A23), chip select (CS7), and interrupt input (IRQ7) share pins-enabling compact memory-mapped peripheral design |
| PD0–PD7 / D8–D15 | Data bus I/O | Lower 8-bit bidirectional data bus (D8–D15) with DDR-controlled direction-supports 16-bit external memory access when paired with PE0–PE7 |
| PE0–PE7 / D0–D7 | Data bus I/O | Lower 8-bit bidirectional data bus (D0–D7), completing full 16-bit data path with PD0–PD7 for external memory or peripheral interfacing |
Key Features
| Feature | Design Value |
|---|---|
| F-ZTAT™ Flash Technology | Single-power 384 KB on-chip flash enabling in-system reprogramming without HV programming voltage |
| Dual Serial Interfaces | SCI (UART-compatible) + IrDA physical layer support-enables wired and infrared host communication simultaneously |
| Timer Pulse Unit (TPU) | 16-bit timer with input capture, output compare, PWM generation, and dead-time insertion for motor control |
| Direct Memory Access Controller | DMAC with 4 channels and automatic request arbitration-offloads CPU during high-bandwidth data transfers (e.g., A/D buffering) |
| Memory Expansion Support | Full 16-bit address/data bus with CS, RD, WR, WAIT, and READY signals-allows connection to SRAM, EPROM, or peripherals without glue logic |
| Boot Mode Flexibility | Configurable boot source (on-chip ROM vs. external memory) via hardware pins-simplifies development and production firmware recovery |
Applications
| Industrial PLC I/O Module | Embedded Data Logger |
|---|---|
|
Use Scenario: Standalone remote I/O node collecting analog sensor data (temperature, pressure) and controlling relay outputs in factory automation. IC Role / Device Role / Timing Role: Central MCU executing real-time control tasks, managing A/D sampling, driving digital outputs, and communicating via SCI to master controller. Use Value: Integrated 10-bit A/D, 8-bit D/A, and 16-bit TPU eliminate external converters and timing ICs-reducing BOM count and PCB area by ~30%. |
Use Scenario: Battery-powered environmental monitor logging temperature, humidity, and light intensity at 10-second intervals over 72 hours. IC Role / Device Role / Timing Role: System controller handling sensor polling, timestamping via internal timers, flash storage management, and low-power sleep/wake cycles. Use Value: 32 KB on-chip RAM buffers log entries; F-ZTAT™ flash allows firmware updates in-field-eliminating need for EEPROM or external flash. |
| Motor Drive Control Board | Medical Diagnostic Instrument |
|
Use Scenario: Brushless DC motor controller using hall-effect feedback and PWM-driven gate drivers in HVAC blower systems. IC Role / Device Role / Timing Role: Real-time motion controller generating synchronized 3-phase PWM waveforms with adjustable dead time and fault monitoring. Use Value: TPU's complementary PWM output and built-in dead-time insertion prevent shoot-through in half-bridge drivers-improving reliability without external logic. |
Use Scenario: Portable blood glucose meter requiring precise analog front-end signal conditioning and USB-adjacent serial communication. IC Role / Device Role / Timing Role: Signal processor digitizing electrochemical sensor output, applying calibration algorithms, and transmitting results via SCI to host PC. Use Value: On-chip 10-bit A/D with internal reference and programmable gain eliminates external op-amp stages-reducing component count and calibration complexity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 16-bit MCU applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HD64F2365 | 512 KB ROM, same 32 KB RAM and peripheral set; differs only in flash size and part marking | Preferred where larger firmware image size is required (e.g., multi-protocol stacks or GUI frameworks) | Select HD64F2365 if firmware exceeds 384 KB; otherwise DF2364VTE34V offers optimal cost/performance balance |
| H8S/2367F | Includes I²C bus interface (IIC2) not present in DF2364VTE34V; otherwise identical CPU, memory, and peripheral configuration | Suitable for designs requiring two independent I²C buses-for example, sensor hub + display interface | Choose H8S/2367F only when dual I²C is mandatory; DF2364VTE34V remains optimal for single-bus or SCI/IrDA-centric systems |
Compared with HD64F2365 and H8S/2367F, DF2364VTE34V delivers the smallest footprint and lowest cost within the H8S/2364F family while retaining full compatibility in pinout, instruction set, and peripheral register mapping-making it ideal for cost-sensitive, volume-manufactured embedded controllers.
Availability
DF2364VTE34V is available at Aetrix Electronics and suitable for industrial automation, test equipment, and medical diagnostics requiring stable component supply, long-term lifecycle support, and RoHS-compliant manufacturing.
Supply support for DF2364VTE34V includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and infrastructure markets.
The H8S/2364F group was designed for cost-effective, real-time embedded control in industrial equipment and instrumentation-emphasizing integration, flash flexibility, and deterministic peripheral response.
FAQ
What is the package type and lead pitch of DF2364VTE34V?
DF2364VTE34V uses a 128-pin plastic quad flat pack (QFP) package with 0.4 mm lead pitch, conforming to JEDEC MS-026. This package supports standard SMT assembly and provides full external bus interface capability with dedicated power/ground pins for noise resilience.
Does DF2364VTE34V support in-system programming of its flash memory?
Yes, DF2364VTE34V incorporates Renesas' F-ZTAT™ flash technology, enabling single-power (3.3 V) in-system programming without high-voltage programming signals. Firmware updates can be performed via SCI or on-chip bootloader-no external programmer required.
What are the key differences between DF2364VTE34V and HD64F2365?
DF2364VTE34V and HD64F2365 share identical CPU architecture, peripheral sets, pinout, and electrical characteristics. The sole difference is ROM capacity: DF2364VTE34V has 384 KB, while HD64F2365 has 512 KB. All other specifications-including RAM, clock speed, and I/O functionality-are functionally equivalent.
Can DF2364VTE34V operate in low-power modes for battery-powered applications?
Yes, DF2364VTE34V supports multiple low-power modes including Sleep and Stop, controlled via the PMR register. In Sleep mode, the CPU halts while peripherals remain active; in Stop mode, both CPU and most peripherals suspend-reducing current draw to under 10 µA with RTC active.
Is DF2364VTE34V qualified for automotive applications?
No, DF2364VTE34V is classified as a "Standard" quality grade device per Renesas documentation and is intended for industrial, office, and consumer applications-not automotive or safety-critical systems. For automotive use, Renesas recommends RH850 or RL78/F1x series MCUs with AEC-Q100 qualification.
DF2364VTE34V Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 120-TQFP
- Series:
- H8® H8S/2300
- Packaging:
- Tray
- Product Status:
- Last Time Buy
- Programmable:
- Not Verified
- Core Processor:
- H8S/2000
- Core Size:
- 16-Bit
- Speed:
- 34MHz
- Connectivity:
- I2C, IrDA, SCI, SmartCard
- Peripherals:
- DMA, POR, PWM, WDT
- Number of I/O:
- 83
- Program Memory Size:
- 384KB (384K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 32K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 3.6V
- Data Converters:
- A/D 10x10b; D/A 2x8b
- Oscillator Type:
- External
- Operating Temperature:
- -20°C ~ 75°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
DF2364VTE34V FAQ
1.How can I place an order for DF2364VTE34V through Aetrix?
Please submit a Request for Quotation (RFQ) for DF2364VTE34V on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DF2364VTE34V reliable?
The price and inventory of DF2364VTE34V are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DF2364VTE34V is usually 5 days.
3.What payment methods are accepted for DF2364VTE34V?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DF2364VTE34V transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DF2364VTE34V?
DF2364VTE34V orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DF2364VTE34V order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DF2364VTE34V?
For technical support, including DF2364VTE34V datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DF2364VTE34V requirements.
6.How does Aetrix verify that DF2364VTE34V is sourced from the original manufacturer or authorized distributors?
All DF2364VTE34V products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DF2364VTE34V meets industry standards.
7.What is the process for return or replacement of DF2364VTE34V?
All DF2364VTE34V units undergo pre-shipment inspection (PSI). If there is an issue with DF2364VTE34V, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DF2364VTE34V part is unused and in its original packaging.
Return procedure for DF2364VTE34V:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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