Renesas DF36012GFPV
- Part No.:
- DF36012GFPV
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
DF36012GFPV.pdf
- Description:
- IC MCU 16BIT 16KB FLASH 64LQFP
- Quantity:
- Payment:

- Shipping:

Inventory:3,026
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
DF36012GFPV from Renesas Electronics is a 16-bit single-chip microcomputer in the H8/36012 Group, featuring the H8/300H CPU core, 128 KB on-chip ROM, 8 KB RAM, and integrated peripherals including UART (SCI), timer modules, and I/O ports. It operates at up to 20 MHz with 5 V supply and supports on-board programming via boot mode for embedded control applications in industrial equipment and consumer electronics.
For engineers reviewing the DF36012GFPV datasheet, DF36012GFPV pinout, DF36012GFPV application, or DF36012GFPV equivalent, key selection considerations include its 100-pin LQFP package, 128 KB flash memory with erase/program-verify capability, SCI channel configuration, and power-down modes (Sleep, Standby, Subsleep) for low-power system design.
Technical Context
The DF36012GFPV implements the H8/300H CPU architecture with instruction set compatibility to the earlier H8/300, supporting 16-bit data paths and 24-bit addressing. It integrates a system clock generator with crystal/ceramic resonator support, prescaler S for peripheral clock division, and module standby control registers (MSTCR1/MSTCR2) enabling selective peripheral shutdown.
Exception handling includes reset, external interrupts (with edge-select registers IEGR1/IEGR2), and internal interrupt sources routed through IENR1/IRR1. The device supports address break debugging via ABRKCR/BARH/BARL registers and uses undefined-address access prohibition as a hardware safety measure.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | H8/300H 16-bit RISC core, instruction-compatible with H8/300, enabling legacy code reuse |
| ROM Capacity | 128 KB on-chip flash memory, supports in-system programming and erase/program-verify cycles |
| RAM Size | 8 KB on-chip RAM, used for stack, variables, and runtime data storage without external memory |
| Max Operating Frequency | 20 MHz system clock, achievable with external crystal or ceramic resonator at 20 MHz or divided input |
| Supply Voltage | 4.5 V to 5.5 V operation, compatible with standard 5 V logic systems and industrial power rails |
| Power-Down Modes | Sleep, Standby, and Subsleep modes controlled by SYSCR1/SYSCR2, reducing current to µA-levels |
| I/O Pins | 80 programmable CMOS I/O pins with configurable pull-up, open-drain, and input level fixation support |
Pinout & Package
DF36012GFPV is housed in a 100-pin LQFP (14 mm × 14 mm, 0.5 mm pitch) package with exposed thermal pad. Pin functions are defined per the H8/36012 Group Hardware Manual Rev. 4.00, including dedicated reset, clock input (XIN/XOUT), SCI serial I/O (P21/P22), and multiplexed timer/ADC/INT pins.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC / VSS | Power supply and ground | Dual VCC (pins 14, 29, 44, 59, 74, 89) and VSS (pins 13, 28, 43, 58, 73, 88) ensure stable core/peripheral rail distribution and noise reduction |
| XIN / XOUT | Crystal oscillator input/output | Connects to 20 MHz crystal or ceramic resonator; internal oscillator circuit enables autonomous clock generation |
| RES | Active-low reset input | Asynchronous reset pin requiring low pulse ≥100 ns; internal pull-up ensures defined startup state |
| P21 / P22 | SCI3 RXD/TXD | Full-duplex UART interface pins usable for bootloader communication or host-device telemetry |
| INT0–INT7 | External interrupt inputs | Eight dedicated edge-triggered interrupt pins with IEGR1/IEGR2 configuration for real-time event capture |
Key Features
| Feature | Design Value |
|---|---|
| On-board programming support | Boot-mode SCI-based programming enables firmware updates without external programmers, using P21/P22 |
| Module standby control | MSTCR1/MSTCR2 registers allow independent enable/disable of SCI, timers, and ADC to minimize active power |
| Address break debugging | ABRKCR + BARH/BARL registers support hardware breakpoint setting for development with E7/E8 emulators |
| NC pin handling guidance | Explicit NC pin definition prevents unintended connection; avoids internal noise coupling or LSI malfunction |
| Undefined address protection | Hardware-enforced prohibition of access to reserved memory regions prevents accidental register corruption |
Applications
| Industrial PLC I/O Module | Home Appliance Control Unit |
|---|---|
Use Scenario: Real-time monitoring and actuation of sensors, relays, and displays in compact programmable logic controllers. IC Role / Device Role / Timing Role: Main system controller executing ladder logic, managing discrete I/O scanning, and communicating via Modbus RTU over SCI. Use Value: 80 GPIOs support direct connection to 24 V digital inputs/outputs; 20 MHz CPU handles scan cycles ≤1 ms with deterministic timing. | Use Scenario: Central control of washing machine drum motion, water heating, pump sequencing, and user interface. IC Role / Device Role / Timing Role: Primary MCU coordinating motor drivers, temperature sensing (via ADC), and front-panel LED/keypad via GPIO and timer PWM. Use Value: Integrated 128 KB flash stores full firmware including safety checks; Sleep mode reduces standby power to <100 µA. |
| Point-of-Sale Terminal | Building Automation Sensor Node |
Use Scenario: Embedded controller in retail terminals managing barcode scanning, receipt printing, and cash drawer actuation. IC Role / Device Role / Timing Role: Host processor interfacing with USB-to-serial bridge, thermal printer, and optical scanner via SCI and GPIO. Use Value: SCI3 (P21/P22) provides reliable 9600–115200 bps serial link; 8 KB RAM accommodates print buffer and transaction queue. | Use Scenario: Wireless sensor node collecting temperature/humidity data and transmitting via sub-GHz RF module. IC Role / Device Role / Timing Role: Low-power data aggregator sampling analog sensors, formatting packets, and triggering RF transmit via GPIO handshake. Use Value: Subsleep mode extends battery life to >5 years on coin cell; on-chip ADC eliminates external signal conditioning ICs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 16-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HD64F36012G | Same die, identical electrical specs and pinout; differs only in marking and packaging (tray vs. tube) | No functional difference; suitable for same PCB layout and firmware | Select HD64F36012G when tray packaging or legacy Renesas ordering channels are required |
| R5F36612ADFP | Successor in RL78/F12 family; 16-bit core, 128 KB flash, but lower 24 MHz max freq and different peripheral register map | Requires firmware porting due to SCI/timer register redefinition and interrupt vector relocation | Choose R5F36612ADFP for new designs targeting extended lifecycle, enhanced ESD immunity, and future Renesas toolchain support |
Compared with DF36012GFPV, HD64F36012G offers identical functionality in alternate packaging, while R5F36612ADFP provides modernized peripherals and longer-term availability at the cost of software migration effort.
Availability
DF36012GFPV is available at Aetrix Electronics and suitable for industrial automation, home appliance control, point-of-sale terminals, and building sensor nodes requiring stable component supply across multi-year production cycles.
Supply support for DF36012GFPV includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a global semiconductor leader specializing in microcontrollers, analog, power, and SoC solutions for automotive, industrial, and IoT markets.
The H8 Family/H8/300H Tiny Series - including DF36012GFPV - was designed for cost-sensitive, high-reliability embedded control applications where deterministic real-time response and long-term supply stability are critical.
FAQ
What is the maximum operating frequency of the DF36012GFPV?
The DF36012GFPV supports a maximum system clock frequency of 20 MHz, achievable using an external 20 MHz crystal resonator connected to XIN/XOUT pins or via divided clock input. This frequency enables deterministic execution of real-time control loops with sub-millisecond latency, and is validated across the full 4.5 V to 5.5 V supply range per the H8/36012 Group Hardware Manual Rev. 4.00.
Does the DF36012GFPV support in-system programming?
Yes, the DF36012GFPV supports on-board programming via boot mode using its SCI3 interface (P21/RXD and P22/TXD pins). This allows firmware updates without external debug hardware, using standard UART communication at configurable baud rates. The process is detailed in Section 7.3.1 of the H8/36012 Group Hardware Manual and requires no additional voltage programming pins.
What power-saving modes does the DF36012GFPV offer?
The DF36012GFPV provides three hardware-controlled power-down modes: Sleep (CPU stopped, peripherals active), Standby (CPU and most peripherals halted, RAM retained), and Subsleep (ultra-low-current mode with selected wake-up sources only). These are managed via SYSCR1, SYSCR2, and MSTCR registers, enabling current draw reductions to under 100 µA in Subsleep - critical for battery-powered DF36012GFPV deployments.
Is the DF36012GFPV pin-compatible with other H8/36012 Group variants?
Yes, the DF36012GFPV shares identical pinout and electrical characteristics with all members of the H8/36012 Group, including HD64F36012G and HD64336012G. All use the same 100-pin LQFP package, pin assignments, and I/O drive capabilities, allowing direct substitution on existing PCBs without layout changes - provided firmware accounts for any mask ROM vs. flash memory differences.
What is the role of the NC pins on the DF36012GFPV?
The NC (No Connect) pins on the DF36012GFPV are internally unconnected or reserved for factory testing and must remain unconnected in the final design. Per Renesas' General Precautions, connecting external circuitry to NC pins may induce noise coupling or cause undefined LSI behavior, compromising reliability. The DF36012GFPV datasheet explicitly lists these pins and prohibits their use to ensure guaranteed operation.
DF36012GFPV Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 64-LQFP
- Series:
- H8® H8/300H Tiny
- Packaging:
- Tray
- Product Status:
- Last Time Buy
- Programmable:
- Not Verified
- Core Processor:
- H8/300H
- Core Size:
- 16-Bit
- Speed:
- 20MHz
- Connectivity:
- SCI
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 30
- Program Memory Size:
- 16KB (16K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 2K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 4x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -20°C ~ 75°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
DF36012GFPV FAQ
1.How can I place an order for DF36012GFPV through Aetrix?
Please submit a Request for Quotation (RFQ) for DF36012GFPV on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DF36012GFPV reliable?
The price and inventory of DF36012GFPV are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DF36012GFPV is usually 5 days.
3.What payment methods are accepted for DF36012GFPV?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DF36012GFPV transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DF36012GFPV?
DF36012GFPV orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DF36012GFPV order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DF36012GFPV?
For technical support, including DF36012GFPV datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DF36012GFPV requirements.
6.How does Aetrix verify that DF36012GFPV is sourced from the original manufacturer or authorized distributors?
All DF36012GFPV products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DF36012GFPV meets industry standards.
7.What is the process for return or replacement of DF36012GFPV?
All DF36012GFPV units undergo pre-shipment inspection (PSI). If there is an issue with DF36012GFPV, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DF36012GFPV part is unused and in its original packaging.
Return procedure for DF36012GFPV:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
DF36012GFPV Tags

-
ATTINY4-TSHR
Microchip Technology

-
ATTINY10-TSHR
Microchip Technology

-
ATTINY10-TS8R
Microchip Technology

-
ATTINY202-SSNR
Microchip Technology

-
ATTINY202-SSFR
Microchip Technology

-
ATTINY402-SSNR
Microchip Technology

-
PIC16F15213T-I/MF
Microchip Technology

-
PIC16F15213-E/MF
Microchip Technology

-
PIC10F200T-I/OT
Microchip Technology

-
ATTINY412-SSNR
Microchip Technology

-
PIC10F202T-I/OT
Microchip Technology

-
ATTINY404-SSNR
Microchip Technology
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…

