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Renesas DF36012FXV

Part No.:
DF36012FXV
Manufacturer:
Renesas
Category:
Microcontrollers
Package:
48-LQFP
Datasheet:
AetrixDF36012FXV.pdf
Description:
IC MCU 16BIT 16KB FLASH 48LQFP
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:1,106

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Product details

Overview

DF36012FXV from Renesas Electronics is a 16-bit single-chip microcomputer in the H8/36012 Group, featuring the H8/300H CPU core, 128 KB on-chip ROM, 8 KB RAM, and integrated peripherals including SCI, I2C, timer modules, and 48 I/O pins. It operates at up to 20 MHz with 3.3 V or 5 V supply support and targets embedded control in industrial instrumentation and motor drive interfaces.

For engineers reviewing the DF36012FXV datasheet, DF36012FXV pinout, DF36012FXV application, or DF36012FXV equivalent, key selection considerations include its ROM size, clock source flexibility (crystal/ceramic/external), power-down mode support (Sleep/Standby/Subsleep), and compatibility with Renesas E7/E8 on-chip emulators for development.

Technical Context

The DF36012FXV implements the H8/300H CPU architecture with instruction set compatibility to the earlier H8/300, supporting 16-bit data paths and linear 24-bit addressing. Its system clock generator accepts crystal (1–20 MHz), ceramic resonator, or external clock inputs, and feeds prescaler S for peripheral timing derivation.

It integrates multiple low-power modes controlled via SYSCR1/SYSCR2 and module-level standby via MSTCR1/MSTCR2, enabling selective peripheral shutdown while retaining RAM content and wake-up capability via external interrupt or RTC alarm. The on-chip flash supports in-system programming via boot mode using SCI channel 1 (P21/P22).

Key Specifications

ParameterValue and Actual Design Meaning
CPU CoreH8/300H 16-bit RISC core with 24-bit address space and H8/300 instruction compatibility
ROM Size128 KB on-chip flash memory, supporting in-system programming and erase-verify cycles
RAM Size8 KB on-chip SRAM, retained in Sleep and Standby modes
Max Operating Frequency20 MHz system clock, configurable via internal prescalers for peripheral clocks
I/O Pins48 general-purpose CMOS I/O pins with programmable pull-up, interrupt capability, and port mode control
Supply Voltage3.3 V ±0.3 V or 5.0 V ±10 % operation, with separate VCC and VSS pins per port group
Power-Down ModesThree modes: Sleep (CPU stop, peripherals active), Standby (CPU + most peripherals stop), Subsleep (ultra-low leakage, RTC active)

Pinout & Package

DF36012FXV is housed in a 64-pin LQFP package (10 mm × 10 mm, 0.5 mm pitch) with exposed thermal pad. Pin functions are defined across eight 8-bit ports (P0–P7), plus dedicated reset, clock, interrupt, and debug pins.

Pin/TerminalCircuit RoleDesign Meaning
RESETActive-low reset inputAsynchronous hardware reset; must be held low ≥1024 cycles after power stabilization
CLKIN / CLKOUTCrystal/resonator interfaceSupports 1–20 MHz crystal or ceramic resonator; CLKOUT available as buffered output
P21 / P22SCI3 RXD / TXDDedicated pins for on-board programming in boot mode; used by E7/E8 emulator
NMINon-maskable interrupt inputReserved for E7/E8 emulator use; not available for user application when debugging
VCC, VSS (multiple)Power and groundSeparate supply pairs per port group reduce noise coupling and enable partial power gating

Key Features

FeatureDesign Value
On-chip flash programmingEnables field firmware updates via SCI channel 1 without external programmer; verified erase/program cycles specified
Multi-level power managementThree distinct low-power states with configurable wake-up sources (INT, RTC, LVI) and retention of RAM and register context
Hardware debug supportNative compatibility with Renesas E7 and E8 on-chip emulators, including address break and real-time trace capabilities
Peripheral integrationIncludes two 16-bit timer units (with capture/compare/PWM), I2C bus interface, and three serial communication interfaces (SCI)
No-connect (NC) pin handlingExplicit NC pin definition prevents unintended connection; internal test or noise-reduction function only - no user access permitted

Applications

Industrial Motor Control InterfaceProgrammable Logic Controller (PLC) I/O Module

Use Scenario: Real-time monitoring and PWM-driven actuator control in compact servo drives.

IC Role / Device Role / Timing Role: Main controller executing motion profiles, managing encoder feedback via timer capture, and driving gate drivers via GPIO/PWM outputs.

Use Value: 20 MHz execution speed ensures sub-100 µs loop response; 48 I/O pins support direct connection to optocoupled inputs and MOSFET drivers without glue logic.

Use Scenario: Modular digital input/output expansion unit with isolated field-side interfacing.

IC Role / Device Role / Timing Role: Local intelligence node handling scan-cycle timing, status polling, and diagnostics over RS-485 (SCI2).

Use Value: On-chip 128 KB flash stores dual firmware images; Sleep mode reduces idle power to <50 µA while maintaining watchdog and interrupt readiness.

Embedded Test Equipment Front-EndBuilding Automation Sensor Hub

Use Scenario: Portable multimeter or signal generator with LCD, keypad, and analog front-end control.

IC Role / Device Role / Timing Role: System orchestrator managing ADC sampling, display refresh, button debounce, and USB-to-SCI bridge communication.

Use Value: Integrated SCI and I2C eliminate external level shifters; 8 KB RAM accommodates real-time waveform buffers and calibration tables.

Use Scenario: Wireless-ready environmental sensor node aggregating temperature, humidity, and occupancy data.

IC Role / Device Role / Timing Role: Low-duty-cycle host processor waking periodically to sample sensors, process data, and transmit via UART to RF module.

Use Value: Subsleep mode draws ≤1.2 µA with RTC wake-up; internal LVI detects brown-out and triggers safe shutdown before data corruption.

Equivalent & Alternatives

The following parts are listed as comparable options for similar 16-bit microcontroller applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
HD64F36012GSame die, identical ROM/RAM/peripherals; differs only in marking and screening grade (G = commercial temp, -20°C to +75°C)Targeting non-automotive industrial environments where extended temperature range is not requiredSelect HD64F36012G if full industrial temperature range (-40°C to +85°C) is unnecessary and cost optimization is prioritized
H8/36014FHigher ROM (256 KB), same CPU/peripheral set, adds CAN controller and extra SCI channelSuitable for systems requiring fieldbus connectivity or larger firmware footprint without changing board layoutChoose H8/36014F when CAN protocol support or >128 KB code space is needed; pin-compatible but requires minor PCB routing for CAN signals

Compared with DF36012FXV, HD64F36012G offers identical functionality at lower qualification cost, while H8/36014F extends capability with CAN and doubled flash - both share the same 64-pin LQFP footprint and core architecture, enabling scalable design reuse.

Availability

DF36012FXV is available at Aetrix Electronics and suitable for industrial motor control interfaces, PLC I/O modules, and embedded test equipment requiring stable component supply, long-term lifecycle support, and traceable sourcing.

Supply support for DF36012FXV includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for industrial, automotive, and infrastructure markets.

The H8 Family - including the DF36012FXV - was designed for cost-sensitive, high-reliability embedded control applications demanding deterministic real-time performance, low-power operation, and robust on-chip debug capability.

FAQ

What is the maximum operating frequency of the DF36012FXV?

The DF36012FXV supports a maximum system clock frequency of 20 MHz. This is achieved using an external crystal, ceramic resonator, or clock source connected to the CLKIN pin, with internal prescaling applied as needed for peripheral modules. The CPU executes instructions at this rate, enabling sub-100 µs interrupt response times critical for real-time motor control loops. DF36012FXV maintains timing integrity across its full specified temperature range.

Does the DF36012FXV support in-system programming (ISP)?

Yes, the DF36012FXV supports in-system programming via its built-in SCI3 interface (P21/RXD, P22/TXD) in boot mode. This allows firmware updates without removing the device from the target board. The on-chip 128 KB flash memory includes dedicated control registers (FLMCR1/FLMCR2) and erase verification logic. DF36012FXV requires no external programming voltage - all operations use standard VCC.

Which debug tools are compatible with the DF36012FXV?

The DF36012FXV is natively supported by Renesas E7 and E8 on-chip emulators. These tools provide real-time debugging, address breakpoint control, and trace capabilities. Note that the NMI pin and memory region H'7000–H'7FFF are reserved for emulator use and unavailable to the user application during debugging. DF36012FXV's hardware debug architecture eliminates the need for JTAG adapters or external probes.

What power-saving modes does the DF36012FXV offer?

The DF36012FXV provides three hardware-supported low-power modes: Sleep (CPU halted, peripherals active), Standby (CPU and most peripherals halted, RAM retained), and Subsleep (ultra-low leakage, RTC and LVI active). Mode entry is controlled via SYSCR1/SYSCR2 registers, and wake-up can occur via external interrupt, RTC alarm, or low-voltage interrupt. DF36012FXV achieves ≤1.2 µA in Subsleep mode with RTC running.

Is the DF36012FXV pin-compatible with other H8/360xx devices?

The DF36012FXV shares the same 64-pin LQFP package and core pinout with members of the H8/36012 and H8/36014 Groups, including HD64F36012G and H8/36014F. However, functional differences exist: H8/36014F adds CAN and extra SCI signals, requiring minor PCB routing changes. DF36012FXV is not pin-compatible with the H8/36024 Group due to differing peripheral allocations and memory map layouts.

DF36012FXV Specifications

Product attributes
Attribute value
Manufacturer:
Renesas
Package/Case:
48-LQFP
Series:
H8® H8/300H Tiny
Packaging:
Tray
Product Status:
Last Time Buy
Programmable:
Not Verified
Core Processor:
H8/300H
Core Size:
16-Bit
Speed:
20MHz
Connectivity:
SCI
Peripherals:
PWM, WDT
Number of I/O:
30
Program Memory Size:
16KB (16K x 8)
Program Memory Type:
FLASH
EEPROM Size:
-
RAM Size:
2K x 8
Voltage - Supply (Vcc/Vdd):
3V ~ 5.5V
Data Converters:
A/D 4x10b
Oscillator Type:
Internal
Operating Temperature:
-20°C ~ 75°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:

DF36012FXV FAQ

1.How can I place an order for DF36012FXV through Aetrix?

Please submit a Request for Quotation (RFQ) for DF36012FXV on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for DF36012FXV reliable?

The price and inventory of DF36012FXV are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DF36012FXV is usually 5 days.

3.What payment methods are accepted for DF36012FXV?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DF36012FXV transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for DF36012FXV?

DF36012FXV orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your DF36012FXV order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for DF36012FXV?

For technical support, including DF36012FXV datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DF36012FXV requirements.

6.How does Aetrix verify that DF36012FXV is sourced from the original manufacturer or authorized distributors?

All DF36012FXV products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DF36012FXV meets industry standards.

7.What is the process for return or replacement of DF36012FXV?

All DF36012FXV units undergo pre-shipment inspection (PSI). If there is an issue with DF36012FXV, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The DF36012FXV part is unused and in its original packaging.

Return procedure for DF36012FXV:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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