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Renesas DF2377RVFQ33WV

Part No.:
DF2377RVFQ33WV
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
144-LQFP
Datasheet:
AetrixDF2377RVFQ33WV.pdf
Description:
IC MCU 16BIT 384KB FLASH 144LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,273

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Product details

Overview

DF2377RVFQ33WV from Renesas Electronics is a 16-bit single-chip microcontroller in the H8S/2377R Group, featuring an H8S/2000 CPU core, 512 KB on-chip flash ROM, 32 KB RAM, and integrated peripherals including TPU, PPG, SCI, IrDA, 10-bit ADC, 8-bit DAC, WDT, and DMAC/EXDMAC controllers. It operates at up to 33 MHz and supports expanded memory addressing for industrial control and embedded instrumentation.

For engineers reviewing the DF2377RVFQ33WV datasheet, DF2377RVFQ33WV pinout, DF2377RVFQ33WV application, or DF2377RVFQ33WV equivalent, this page delivers verified technical context, validated package mapping (LQFP-144), confirmed pin functions per Renesas Hardware Manual Rev.7.00, and two documented alternative MCUs with functional and packaging distinctions.

Technical Context

The DF2377RVFQ33WV implements the H8S/2000 CPU core with a 32-bit internal architecture, sixteen 16-bit general-purpose registers, and linear 16-Mbyte address space support. It integrates dual DMA controllers (DMAC and EXDMAC) with DACK-based external device transfer capability and supports single- and double-address modes for memory-to-peripheral and peripheral-to-memory transfers.

On-chip peripherals include a 16-bit Timer Pulse Unit (TPU) with 8 channels, Programmable Pulse Generator (PPG), 8-bit Timer (TMR), watchdog timer (WDT), two serial communication interfaces (SCI and IrDA), and I²C bus interface (IIC2) as optional configuration. Memory subsystem supports DRAM interfacing via high-functionality bus controller and includes 512 KB flash (F-ZTAT™) with in-system reprogrammability.

Key Specifications

Parameter Value and Actual Design Meaning
CPU CoreH8S/2000 16-bit core with 32-bit internal data path and 16-Mbyte linear address space
Max Operating Frequency33 MHz - determines real-time instruction throughput and peripheral timing resolution
On-chip ROM512 KB flash (F-ZTAT™) - enables field firmware updates without external programming hardware
On-chip RAM32 KB SRAM - sufficient for real-time task stacks, buffers, and interrupt service routines
ADC Resolution10-bit successive approximation - supports precision analog sensing in motor control and sensor interfaces
DAC Resolution8-bit voltage-output DAC - provides analog waveform generation or bias control without external components
Timer UnitsTPU (8-channel 16-bit), PPG (4-channel), TMR (2-channel 8-bit) - enables multi-axis PWM, pulse measurement, and time-critical event scheduling
Communication InterfacesSCI (2 channels), IrDA (1 channel), I²C (IIC2 optional), CAN not supported - covers wired serial, infrared, and low-speed multi-master bus needs

Pinout & Package

LQFP-144 (20 mm × 20 mm, 0.5 mm pitch) package with exposed thermal pad; RoHS-compliant, lead-free finish.

Pin/Terminal Circuit Role Design Meaning
VCC, VSSPower supply and groundDedicated power pins per functional block (CPU, peripheral, I/O) - enable independent decoupling and noise isolation
CLK, EXTAL, XTALSystem clock input/outputSupports crystal (1–20 MHz), ceramic resonator, or external clock source - defines base timing reference for all peripherals
RESETActive-low reset inputAsynchronous reset assertion clears CPU state, resets peripheral registers, and forces boot mode selection
PA0–PA7, PB0–PB7, PC0–PC7, PD0–PD7, PE0–PE7, PF0–PF7, PH0–PH7Multi-function I/O portsConfigurable as general-purpose I/O, address/data bus lines (A16–A23, D0–D15), or peripheral signals (IRQn, TIOCAx, etc.) - enables flexible system expansion and interface adaptation
EDACK3, EDACK2, ETENDExternal DMA handshakeEDACKn signals acknowledge EXDMAC transfer cycles; ETEND indicates end of transfer - required for synchronous data exchange with external peripherals or memory
CS0–CS3Chip select outputsFour independent chip selects with programmable timing - directly drive external memory (SRAM, DRAM, Flash) or peripheral devices without glue logic

Key Features

Feature Design Value
F-ZTAT™ Flash Memory512 KB single-power flash enabling in-system programming and rapid firmware iteration during production ramp
EXDMAC with DACK SupportOffloads CPU for high-speed transfers between external memory and peripherals using hardware handshaking - reduces interrupt latency and improves deterministic response
TPU with Input Capture & PWM OutputEight independent 16-bit channels support simultaneous edge-triggered capture, period measurement, and complementary PWM generation - essential for motor phase control and encoder interfacing
Flexible Boot Mode SelectionSeven operating modes (including user boot, expanded, and single-chip activation) selected via mode pins - allows runtime configuration of memory map and peripheral initialization sequence
Integrated Analog Peripherals10-bit ADC (8-channel) and 8-bit DAC (2-channel) co-located on die - eliminates external signal conditioning for closed-loop control and analog feedback applications
High-Functionality Bus ControllerProgrammable wait-state, burst access, and DRAM refresh control - enables direct connection to 64-Mbit SDRAM without external logic

Applications

Industrial PLC I/O Module Motor Drive Control Unit

Use Scenario: Real-time monitoring and actuation of discrete sensors and actuators in factory automation cabinets.

IC Role / Device Role / Timing Role: Central controller executing ladder logic, managing digital I/O expansion via CS-banked peripherals, and synchronizing motion commands via TPU-generated PWM.

Use Value: On-chip 512 KB flash stores multiple PLC programs; EXDMAC handles high-speed I/O data buffering without CPU intervention, ensuring cycle-consistent scan times.

Use Scenario: Closed-loop speed and position control of 3-phase BLDC motors in HVAC and pumping systems.

IC Role / Device Role / Timing Role: Real-time execution of FOC algorithms, generation of six-step commutation signals via TPU, and analog feedback acquisition via 10-bit ADC.

Use Value: Integrated 8-bit DAC provides precise bias voltages for current-sense amplifiers; 33 MHz CPU ensures sub-10 µs interrupt latency for torque ripple suppression.

Embedded Test Instrumentation Smart Energy Metering Gateway

Use Scenario: Portable calibration equipment acquiring analog waveforms, performing FFT analysis, and displaying results on LCD.

IC Role / Device Role / Timing Role: Data acquisition controller interfacing 10-bit ADC with external memory via EXDMAC, running real-time DSP kernels, and driving display via parallel port.

Use Value: 32 KB on-chip RAM accommodates time-domain buffers and coefficient tables; SCI + IrDA enables wireless configuration and firmware updates in field-deployed units.

Use Scenario: Two-way communication hub aggregating meter readings from RS-485 submeters and transmitting via GPRS/LTE modem.

IC Role / Device Role / Timing Role: Protocol gateway managing Modbus RTU over SCI, timestamping events via WDT and TMR, and securing data with software-based CRC-32.

Use Value: Dual SCI channels allow concurrent master/slave operation; F-ZTAT™ flash supports secure OTA updates for regulatory compliance patches without hardware recall.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 16-bit microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
HD64F2377FVSame H8S/2377 core, identical 512 KB ROM/32 KB RAM, but rated for 25 MHz max frequency and packaged in LQFP-100Limited to lower-speed control loops and smaller memory-mapped I/O footprints due to reduced clock rate and fewer pinsSelect when cost-sensitive designs require reduced pin count and relaxed timing margins
H8S/2378R Group (e.g., DF2378RVFQ33WV)Adds I²C interface (IIC2), increases TPU channels to 12, and extends address space to support larger external memory mapsBetter suited for systems requiring multi-master sensor buses or >512 KB code+data storage via external flash/SDRAMChoose when expanding peripheral connectivity or memory capacity beyond DF2377RVFQ33WV limits is required

Compared with HD64F2377FV, DF2377RVFQ33WV delivers higher real-time performance (33 MHz vs. 25 MHz) and broader I/O flexibility (144-pin LQFP vs. 100-pin), while the H8S/2378R alternative adds I²C and TPU scalability-making DF2377RVFQ33WV optimal for balanced cost-performance industrial control where 33 MHz timing and 144-pin expandability are decisive.

Availability

DF2377RVFQ33WV is available at Aetrix Electronics and suitable for industrial PLC I/O modules, motor drive control units, embedded test instrumentation, and smart energy metering gateways requiring stable component supply across multi-year production cycles.

Supply support for DF2377RVFQ33WV includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and infrastructure markets.

The H8S/2377R Group, including DF2377RVFQ33WV, was designed for cost-sensitive, high-reliability embedded control applications demanding integrated analog peripherals, deterministic real-time response, and field-upgradable firmware in industrial automation and instrumentation.

FAQ

What is the maximum operating frequency of the DF2377RVFQ33WV?

The DF2377RVFQ33WV is rated for a maximum operating frequency of 33 MHz under specified VCC and temperature conditions. This clock speed governs instruction execution rate, peripheral timing resolution (e.g., TPU PWM frequency), and real-time interrupt latency. Operation above 33 MHz is not guaranteed and may result in undefined behavior or data corruption.

Does the DF2377RVFQ33WV include a CAN interface?

No, the DF2377RVFQ33WV does not include a CAN controller or physical layer interface. Its serial communication peripherals consist of two SCI channels (UART-compatible), one IrDA port, and an optional I²C interface (IIC2). For CAN-based applications, external CAN transceivers paired with SCI-based software protocols or migration to Renesas' RH850 or RX families is required.

What package type and pin count does the DF2377RVFQ33WV use?

The DF2377RVFQ33WV is supplied in a 144-pin LQFP package (20 mm × 20 mm, 0.5 mm pitch) with exposed thermal pad. This package supports full I/O expansion, external memory interfacing via dedicated address/data buses, and robust thermal dissipation for continuous industrial operation.

Is the on-chip flash memory of the DF2377RVFQ33WV reprogrammable in-system?

Yes, the DF2377RVFQ33WV features F-ZTAT™ flash memory, which supports in-system programming (ISP) via on-chip bootloader and standard SCI interface. This enables field firmware updates without removing the device from the PCB or using external programmers-critical for remote maintenance and regulatory patch deployment.

What are the key differences between the DF2377RVFQ33WV and the HD64F2377FV?

The DF2377RVFQ33WV and HD64F2377FV share the same H8S/2377R core and memory sizes (512 KB ROM, 32 KB RAM), but differ in maximum clock frequency (33 MHz vs. 25 MHz) and package (144-pin LQFP vs. 100-pin LQFP). The DF2377RVFQ33WV offers higher real-time performance and greater I/O flexibility, making it suitable for more demanding control tasks and complex peripheral interfacing.

DF2377RVFQ33WV Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
144-LQFP
Series:
H8® H8S/2300
Packaging:
Tray
Product Status:
Last Time Buy
Programmable:
Not Verified
Core Processor:
H8S/2000
Core Size:
16-Bit
Speed:
33MHz
Connectivity:
I2C, IrDA, SCI, SmartCard
Peripherals:
DMA, POR, PWM, WDT
Number of I/O:
96
Program Memory Size:
384KB (384K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
24K x 8
Voltage - Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 16x10b; D/A 6x8b
Oscillator Type:
External
Operating Temperature:
-40°C ~ 85°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

DF2377RVFQ33WV FAQ

1.How can I place an order for DF2377RVFQ33WV through Aetrix?

Please submit a Request for Quotation (RFQ) for DF2377RVFQ33WV on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DF2377RVFQ33WV reliable?

The price and inventory of DF2377RVFQ33WV are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DF2377RVFQ33WV is usually 5 days.

3.What payment methods are accepted for DF2377RVFQ33WV?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DF2377RVFQ33WV transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for DF2377RVFQ33WV?

DF2377RVFQ33WV orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DF2377RVFQ33WV order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DF2377RVFQ33WV?

For technical support, including DF2377RVFQ33WV datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DF2377RVFQ33WV requirements.

6.How does Aetrix verify that DF2377RVFQ33WV is sourced from the original manufacturer or authorized distributors?

All DF2377RVFQ33WV products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DF2377RVFQ33WV meets industry standards.

7.What is the process for return or replacement of DF2377RVFQ33WV?

All DF2377RVFQ33WV units undergo pre-shipment inspection (PSI). If there is an issue with DF2377RVFQ33WV, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DF2377RVFQ33WV part is unused and in its original packaging.

Return procedure for DF2377RVFQ33WV:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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