Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Renesas DF2367VTE33V

Part No.:
DF2367VTE33V
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
120-TQFP
Datasheet:
AetrixDF2367VTE33V.pdf
Description:
IC MCU 16BIT 384KB FLASH 120TQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,535

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

DF2367VTE33V from Renesas Electronics is a 16-bit single-chip microcontroller (MCU) in the H8S/2367F group, featuring an H8S/2600 CPU core, 384 KB on-chip ROM, 32 KB RAM, and integrated peripherals including TPU, PPG, SCI, IrDA, 10-bit ADC, 8-bit DAC, and I²C interface. It operates at up to 25 MHz with 3.3 V supply and targets industrial control and embedded instrumentation.

For engineers reviewing the DF2367VTE33V datasheet, DF2367VTE33V pinout, DF2367VTE33V application, or DF2367VTE33V equivalent, key selection criteria include its 128-pin QFP package, flash-based F-ZTAT™ ROM architecture, PLL clock synthesis capability, and support for expanded memory mode with external bus interface.

Technical Context

The DF2367VTE33V implements the H8S/2600 CPU core with a 32-bit internal data path, sixteen 16-bit general-purpose registers, and linear 16-Mbyte addressing. It supports multiple operating modes-including boot, expanded, and user boot modes-with configurable RAME and EXPE bits governing RAM mapping and external address space access.

Its peripheral set includes a Direct Memory Access Controller (DMAC), Data Transfer Controller (DTC), watchdog timer (WDT), and dual serial interfaces (SCI + IrDA). The on-chip PLL generates system clocks from external crystal or oscillator inputs, with dedicated PLLVCC/PLLVSS power pins and VCL decoupling requirements.

Key Specifications

Parameter Value and Actual Design Meaning
CPU CoreH8S/2600 16-bit architecture with 32-bit internal data path and 16-Mbyte linear address space
ROM Size384 KB on-chip flash (F-ZTAT™) enabling in-system reprogramming without UV erasure
RAM Size32 KB on-chip SRAM, configurable as internal RAM or external address space via SYSCR register
Max Clock Frequency25 MHz system operation with PLL-based clock generation supporting stable high-speed timing
I/O PinsUp to 96 programmable I/O pins across ports PA–PE, with multiplexed address/data and peripheral functions
Supply Voltage3.3 V ±0.3 V operation; separate PLL power domain (PLLVCC/PLLVSS) for jitter-sensitive clock synthesis
Package128-pin plastic QFP (QFP-128), 20 mm × 20 mm, 0.5 mm pitch, lead-free and RoHS compliant

Pinout & Package

DF2367VTE33V is housed in a 128-pin QFP package (QFP-128) with 0.5 mm pitch, 20 mm × 20 mm body size, and standard JEDEC MO-140 compliance. Power and ground pins are distributed across multiple locations to minimize noise coupling and support stable high-frequency operation.

Pin/Terminal Circuit Role Design Meaning
Vcc (Pins 2, 60, 83, 84)Core power supply3.3 V main supply for logic and peripheral circuits; requires local 0.1 µF decoupling per pin
Vss (Pins 3, 4, 12, 21, 26, 35, 36, 64, 68, 88, 95, 99, 100)Digital groundCommon reference for all digital I/O and internal logic; multiple pins reduce ground bounce
PLLVCC (Pin 84)PLL analog powerDedicated 3.3 V supply for phase-locked loop circuitry; must be filtered separately from core Vcc
PLLVSS (Pin 86)PLL analog groundIsolated ground return for PLL; routed separately from digital Vss to suppress switching noise
VCL (Pin 3)Capacitor connection for PLLConnects to Vss via 0.1 µF capacitor; sets PLL loop filter time constant and stabilizes frequency lock
PA0–PA7 / PB0–PB7 / PC0–PC7Address/data multiplexed I/OConfigurable as A0–A23 address outputs or D0–D15 data I/O in external bus mode; DDR-controlled direction
PD0–PD7 / PE0–PE7Data bus I/O8-bit bidirectional data bus (D0–D7) with latch control; supports 16-bit wide external memory access when paired with PB/PC

Key Features

Feature Design Value
F-ZTAT™ Flash Memory384 KB single-power flash enabling field firmware updates without high-voltage programming or UV erasure
Flexible Memory MappingFour operating modes (boot, expanded, user boot, single-chip activation) controlled by SYSCR bits for dynamic RAM/ROM/external space allocation
Dual Serial InterfacesSCI (UART-compatible) + IrDA physical layer support enables wired and infrared host/device communication simultaneously
Hardware DMA & DTCDMAC and DTC offload CPU during memory-to-peripheral transfers, reducing interrupt latency and improving real-time response
Integrated Analog Peripherals10-bit ADC (8 channels) and 8-bit DAC (2 channels) provide mixed-signal capability without external converters
Programmable Pulse GeneratorPPG module generates precise PWM, one-shot, or interval timing waveforms independent of CPU load

Applications

Industrial PLC I/O Module Factory Automation Controller

Use Scenario: Real-time monitoring and control of discrete sensors, actuators, and motor drives in modular PLC backplanes.

IC Role / Device Role / Timing Role: Central MCU executing ladder logic, managing high-speed I/O scanning, and coordinating serial fieldbus communication (e.g., Modbus RTU over SCI).

Use Value: On-chip 32 KB RAM buffers scan data; 384 KB flash stores multiple firmware versions; hardware DTC accelerates I/O register reads/writes.

Use Scenario: Standalone motion controller synchronizing stepper/servo axes using encoder feedback and pulse-width modulation outputs.

IC Role / Device Role / Timing Role: Timing-critical pulse generation via PPG and TPU modules, with ADC sampling of current/voltage feedback at deterministic intervals.

Use Value: 25 MHz CPU clock and hardware timers ensure sub-microsecond jitter in pulse edges; integrated DAC provides analog reference for current loops.

Embedded Test Instrument Smart Energy Metering Unit

Use Scenario: Portable multimeter or signal generator requiring precision analog front-end control, display interface, and USB/IrDA connectivity.

IC Role / Device Role / Timing Role: Mixed-signal processor handling 10-bit ADC acquisition, DAC waveform synthesis, LCD segment driving, and IrDA data transmission.

Use Value: Single-chip integration eliminates external ADC/DAC; SCI+IrDA enables wireless configuration and firmware updates in field-deployed units.

Use Scenario: DIN-rail mounted electricity meter performing voltage/current sampling, energy calculation, tamper detection, and HAN communication.

IC Role / Device Role / Timing Role: High-accuracy metrology engine interfacing with isolation amplifiers, computing kWh via hardware multiply-accumulate, and logging events to flash.

Use Value: F-ZTAT™ flash allows secure, field-upgradable tariff tables and cryptographic keys; watchdog timer ensures fail-safe reset on firmware corruption.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 16-bit microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
HD64F2368FVTE33V512 KB ROM, identical pinout and peripheral set; higher code density support for complex control algorithmsBetter suited for applications requiring larger firmware footprint (e.g., multi-protocol gateways)Select when >384 KB program storage is needed without changing PCB layout
H8S/2364FVTE33V384 KB ROM but no I²C interface; reduced peripheral count (no D/A converter); same CPU and memory architectureTargeted at cost-sensitive, lower-complexity control tasks where analog output or I²C sensors are unnecessaryChoose for simplified BOM where IrDA/SCI-only communication suffices and DAC/I²C are unused

Compared with DF2367VTE33V, HD64F2368FVTE33V offers greater firmware capacity while maintaining full compatibility, whereas H8S/2364FVTE33V reduces feature count to lower unit cost-both retain the same QFP-128 package and core timing behavior.

Availability

DF2367VTE33V is available at Aetrix Electronics and suitable for industrial automation, factory instrumentation, and embedded test equipment requiring stable component supply, long-term lifecycle support, and RoHS-compliant manufacturing.

Supply support for DF2367VTE33V includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and infrastructure markets.

The DF2367VTE33V belongs to the H8S/2300 Series-a legacy 16-bit MCU family designed for deterministic real-time control in cost-sensitive industrial applications where reliability and toolchain maturity are critical.

FAQ

What is the maximum operating frequency of the DF2367VTE33V?

The DF2367VTE33V supports a maximum system clock frequency of 25 MHz. This is achieved using the on-chip PLL, which multiplies an external crystal or oscillator input. The PLL requires dedicated PLLVCC and PLLVSS pins and a 0.1 µF capacitor on the VCL pin to stabilize lock time and jitter performance. DF2367VTE33V maintains full peripheral functionality-including TPU, ADC, and SCI-at this rated speed.

Does the DF2367VTE33V include on-chip flash memory, and is it reprogrammable in-system?

Yes, the DF2367VTE33V integrates 384 KB of on-chip F-ZTAT™ flash memory. This single-power flash technology allows full in-system programming (ISP) at 3.3 V without requiring high-voltage Vpp or UV exposure. Firmware updates can be performed via SCI or internal bootloader routines, making DF2367VTE33V suitable for field-deployed devices requiring post-manufacture calibration or feature upgrades.

What peripheral interfaces are supported by the DF2367VTE33V?

The DF2367VTE33V supports SCI (asynchronous UART), IrDA (infrared data association physical layer), I²C bus interface (IIC2), 16-bit Timer Pulse Unit (TPU), Programmable Pulse Generator (PPG), 10-bit ADC (8 channels), 8-bit DAC (2 channels), and a watchdog timer (WDT). It also includes DMAC and DTC controllers for autonomous data movement. DF2367VTE33V does not integrate CAN, USB, or Ethernet peripherals.

What package type and pin count does the DF2367VTE33V use?

The DF2367VTE33V is packaged in a 128-pin plastic quad flat pack (QFP-128) with 0.5 mm lead pitch and 20 mm × 20 mm body size. It complies with JEDEC MO-140 standards and is lead-free/RoHS compliant. Pin functions include multiplexed address/data lines (A0–A23, D0–D15), dedicated PLL power/ground (PLLVCC/PLLVSS), and VCL for PLL loop filtering-details are fully documented in the H8S/2368 Group Hardware Manual.

Is the DF2367VTE33V qualified for automotive applications?

No, the DF2367VTE33V is classified as a Standard-grade Renesas product intended for computers, office equipment, communications gear, test instruments, audio/video systems, home appliances, and industrial robots. It is not qualified to AEC-Q100 or automotive temperature ranges. For automotive use, Renesas offers separate H8S/2200 or RH850 families-DF2367VTE33V should not be deployed in safety-critical or transportation-related systems without explicit written approval from Renesas Electronics.

DF2367VTE33V Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
120-TQFP
Series:
H8® H8S/2300
Packaging:
Tray
Product Status:
Last Time Buy
Programmable:
Not Verified
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
33MHz
Connectivity:
I2C, IrDA, SCI, SmartCard
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
83
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
24K x 8
Voltage - Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 10x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

DF2367VTE33V FAQ

1.How can I place an order for DF2367VTE33V through Aetrix?

Please submit a Request for Quotation (RFQ) for DF2367VTE33V on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DF2367VTE33V reliable?

The price and inventory of DF2367VTE33V are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DF2367VTE33V is usually 5 days.

3.What payment methods are accepted for DF2367VTE33V?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DF2367VTE33V transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for DF2367VTE33V?

DF2367VTE33V orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DF2367VTE33V order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DF2367VTE33V?

For technical support, including DF2367VTE33V datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DF2367VTE33V requirements.

6.How does Aetrix verify that DF2367VTE33V is sourced from the original manufacturer or authorized distributors?

All DF2367VTE33V products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DF2367VTE33V meets industry standards.

7.What is the process for return or replacement of DF2367VTE33V?

All DF2367VTE33V units undergo pre-shipment inspection (PSI). If there is an issue with DF2367VTE33V, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DF2367VTE33V part is unused and in its original packaging.

Return procedure for DF2367VTE33V:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

DF2367VTE33V Tags

  • DF2367VTE33V
  • DF2367VTE33V PDF
  • DF2367VTE33V Datasheet
  • DF2367VTE33V Specifications
  • DF2367VTE33V Images
  • Renesas
  • Renesas DF2367VTE33V
  • Buy DF2367VTE33V
  • DF2367VTE33V Price
  • DF2367VTE33V Distributor
  • DF2367VTE33V Supplier
  • DF2367VTE33V Wholesale
Related Products
ATTINY4-TSHR
ATTINY4-TSHR

Microchip Technology

ATTINY10-TSHR
ATTINY10-TSHR

Microchip Technology

ATTINY10-TS8R
ATTINY10-TS8R

Microchip Technology

ATTINY202-SSNR
ATTINY202-SSNR

Microchip Technology

ATTINY202-SSFR
ATTINY202-SSFR

Microchip Technology

ATTINY402-SSNR
ATTINY402-SSNR

Microchip Technology

PIC16F15213T-I/MF
PIC16F15213T-I/MF

Microchip Technology

PIC16F15213-E/MF
PIC16F15213-E/MF

Microchip Technology

PIC10F200T-I/OT
PIC10F200T-I/OT

Microchip Technology

ATTINY412-SSNR
ATTINY412-SSNR

Microchip Technology

PIC10F202T-I/OT
PIC10F202T-I/OT

Microchip Technology

ATTINY404-SSNR
ATTINY404-SSNR

Microchip Technology

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER