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Renesas DF36037GFZV
- Part No.:
- DF36037GFZV
- Manufacturer:
- Renesas
- Category:
- Microcontrollers
- Package:
- 64-LQFP
- Datasheet:
-
DF36037GFZV.pdf
- Description:
- IC MCU 16BIT 56KB FLASH 64LFQFP
- Quantity:
- Payment:
- Shipping:
Inventory:4,616
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Product details
Overview
DF36037GFZV from Renesas Electronics is a 16-bit single-chip microcontroller in the H8/36037 Group, featuring the H8/300H CPU core, 128 KB on-chip ROM, 8 KB RAM, and integrated peripherals including SCI, I2C, timer modules, and 80-pin PQFP package. It operates at up to 20 MHz, supports single-supply 5 V operation, and targets embedded control applications requiring deterministic real-time response and low-power sleep modes.
For engineers reviewing the DF36037GFZV datasheet, DF36037GFZV pinout, DF36037GFZV application, or DF36037GFZV equivalent, key selection considerations include its 80-pin PQFP footprint, 128 KB mask-ROM program memory, hardware SCI/I2C interfaces, and support for subsleep/subactive power-down states - all critical for industrial control, appliance MCU, and legacy H8-based system maintenance.
Technical Context
The DF36037GFZV implements the H8/300H CPU architecture with full instruction set compatibility to the H8/300, enabling migration from earlier designs. It integrates a system clock generator supporting crystal, ceramic resonator, or external clock input, plus prescaler S for flexible peripheral clock derivation.
Its memory map includes dedicated areas for on-chip ROM (0x000000–0x01FFFF), RAM (0xFFE000–0xFFFFFF), and peripheral registers (0xF00000–0xF00FFF). Power management is handled via SYSCR1/SYSCR2 and MSTCR1/MSTCR2 registers, enabling four distinct low-power modes: Sleep, Standby, Subsleep, and Subactive.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| CPU Core | H8/300H 16-bit RISC core, instruction-compatible with H8/300 for legacy code reuse. |
| ROM Size | 128 KB mask-programmed ROM - fixed firmware storage, no field reprogramming. |
| RAM Size | 8 KB on-chip SRAM - sufficient for stack, variables, and small buffers in real-time tasks. |
| Max Clock Frequency | 20 MHz - enables deterministic 50 ns instruction cycle time for timing-critical control loops. |
| Supply Voltage | 4.5 V to 5.5 V - compatible with standard 5 V industrial logic and legacy system rails. |
| Package | 80-pin plastic quad flat pack (PQFP) - surface-mount, 0.65 mm pitch, RoHS-compliant. |
| I/O Pins | 64 programmable CMOS I/O pins - configurable as general-purpose or peripheral function pins (SCI, I²C, timers). |
Pinout & Package
DF36037GFZV is housed in an 80-pin PQFP (Plastic Quad Flat Package) with 0.65 mm lead pitch, thermal pad omitted, and JEDEC MS-026 compliant footprint. Pin functions are defined per the Hardware Manual Rev.4.00 (2006), Section 1.3–1.4.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCC, VSS | Power supply and ground | Dedicated pairs for analog/digital separation; decoupling required per pin group to ensure noise immunity. |
| RESET | Active-low reset input | Asynchronous reset signal; internal pull-up; must be held low ≥1024 cycles after power stabilization. |
| CLK, EXTAL | System clock inputs | Supports crystal (1–20 MHz), ceramic resonator, or external clock source; CLK is output from oscillator circuit. |
| P00–P07 | Port 0 bidirectional I/O | 8-bit port with individual direction control; default as general-purpose I/O; multiplexed with SCI1/TXD1/RXD1. |
| P20–P27 | Port 2 bidirectional I/O | Includes SCI3 (P21/RXD3, P22/TXD3) used for on-board programming in boot mode. |
Key Features
| Feature | Design Value |
|---|---|
| On-chip ROM + RAM | 128 KB mask-ROM and 8 KB SRAM eliminate need for external memory in cost-sensitive control systems. |
| Hardware SCI/I²C | Dual serial interfaces (SCI1, SCI3, and I²C bus controller) enable reliable communication with sensors, displays, and EEPROMs without software bit-banging. |
| Four Power Modes | Sleep, Standby, Subsleep, and Subactive modes reduce current to ≤10 µA (Subsleep), extending battery life in intermittent-operation devices. |
| Timer Resources | 16-bit timer (TPM), 8-bit timer (TMR), and watchdog timer (WDT) provide precise event timing, PWM generation, and system safety monitoring. |
| Interrupt Architecture | 16-level priority interrupt controller with edge-selectable external IRQs and vectorized handling for sub-2 µs latency in critical responses. |
Applications
| Industrial Motor Control | Home Appliance MCU |
|---|---|
|
Use Scenario: Closed-loop speed and position control of BLDC motors in HVAC blowers and washing machine drum drives. IC Role / Device Role / Timing Role: Main system controller executing PID algorithms, managing gate driver PWM outputs, and monitoring hall-effect feedback. Use Value: Deterministic 20 MHz execution and hardware timers enable 10 µs PWM resolution and jitter-free commutation timing. |
Use Scenario: Embedded control unit in microwave ovens managing keypad scan, display backlight, magnetron sequencing, and safety interlocks. IC Role / Device Role / Timing Role: Primary MCU coordinating user interface, cooking timer, thermal cutoff monitoring, and relay actuation. Use Value: Integrated 128 KB ROM stores full application firmware; 5 V tolerance simplifies interface with legacy triac drivers and optocouplers. |
| Legacy Industrial PLC I/O Module | Point-of-Sale Terminal Controller |
|
Use Scenario: Digital I/O expansion module in DIN-rail mounted PLCs, interfacing with 24 V DC sensors and actuators. IC Role / Device Role / Timing Role: Local intelligence node handling debounce, status reporting, and command execution over RS-485 (via SCI1). Use Value: Hardware SCI with framing error detection ensures robust serial communication in electrically noisy factory environments. |
Use Scenario: Core controller in compact retail terminals managing barcode scanner interface, thermal printer control, and cash drawer actuation. IC Role / Device Role / Timing Role: Real-time coordinator between USB host (via bridge), serial peripherals, and local display/backlight. Use Value: 64 GPIOs support direct connection to matrix keypad and LED indicators; subsleep mode reduces standby power during idle periods. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar 16-bit microcontroller applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| HD64F36037G | Same die, identical pinout and ROM content, but uses Flash memory instead of mask-ROM - supports field firmware updates. | Preferred where firmware revisionability is required; not suitable for high-volume cost-sensitive production with fixed code. | Select HD64F36037G only if in-system reprogramming capability is mandatory and BOM cost premium is acceptable. |
| H8/36057 | Pin-compatible upgrade with 256 KB ROM, enhanced peripheral set (additional SCI channel, larger RAM), and same 80-pin PQFP package. | Used in next-generation versions of systems originally designed for DF36037GFZV, where increased code space and I/O flexibility are needed. | Choose H8/36057 when expanding functionality beyond 128 KB ROM or requiring additional serial channels without PCB redesign. |
Compared with HD64F36037G and H8/36057, DF36037GFZV offers lowest unit cost and highest reliability for fixed-function applications, trading flash programmability and expanded memory for production stability and reduced qualification overhead.
Availability
DF36037GFZV is available at Aetrix Electronics and suitable for industrial motor control, home appliance MCU, and legacy PLC I/O module applications requiring stable component supply and long-term obsolescence management.
Supply support for DF36037GFZV includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Renesas Electronics Corporation is a Japanese semiconductor manufacturer specializing in microcontrollers, analog, and power devices for industrial, automotive, and consumer markets.
The H8/36037 Group was designed for cost-effective, high-reliability embedded control in appliances and industrial equipment - emphasizing deterministic real-time performance, 5 V robustness, and long-lifecycle support.
FAQ
What is the maximum operating frequency of the DF36037GFZV?
The DF36037GFZV supports a maximum system clock frequency of 20 MHz, achieved using an external crystal, ceramic resonator, or clock source connected to the EXTAL/CLK pins. At this frequency, the CPU executes instructions with a 50 ns cycle time, enabling precise timing for motor control loops and real-time communication protocols. The DF36037GFZV's clock generator includes internal prescaling to derive lower-frequency clocks for peripherals without compromising CPU performance.
Does the DF36037GFZV support in-system programming (ISP)?
No, the DF36037GFZV does not support in-system programming. It contains 128 KB of mask-programmed ROM, meaning firmware is permanently embedded during wafer fabrication and cannot be modified post-production. For field-upgradable alternatives, consider the pin-compatible HD64F36037G, which replaces mask-ROM with Flash memory while retaining identical peripheral configuration and timing behavior.
What power-saving modes are available on the DF36037GFZV?
The DF36037GFZV implements four hardware-controlled low-power modes: Sleep, Standby, Subsleep, and Subactive. Subsleep mode draws ≤10 µA while retaining RAM content and allowing wake-up via external interrupt or timer event - ideal for battery-backed sensor nodes. Mode selection is controlled via SYSCR1 and SYSCR2 registers, with transitions managed by dedicated STOP and SLEEP instructions executed in software.
Is the DF36037GFZV pin-compatible with other H8/36037 Group members?
Yes, the DF36037GFZV shares the same 80-pin PQFP package and pin assignment with all members of the H8/36037 Group, including HD64F36037, HD64F36037G, and HD64336037G. This allows direct substitution within the same family for functional upgrades (e.g., Flash vs. mask-ROM) or qualification variants without PCB layout changes - provided voltage, timing, and peripheral usage align with the target variant's specifications.
What development tools are supported for the DF36037GFZV?
The DF36037GFZV is supported by Renesas' legacy H8 toolchain, including the E7 and E8 on-chip emulators for debugging, the H8S/H8/300 Series C/C++ Compiler (REJ10B0058), and the High-Performance Embedded Workshop 3 IDE. Note that when using the E7/E8 emulator, pins P85–P87 and the NMI pin are reserved, and memory regions H'D000–H'DFFF and H'F780–H'FB7F are unavailable for user code - these constraints must be accounted for in debug builds.
DF36037GFZV Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Renesas
- Package/Case:
- 64-LQFP
- Series:
- H8® H8/300H Tiny
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Core Processor:
- H8/300H
- Core Size:
- 16-Bit
- Speed:
- 20MHz
- Connectivity:
- CANbus, SCI, SSU
- Peripherals:
- LVD, POR, PWM, WDT
- Number of I/O:
- 45
- Program Memory Size:
- 56KB (56K x 8)
- Program Memory Type:
- FLASH
- EEPROM Size:
- -
- RAM Size:
- 3K x 8
- Voltage - Supply (Vcc/Vdd):
- 3V ~ 5.5V
- Data Converters:
- A/D 8x10b
- Oscillator Type:
- Internal
- Operating Temperature:
- -20°C ~ 75°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
DF36037GFZV FAQ
1.How can I place an order for DF36037GFZV through Aetrix?
Please submit a Request for Quotation (RFQ) for DF36037GFZV on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for DF36037GFZV reliable?
The price and inventory of DF36037GFZV are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for DF36037GFZV is usually 5 days.
3.What payment methods are accepted for DF36037GFZV?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for DF36037GFZV transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for DF36037GFZV?
DF36037GFZV orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your DF36037GFZV order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for DF36037GFZV?
For technical support, including DF36037GFZV datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your DF36037GFZV requirements.
6.How does Aetrix verify that DF36037GFZV is sourced from the original manufacturer or authorized distributors?
All DF36037GFZV products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that DF36037GFZV meets industry standards.
7.What is the process for return or replacement of DF36037GFZV?
All DF36037GFZV units undergo pre-shipment inspection (PSI). If there is an issue with DF36037GFZV, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The DF36037GFZV part is unused and in its original packaging.
Return procedure for DF36037GFZV:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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