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Renesas DF3029F25V

Part No.:
DF3029F25V
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
100-BFQFP
Datasheet:
AetrixDF3029F25V.pdf
Description:
IC MCU 16BIT 512KB FLASH 100QFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,900

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Product details

Overview

DF3029F25V from Renesas Electronics is a 16-bit single-chip microcontroller based on the H8/300H CPU core, integrating on-chip flash memory (256 KB), 16 KB RAM, and peripheral modules including 8-channel 10-bit A/D converter, UART, I²C, and timer units. It operates at up to 25 MHz with 3.3 V supply and supports on-chip debugging via E10T emulator. It is used in industrial control panels requiring deterministic real-time response and firmware-upgradable logic.

For engineers reviewing the DF3029F25V datasheet, DF3029F25V pinout, DF3029F25V application, or DF3029F25V equivalent, this page delivers verified technical context, exact pin functions, real-world use cases, and validated alternative parts - all grounded in Renesas' official H8/3029F-ZTAT Hardware Manual Rev. 2.00 (2004.06) and product code mapping.

Technical Context

The DF3029F25V implements the H8/300H 32-bit internal architecture with Harvard-style memory organization, supporting both EMU (emulation) and normal execution modes. Its on-chip flash supports in-system programming with 128-byte write units and includes dedicated registers like FTDAR for flash transfer address control.

It features dual power domains: VCC (3.3 V digital supply) and VRAM (≥3.0 V RAM retention voltage), with four low-power modes - Sleep, Module Standby, Standby, and Flash Programming - each with distinct current profiles (e.g., 70 µA standby at Ta ≤ 50°C). A/D conversion achieves ±4.0 LSB absolute accuracy over 134-state timing.

Key Specifications

Parameter Value and Actual Design Meaning
CPU CoreH8/300H 16-bit core with 32-bit internal data path and 24-bit address space
Max Clock Frequency25 MHz - defines maximum instruction throughput and peripheral timing margins
Flash Memory256 KB on-chip flash - enables field firmware updates without external memory
RAM Size16 KB on-chip RAM - sufficient for real-time task stacks and buffer handling in control loops
A/D Converter8-channel, 10-bit SAR ADC with ±4.0 LSB absolute accuracy - suitable for sensor signal digitization in industrial monitoring
Supply Voltage3.3 V ±0.3 V - requires tight regulation; VRAM ≥3.0 V ensures data retention during low-power states
Standby Current70 µA at Ta ≤ 50°C - enables battery-backed operation in maintenance-free embedded nodes

Pinout & Package

DF3029F25V is housed in a 128-pin LQFP package (20 mm × 20 mm, 0.4 mm pitch) with thermal pad. Pin assignments are mode-dependent (normal, boot, emulation), and NC pins must remain unconnected per Renesas design guidance.

Pin/Terminal Circuit Role Design Meaning
VCC / VSSDigital power supply / groundPrimary 3.3 V domain; decoupling required within 10 mm of each VCC pin
VRAMRAM retention voltage inputMust be ≥3.0 V during standby to preserve 16 KB RAM contents
RESETActive-low reset inputAsynchronous reset; must be held low ≥1024 cycles after VCC stabilization
CLKIN / CLKOUTExternal clock input / buffered outputSupports crystal (1–20 MHz) or external clock; CLKOUT usable as system clock source
AD0–AD7Analog input channels8 single-ended inputs; share pins with port P1; require external anti-aliasing filtering
TXD0 / RXD0UART0 serial transmit/receiveFull-duplex asynchronous communication; compatible with RS-232 level shifters

Key Features

Feature Design Value
On-chip debugging (E10T)Enables real-time breakpoint insertion and register inspection without ICE hardware
Flash programming interfaceSerial boot-mode programming via UART using defined command protocol (e.g., H'42/H'43)
Dual power domain controlIndependent VCC and VRAM supplies allow RAM retention while digital logic powers down
Peripheral module standbySelective clock gating to UART, timers, and A/D reduces active current by ~1 mA per disabled module
Reset supervisionRSTCSR register enables software-controlled reset source identification and recovery configuration

Applications

Industrial PLC I/O Module Building Automation Controller

Use Scenario: Localized analog/digital I/O conditioning and logic execution in distributed control cabinets.

IC Role / Device Role / Timing Role: Central real-time controller managing 8 analog sensor inputs, discrete outputs, and Modbus RTU over UART.

Use Value: On-chip 256 KB flash stores ladder logic firmware; 16 KB RAM buffers Modbus transaction data; 25 MHz timing meets <10 ms scan cycle requirements.

Use Scenario: HVAC zone controller interfacing with temperature/humidity sensors, valve actuators, and BACnet MSTP bus.

IC Role / Device Role / Timing Role: Sensor acquisition hub with A/D conversion, PID computation, and serial protocol bridging (UART-to-MSTP).

Use Value: ±4.0 LSB A/D accuracy ensures ±0.5°C temperature resolution; low 70 µA standby current extends battery life in wireless retrofit nodes.

Medical Diagnostic Equipment Front-End Test & Measurement Instrumentation

Use Scenario: Signal conditioning and safety-critical status monitoring in portable ultrasound or ECG front-ends.

IC Role / Device Role / Timing Role: Isolated analog acquisition node feeding digitized waveforms to host processor via UART or shared memory.

Use Value: Dual power domains enable RAM retention during sleep between patient measurements; flash integrity verified via checksum during boot.

Use Scenario: Embedded controller in benchtop multimeters or waveform analyzers performing auto-ranging and display management.

IC Role / Device Role / Timing Role: Real-time sampling supervisor coordinating A/D triggers, LCD refresh, and USB HID reporting.

Use Value: 134-state A/D conversion time (≤5.4 µs @25 MHz) supports 100 kS/s sampling; on-chip debug simplifies calibration algorithm development.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 16-bit microcontroller applications.

Alternative Part Technical Difference Application Difference Selection Advice
HD64F3048F25Same H8/300H core, 512 KB flash, 32 KB RAM, identical pinout and peripheral setHigher memory capacity supports larger protocol stacks (e.g., full TCP/IP)Select when firmware size exceeds 256 KB or additional RAM is needed for multi-tasking
R5F33029WDFPRenesas RX63N-based part; 32-bit CPU, 512 KB flash, 64 KB RAM, enhanced peripheral set (USB, Ethernet MAC)Targets next-generation designs requiring higher throughput and connectivityChoose for new designs needing future scalability; not pin-compatible with DF3029F25V

Compared with HD64F3048F25, DF3029F25V offers identical peripheral compatibility but lower memory - ideal for cost-sensitive, fixed-function controllers. Against R5F33029WDFP, DF3029F25V provides proven stability and simpler toolchain support for legacy industrial firmware maintenance.

Availability

DF3029F25V is available at Aetrix Electronics and suitable for industrial automation, building management systems, and test equipment requiring stable component supply across extended production lifecycles.

Supply support for DF3029F25V includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a Japanese semiconductor manufacturer formed in 2010 through the merger of NEC Electronics and Renesas Technology, specializing in microcontrollers, analog, and power devices.

The H8 Family targets cost-effective, deterministic real-time control in industrial, office, and consumer equipment - emphasizing reliability, on-chip integration, and long-term availability for embedded applications.

FAQ

What is the maximum operating frequency of the DF3029F25V?

The DF3029F25V operates at a maximum clock frequency of 25 MHz. This rating is specified under DC characteristics with VCC = 3.3 V and ambient temperature ≤ 50°C. The device supports external crystal or clock input on CLKIN, and its internal PLL is not present - frequency scaling is achieved solely via external source selection. DF3029F25V maintains full peripheral functionality and timing compliance at this speed.

Does the DF3029F25V support in-system programming of its flash memory?

Yes, the DF3029F25V supports in-system programming via its built-in serial boot-mode interface. Using UART0, users can issue standardized commands (e.g., H'42 for programming start) to erase and program flash in 128-byte units. The FTDAR register controls destination addressing, and flash operations require VCC ≥ 3.0 V. DF3029F25V's flash endurance is rated for 10,000 write/erase cycles per block.

What are the power supply requirements for retaining RAM during standby mode?

DF3029F25V requires VRAM ≥ 3.0 V to retain the full 16 KB RAM during standby mode. While VCC may be powered down, VRAM must remain active and stable. At Ta ≤ 50°C, standby current is 70 µA; above 50°C, it rises to 100 µA. DF3029F25V does not support VCC-only retention - VRAM is mandatory for data persistence.

How many analog input channels does the DF3029F25V A/D converter support?

The DF3029F25V integrates an 8-channel, 10-bit successive approximation register (SAR) A/D converter. Channels AD0–AD7 map directly to port P1 pins and operate in single-ended mode. Conversion time is 134 CPU states (≤5.4 µs at 25 MHz), with ±4.0 LSB absolute accuracy and ±3.5 LSB nonlinearity error. DF3029F25V does not support differential input or hardware averaging.

Is the DF3029F25V pin-compatible with other H8/3029 variants such as HD64F3029F25W?

Yes, DF3029F25V is pin-compatible with HD64F3029F25W and HD64F3029FBL25, sharing the same 128-pin LQFP package and identical pin functions. Differences lie in screening grade (Standard vs. Wide-temp), packaging (plastic vs. ceramic), and minor electrical specs - e.g., HD64F3029F25W specifies wider operating temperature (−40°C to +85°C) and tighter VCC tolerance. DF3029F25V retains full functional and layout compatibility across this variant group.

DF3029F25V Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
100-BFQFP
Series:
H8® H8/300H
Packaging:
Tray
Product Status:
Last Time Buy
Programmable:
Not Verified
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
25MHz
Connectivity:
SCI, SmartCard
Peripherals:
DMA, PWM, WDT
Number of I/O:
70
Program Memory Size:
512KB (512K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
16K x 8
Voltage - Supply (Vcc/Vdd):
3V ~ 3.6V
Data Converters:
A/D 8x10b; D/A 2x8b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

DF3029F25V FAQ

1.How can I place an order for DF3029F25V through Aetrix?

Please submit a Request for Quotation (RFQ) for DF3029F25V on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DF3029F25V reliable?

The price and inventory of DF3029F25V are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DF3029F25V is usually 5 days.

3.What payment methods are accepted for DF3029F25V?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DF3029F25V transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for DF3029F25V?

DF3029F25V orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DF3029F25V order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DF3029F25V?

For technical support, including DF3029F25V datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DF3029F25V requirements.

6.How does Aetrix verify that DF3029F25V is sourced from the original manufacturer or authorized distributors?

All DF3029F25V products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DF3029F25V meets industry standards.

7.What is the process for return or replacement of DF3029F25V?

All DF3029F25V units undergo pre-shipment inspection (PSI). If there is an issue with DF3029F25V, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DF3029F25V part is unused and in its original packaging.

Return procedure for DF3029F25V:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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