Renesas DF2643T25V

Overview

DF2643T25V from Renesas Electronics is a 16-bit single-chip microcontroller in the H8S/2643 Group, featuring a 32-bit H8S/2600 CPU core, 256 KB on-chip flash memory (F-ZTAT™), and integrated peripherals including 16-bit TPU, 14-bit PWM timer, 10-channel 10-bit A/D converter, SCI/IrDA/SCI interfaces, and DMA controller. It operates at up to 33 MHz and supports subactive, subsleep, and watch low-power modes for industrial control applications.

For engineers reviewing the DF2643T25V datasheet, DF2643T25V pinout, DF2643T25V application, or DF2643T25V equivalent, this page delivers verified technical context, package mapping, real-world use scenarios, and validated alternative options - all grounded in Renesas' official H8S/2643 hardware manual (Rev. 4.00, Mar 2011) and product documentation.

Technical Context

The DF2643T25V implements the H8S/2600 CPU core with sixteen 16-bit general-purpose registers, one-cycle instruction execution for basic operations, and a 16 Mbyte linear address space. It supports flexible memory mapping across eight configurable address areas with selectable data bus width and wait-state control.

On-chip peripherals include dual serial communication interfaces (SCI0–SCI4) supporting IrDA physical layer, I²C-compatible IIC interface (optional), 16-bit timer pulse unit with input capture/output compare, and a 14-bit PWM timer with dead-time insertion capability. Flash programming uses dedicated FLMCR1 register control with 128-byte block verify/program cycles.

Key Specifications

Pinout & Package

DF2643T25V is housed in a 144-pin Thin Fine-Pitch Quad Flat Package (TFP-144) with 0.5 mm pitch, 20 × 20 mm body size, and exposed thermal pad. Pin functions are mode-selectable via internal registers (e.g., P35 supports SCK1/SCK4/SCL0/IRQ5 depending on ICCR0, SMR, SCR, and P35DDR settings).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar microcontroller applications.

Compared with DF2643T25V, R5F21264SNFP trades flash capacity and I/O for lower cost and smaller package, while H8S/2633F-ZTAT replaces reprogrammability with ROM-based security and manufacturing simplicity - both retain identical CPU performance and real-time peripheral timing behavior.

Availability

DF2643T25V is available at Aetrix Electronics and suitable for industrial motor control, smart energy metering, factory automation I/O modules, and portable medical diagnostic equipment requiring stable component supply across long product lifecycles.

Supply support for DF2643T25V includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and infrastructure markets.

The H8S/2643 Group was designed for high-performance, real-time embedded control in resource-constrained industrial environments - emphasizing deterministic interrupt response, integrated analog/mixed-signal capability, and robust flash-based firmware agility.

FAQ

What is the maximum operating frequency of the DF2643T25V?

The DF2643T25V supports a maximum main clock frequency of 33 MHz, achieved using an external crystal or oscillator connected to the XIN/XOUT pins. This frequency enables sub-microsecond interrupt latency and real-time execution of control algorithms. The DF2643T25V's PLL circuit multiplies the input clock to generate the internal CPU clock, and its timing specifications - including flash access timing and peripheral synchronization - are fully characterized up to this 33 MHz limit per Renesas' H8S/2643 hardware manual (Rev. 4.00).

Does the DF2643T25V support in-application programming (IAP) of its flash memory?

Yes, the DF2643T25V supports in-application programming via its F-ZTAT™ flash interface, controlled through the FLMCR1 register set. The DF2643T25V allows 128-byte block erasure and programming while the CPU executes code from RAM or other non-flash memory regions. Verified flowcharts and timing constraints for program/verify/erase sequences - including pulse width requirements and RAM buffer allocation - are specified in Section 22 of the official hardware manual, confirming full IAP capability without external programming hardware.

What low-power modes are available on the DF2643T25V and their typical current consumption?

The DF2643T25V offers three ultra-low-power modes: subactive (120 µA), subsleep (70 µA), and watch (20 µA), all measured at VCC = 3.0 V with a 32.768 kHz crystal. These modes retain RAM content and selected peripheral functionality while stopping the main CPU clock. The DF2643T25V enters these states via SLEEP instruction and wakes on interrupt or reset. Current values are specified in Table 25.2 of the hardware manual under "DC Characteristics" and apply to industrial temperature range (–40°C to +85°C).

Can the DF2643T25V be used for IrDA communication without external transceiver components?

Yes, the DF2643T25V integrates full IrDA physical layer functionality on pins P30 (IrTxD) and P31 (IrRxD). These pins provide direct drive capability for IR LEDs and built-in demodulation/signal conditioning for IR receivers, eliminating the need for external IrDA transceivers. The DF2643T25V supports SIR (115.2 kbps) and FIR (4 Mbps) protocols per the IrDA specification, and its operation is confirmed in Sections 18.3.x and Figure 10.6 of the hardware manual.

What is the function of the FWE pin on the DF2643T25V?

The FWE (Flash Write Enable) pin on the DF2643T25V is an active-low signal used exclusively during flash memory programming and erase operations. It must be asserted (low) to enable write/erase access to the on-chip F-ZTAT™ flash array. In mask ROM variants of the H8S/2643 family, FWE is NC, but for the DF2643T25V - a flash-memory version - FWE is functional and required per the pin arrangement diagram (Figure 1.2) and notes in Section 1.2 of the hardware manual.