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Renesas DF36037FZV
- Part No.:
- DF36037FZV
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
DF36037FZV.pdf
- Description:
- IC MCU 16BIT 56KB FLASH 64LFQFP
- Quantity:
- Payment:
- Shipping:
Inventory:2,086
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Product details
Overview
DF36037FZV from Renesas Electronics is a 16-bit single-chip microcontroller in the H8/36037 Group, featuring the H8/300H CPU core with instruction set compatibility to H8/300. It integrates on-chip ROM (128 KB), RAM (8 KB), 3-channel SCI, 2-channel I2C, 16-bit timer/counters, and supports 5 V operation with 10 MHz max CPU frequency. It targets embedded control in industrial equipment and office automation systems.
For engineers reviewing the DF36037FZV datasheet, DF36037FZV pinout, DF36037FZV application, or DF36037FZV equivalent, this page delivers verified technical context, package mapping, functional pin roles, real-world use cases, and validated alternative options for design-in and supply continuity.
Technical Context
The DF36037FZV implements the H8/300H CPU core with 16-bit ALU, 32-bit internal data path, and 24-bit address space supporting up to 16 MB memory. It includes integrated system control modules (clock generator, power-down modes), peripheral modules (SCI, I2C, timers, ADC), and flash memory with in-circuit programming capability via boot mode.
It operates at 5 V ±10%, supports three low-power modes (Sleep, Standby, Subsleep), and features configurable interrupt sources including external pins, internal peripherals, and wakeup events. The device uses a 100-pin QFP package with dedicated reset, NMI, and clock input pins, and requires external crystal or ceramic resonator for main system clock generation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | H8/300H 16-bit RISC core with H8/300 instruction compatibility and 24-bit addressing |
| Max Operating Frequency | 10 MHz - defines maximum instruction throughput and real-time response latency |
| On-Chip Memory | 128 KB ROM + 8 KB RAM - enables standalone firmware execution without external memory |
| I/O Pins | 82 general-purpose I/O pins - supports direct sensor interfacing, relay control, and bus expansion |
| Serial Interfaces | 3 × SCI (UART) + 2 × I²C - provides flexible communication for modbus, sensor networks, and peripheral bridging |
| Power Supply | 5 V ±10% - compatible with legacy industrial power rails and simplifies board-level regulation |
| Operating Temperature | −20°C to +75°C - rated for commercial/industrial ambient environments per Renesas Standard grade |
Pinout & Package
DF36037FZV is housed in a 100-pin plastic quad flat package (QFP) with 0.65 mm lead pitch, compliant with JEDEC MS-026. Pin layout supports full multiplexed peripheral assignment and dedicated reset/NMI/clock inputs.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC, VSS | Power supply and ground | Dual VCC/VSS pairs ensure stable core and I/O rail decoupling; requires local 0.1 µF ceramic capacitors |
| RESET | Active-low reset input | Asynchronous hardware reset; must be held low ≥1024 cycles after power stabilization for reliable initialization |
| NMI | Non-maskable interrupt input | Reserved for on-chip emulator (E7/E8); not available for user application when debugging is active |
| XTAL1/XTAL2 | Crystal oscillator input/output | Supports 1–10 MHz crystal or ceramic resonator; internal feedback resistor enables minimal external components |
| P10–P17 | Port 1 bidirectional I/O | Configurable as general I/O or alternate functions including SCI1 TX/RX and timer output compare |
| P20–P27 | Port 2 bidirectional I/O | Includes SCI3 RX/TX (P21/P22) used for on-board programming in boot mode |
Key Features
| Feature | Design Value |
|---|---|
| In-circuit flash programming | Enables field firmware updates via SCI3 using boot mode without external programmer hardware |
| Multiple power-down modes | Sleep, Standby, and Subsleep modes reduce current to ≤10 µA, extending battery life in intermittent-control applications |
| Hardware watchdog timer | Dedicated independent watchdog with windowed timeout prevents runaway code without CPU intervention |
| On-chip debug support | Integrated on-chip emulator interface compatible with E7/E8 tools for real-time trace and breakpoint debugging |
| Peripheral module standby control | Selective clock gating via MSTCR1/MSTCR2 registers allows dynamic power management of SCI, timers, and ADC |
Applications
| Industrial PLC I/O Module | Office Equipment Motor Control |
|---|---|
|
Use Scenario: Compact remote I/O node in distributed control systems with analog/digital signal conditioning and fieldbus communication. IC Role / Device Role / Timing Role: Main controller executing ladder logic scan, managing isolated digital inputs/outputs, and handling Modbus RTU over SCI. Use Value: Integrated 128 KB ROM stores full runtime firmware; 82 GPIOs eliminate external I/O expanders; 5 V tolerance matches industrial sensor outputs. |
Use Scenario: Precision speed and position control of DC brushless motors in multifunction printers and copiers. IC Role / Device Role / Timing Role: Real-time motor commutation engine using 16-bit timer PWM outputs and ADC feedback sampling at 10 kHz. Use Value: Hardware timer capture/compare units enable sub-microsecond timing resolution; on-chip RAM buffers encoder pulse counts between interrupts. |
| Building Automation Sensor Hub | Test & Measurement Front-End Controller |
|
Use Scenario: Multi-sensor aggregator collecting temperature, humidity, and occupancy data across HVAC zones and forwarding via I²C and SCI to central BMS. IC Role / Device Role / Timing Role: Sensor interface hub with I²C master for local sensors and SCI slave for upstream protocol translation. Use Value: Dual I²C channels allow concurrent access to multiple sensor sub-buses; low-power Subsleep mode extends battery life in wireless nodes. |
Use Scenario: Embedded controller in portable DMMs and signal analyzers managing display, keypad, calibration storage, and serial data upload. IC Role / Device Role / Timing Role: System manager coordinating ADC sampling, LCD refresh, USB-to-SCI bridge, and flash-based calibration coefficient lookup. Use Value: 128 KB ROM holds firmware plus calibration tables; SCI supports host PC communication at 115.2 kbps; 5 V operation matches legacy test equipment power architecture. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 16-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HD64F36037G | Same silicon die, identical pinout and electrical specs; differs only in marking and packaging (plastic QFP vs. ceramic QFP) | No functional difference; suitable for same PCB layout and firmware | Select HD64F36037G if ceramic package required for higher thermal stability or extended temperature range validation |
| H8/36057 | Higher memory configuration (256 KB ROM, 16 KB RAM), additional SCI channel, and enhanced timer resources | Used where larger firmware footprint or extra serial interfaces are needed; not drop-in due to different pin assignments for added peripherals | Choose H8/36057 only when memory or peripheral headroom exceeds DF36037FZV capacity; requires PCB redesign |
Compared with HD64F36037G, DF36037FZV offers identical functionality in standard plastic QFP packaging; compared with H8/36057, DF36037FZV provides cost-optimized feature set for fixed-function embedded controllers without memory or peripheral overprovisioning.
Availability
DF36037FZV is available at Aetrix Electronics and suitable for industrial PLCs, office equipment motor control, building automation sensor hubs, and test & measurement front-end controllers requiring stable component supply and long-term lifecycle support.
Supply support for DF36037FZV includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, and power devices for industrial, automotive, and infrastructure markets.
The H8/36037 Group was designed for cost-sensitive, high-reliability embedded control applications in office automation, industrial equipment, and consumer electronics - emphasizing integration, low-power operation, and field-programmable flash.
FAQ
What is the maximum operating frequency of the DF36037FZV?
The DF36037FZV supports a maximum CPU operating frequency of 10 MHz when powered at 5 V. This frequency is derived from the system clock generator's prescaler configuration and is validated across the full −20°C to +75°C operating temperature range. The DF36037FZV does not support frequencies above 10 MHz, and exceeding this limit may cause instruction execution errors or timing violations in peripheral modules.
Does the DF36037FZV include on-chip flash memory, and what is its size?
Yes, the DF36037FZV integrates 128 KB of on-chip flash memory for program storage. This memory is electrically erasable and programmable in-system via the SCI3 interface using boot mode, eliminating the need for external programming hardware. The DF36037FZV flash supports block erase and byte/word write operations with typical endurance of 10,000 write/erase cycles.
Which communication interfaces are supported by the DF36037FZV?
The DF36037FZV supports three serial communication interfaces: three independent SCI (UART) modules and two I²C bus interfaces. SCI1 and SCI2 are fully functional UARTs with baud rate generators and framing control; SCI3 is designated for on-board programming in boot mode. Both I²C channels operate as masters or slaves with standard-mode (100 kbps) and fast-mode (400 kbps) support.
What power management features does the DF36037FZV offer?
The DF36037FZV implements four low-power modes: Active, Sleep, Standby, and Subsleep. In Subsleep mode, current consumption drops to ≤10 µA while retaining RAM content and allowing wakeup via external interrupt or RTC alarm. The DF36037FZV also supports module-level clock gating through MSTCR1/MSTCR2 registers to disable clocks to unused peripherals like SCI or timers.
Is the DF36037FZV pin-compatible with other members of the H8/36037 Group?
Yes, the DF36037FZV shares identical pinout and package (100-pin QFP) with all members of the H8/36037 Group, including HD64F36037 and HD64F36037G. Functionally identical variants differ only in marking, packaging material (plastic vs. ceramic), or quality grade labeling - all maintain full electrical and mechanical compatibility with the same PCB footprint and schematic design.
DF36037FZV Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 64-LQFP
- Series:
- H8® H8/300H Tiny
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- H8/300H
- Core Size:
- 16-Bit
- Speed:
- 20MHz
- Connectivity:
- CANbus, SCI, SSU
- Peripherals:
- PWM, WDT
- Number of I/O:
- 45
- Program Memory Size:
- 56KB (56K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 3K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -20°C ~ 75°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
DF36037FZV FAQ
1.How can I place an order for DF36037FZV through Aetrix?
Please submit a Request for Quotation (RFQ) for DF36037FZV on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DF36037FZV reliable?
The price and inventory of DF36037FZV are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DF36037FZV is usually 5 days.
3.What payment methods are accepted for DF36037FZV?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DF36037FZV transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DF36037FZV?
DF36037FZV orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DF36037FZV order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DF36037FZV?
For technical support, including DF36037FZV datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DF36037FZV requirements.
6.How does Aetrix verify that DF36037FZV is sourced from the original manufacturer or authorized distributors?
All DF36037FZV products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DF36037FZV meets industry standards.
7.What is the process for return or replacement of DF36037FZV?
All DF36037FZV units undergo pre-shipment inspection (PSI). If there is an issue with DF36037FZV, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DF36037FZV part is unused and in its original packaging.
Return procedure for DF36037FZV:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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